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    • 1. 发明申请
    • ISOLATION OF SONOS DEVICES
    • SONOS设备的隔离
    • WO2003003451A1
    • 2003-01-09
    • PCT/US2001/049047
    • 2001-12-14
    • ADVANCED MICRO DEVICES, INC.FUJITSU LIMITED
    • YANG, Jean, Yee-MeiRAMSBEY, Mark, T.LINGUNIS, Emmanuil, ManosWU, YiderKAMAL, TazrienHE, YiHSIA, EdwardSHIRAIWA, Hidehiko
    • H01L21/8246
    • H01L21/2652H01L21/2658H01L27/11568H01L29/66833
    • One aspect of the present invention relates to a method of forming a SONOS type non-volatile semiconductor memory device, involving forming a first layer of a charge trapping dielectric on a semiconductor substrate; forming a second layer of the charge trapping dielectric over the first layer of the charge trapping dielectric on the semiconductor substrate; optionally at least partially forming a third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric, if present; forming a source/drain mask over the charge trapping dielectric; implanting a source/drain implant through the charge trapping dielectric into the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric, if present; and one of forming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, reforming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, or forming additional material over the third layer of the charge trapping dielectric.
    • 本发明的一个方面涉及一种形成SONOS型非易失性半导体存储器件的方法,包括在半导体衬底上形成电荷俘获电介质的第一层; 在所述半导体衬底上的所述电荷俘获电介质的所述第一层上形成所述电荷俘获电介质的第二层; 可选地至少部分地在所述半导体衬底上的所述电荷俘获电介质的所述第二层上形成所述电荷俘获电介质的第三层; 任选地去除电荷捕获电介质的第三层(如果存在) 在电荷俘获电介质上形成源极/漏极掩模; 将源极/漏极注入物通过电荷俘获电介质注入到半导体衬底中; 任选地去除电荷捕获电介质的第三层(如果存在) 以及在半导体衬底上的电荷俘获电介质的第二层上形成电荷俘获电介质的第三层之一,在半导体衬底上的电荷俘获电介质的第二层上重整第三层电荷俘获电介质,或 在电荷俘获电介质的第三层上形成附加材料。
    • 4. 发明申请
    • IMPROVED SYSTEM FOR PROGRAMMING A NON-VOLATILE MEMORY CELL
    • 用于编程非易失性存储单元的改进系统
    • WO2004051667A1
    • 2004-06-17
    • PCT/US2003/023085
    • 2003-07-24
    • ADVANCED MICRO DEVICES, INC.
    • HE, YiLIU, ZhizhengRANDOLPH, Mark, W.HADDAD, Sameer, S.
    • G11C16/10
    • G11C16/10G11C16/0475G11C16/0491
    • An array (40) of dual bit dielectric memory cells (48) comprises a plurality of bit lines. A first bit line (201) forms a source region for each of a plurality of memory cells (38) within a column of memory cells within the array (40). A second bit line (202) forms a drain region for each of the plurality of memory cells (38) within the column. A channel region (50) of the opposite conductivity is positioned between the first bit line (201) and the second bit line (202) and forms a junction with each. A selected word line (211) is positioned over the channel region (50) and forms a gate (60) over each for a plurality of memory cells (48) within a same row. A plurality of non-selected word lines (210, 212), are each parallel to the selected word line (211) and each form a gate (60) over one of the plurality of memory cells (48) within the column other than the selected one of the plurality of memory cells (49). A word line control circuit (46) applies a positive programming voltage (220) to the selected word line (211) while a bit line control circuit (44) simultaneously applies a positive drain voltage to the drain bit line (202) and a positive source voltage to the source bit line (201), the positive source voltage being less than the positive drain voltage.
    • 双位介质存储器单元(48)的阵列(40)包括多个位线。 第一位线(201)为阵列(40)内的存储单元列内的多个存储器单元(38)中的每一个形成源区域。 第二位线(202)为列内的多个存储单元(38)中的每一个形成漏极区。 具有相反电导率的沟道区域(50)位于第一位线(201)和第二位线(202)之间,并且与第一位线形成结。 所选择的字线(211)位于信道区域(50)上方,并在同一行内的多个存储单元(48)上形成一个门(60)。 多个未选择的字线(210,212)各自平行于所选择的字线(211),并且每个在所述列内的多个存储器单元(48)中的一个上形成门(60),而不是 所选择的多个存储单元(49)中的一个。 字线控制电路(46)将正编程电压(220)施加到所选择的字线(211),同时位线控制电路(44)同时向漏位线(202)施加正漏电压, 源极电压(201),正电源电压小于正漏极电压。
    • 5. 发明申请
    • IMPROVED PRE-CHARGE METHOD FOR READING A NON-VOLATILE MEMORY CELL
    • 用于读取非易失性存储器单元的改进的预充电方法
    • WO2004051663A1
    • 2004-06-17
    • PCT/US2003/023087
    • 2003-07-24
    • ADVANCED MICRO DEVICES, INC.
    • HE, YiLIU, ZhizhengRANDOLPH, Mark, W.RUNNION, Edward, F.HAMILTON, DarleneCHEN, Patu-LingLE, Binh, Q.
    • G11C7/12
    • G11C7/12G11C16/0475G11C16/24
    • A method of detecting a charge stored on a charge storage region (62) of a first dual bit dielectric memory cell (49) within an array (40) of dual bit dielectric memory cells (48) comprises coupling a first bit line (201) that forms a source junction with a channel region (50) of the first memory cell (49) to ground (68). A high voltage is applied to a gate (60) of the first memory cell (49) and to a second bit line (202) that is the next bit line to the right of the first bit line (201) and separated from the first bit line (201) only by the channel region (50). A third bit line (203), that is the next bit line to the right of the second bit line (202), is isolated such that its potential is effected only by its junctions with the a second channel region (50) and a third channel region (50) on opposing sides of the third bit line (203). A high voltage is applied to a pre-charge bit line that is to the right of the third bit line (203) and current flow is detected at the second bit line (202) to determine the programmed status of a source bit (62) of the first memory cell (49).
    • 检测存储在双位介质存储单元(48)的阵列(40)内的第一双位介质存储单元(49)的电荷存储区域(62)上的电荷的方法包括将第一位线(201) 其形成与第一存储单元(49)的沟道区(50)到地(68)的源极结。 向第一存储单元(49)的栅极(60)和第二位线(202)施加高电压,第二位线(202)是第一位线(201)右侧的下一个位线,并且与第一位线 位线(201)仅通过通道区域(50)。 作为第二位线(202)右侧的下一个位线的第三位线(203)是隔离的,使得其电位仅通过其与第二通道区域(50)的连接和第三位线 在第三位线(203)的相对侧上的通道区域(50)。 高电压被施加到位于第三位线(203)右侧的预充电位线,并且在第二位线(202)处检测电流以确定源位(62)的编程状态, 的第一存储单元(49)。
    • 10. 发明申请
    • RETROGRADE CHANNEL DOPING TO IMPROVE SHORT CHANNEL EFFECT
    • 改进通道,改善短路通道效果
    • WO2004049453A1
    • 2004-06-10
    • PCT/US2003/021682
    • 2003-07-10
    • ADVANCED MICRO DEVICES, INC.
    • ZHENG, WeiLIU, ZhizhengRANDOLPH, Mark, W.HE, Yi
    • H01L29/788
    • H01L29/66825H01L29/105H01L29/7881H01L29/792
    • A memory semiconductor cell (30) comprises a gate region (16), a source region (14) and a drain region (14). A channel region (17) is formed between the source region (14) and the drain region (14). The channel region (17) comprises a first channel portion (33) with a first concentration of doping material, the first channel portion (33) disposed adjacent to an edge of the channel region (17) closest to and substantially parallel to the gate region (16). The channel region (17) further comprises a second channel portion (31) with a second concentration of doping material, the second channel portion (31) disposed substantially parallel to the first channel portion (33) and a third channel portion (32), disposed between the first channel portion (33) and the second channel portion (31), with a third concentration of doping material. The third concentration is lower than the first concentration and lower than the second concentration. The memory cell may be one of two general types of non-volatile memory, a floating gate cell or a nitride read only memory (NROM), whereby layer (12B) in a floating gate or a nitride layer respectively.
    • 存储器半导体单元(30)包括栅极区(16),源极区(14)和漏极区(14)。 在源极区域(14)和漏极区域(14)之间形成沟道区域(17)。 沟道区域(17)包括具有第一浓度掺杂材料的第一沟道部分(33),第一沟道部分(33)邻近沟道区域(17)的与栅极区域最接近且基本平行的边缘 (16)。 通道区域(17)还包括具有第二浓度掺杂材料的第二通道部分(31),第二通道部分(31)基本上平行于第一通道部分(33)和第三通道部分(32)设置, 设置在第一通道部分(33)和第二通道部分(31)之间,具有第三浓度的掺杂材料。 第三浓度低于第一浓度,低于第二浓度。 存储单元可以是两种一般类型的非易失性存储器,浮动栅极单元或氮化物只读存储器(NROM)中的一种,其中分别在浮动栅极或氮化物层中的层(12B)。