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1. 发明申请

WO2003003471A1 半導体装置审中-公开
标题翻译：半导体器件
公开(公告)号：WO2003003471A1
公开(公告)日：2003-01-09
申请号：PCT/JP2002/006032
申请日：2002-06-17
申请人：株式会社日立製作所 , 門島勝 , 生田目俊秀 , 鈴木孝明 , 村田康彦 , 内藤孝 , 平谷正彦
发明人：門島勝 , 生田目俊秀 , 鈴木孝明 , 村田康彦 , 内藤孝 , 平谷正彦
IPC分类号： H01L29/78
CPC分类号： H01L29/517
摘要： A MIS transistor device using a silicon single crystal substrate as a base and a semiconductor device having an amorphous gate insulating film of high relative dielectric constant are disclosed. A semiconductor device having a dense gate insulating film of high relative dielectric constant, especially a MIS transistor device, is fabricated by forming an amorphous composite oxide film composed of three metallic elements as a gate insulating film on a silicon single crystal substrate.
摘要翻译：公开了使用硅单晶衬底作为基底的MIS晶体管器件和具有高相对介电常数的非晶栅极绝缘膜的半导体器件。通过在硅单晶衬底上形成由三个金属元素构成的非晶复合氧化物膜作为栅极绝缘膜，制造具有高相对介电常数的致密栅极绝缘膜的半导体器件，特别是MIS晶体管器件。

2. 发明申请

WO2003007369A1 半導体接続基板审中-公开
标题翻译：半导体连接基板
公开(公告)号：WO2003007369A1
公开(公告)日：2003-01-23
申请号：PCT/JP2002/007091
申请日：2002-07-12
申请人：株式会社日立製作所 , 佐藤俊也 , 荻野雅彦 , 三輪崇夫 , 内藤孝 , 滑川孝
发明人：佐藤俊也 , 荻野雅彦 , 三輪崇夫 , 内藤孝 , 滑川孝
IPC分类号： H01L23/12
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H01L2924/19011 , H01L2924/3011 , H05K1/162 , H05K3/4602 , H05K2201/09509 , H05K2201/09763 , H01L2924/00
摘要： A small, high−performance, low−cost semiconductor connection substrate such that the large size of the module because of discrete passive elements mounted on the substrate and the rise in mounting cost are improved, the substrate has a high reliability, the production yield is favorable, and various electronic components such as capacitors, inductors, and resistors are integrated at high density. A semiconductor connection substrate for connecting a semiconductor device to a mounting substrate such as a printed substrate is characterized by comprising an insulating substrate, one or more elements selected from capacitor elements provided on the insulating substrate and composed of electrodes having different areas and a dielectric material interposed between the electrodes, inductor elements, and resistor elements, a metallic wiring for connecting the elements, a metallic terminal part that is a part of the metallic wiring, and an organic insulating material covering the surroundings of the metallic wiring part except for the elements and metallic terminal part
摘要翻译：一种小型，高性能，低成本的半导体连接基板，由于安装在基板上的分立的无源元件以及安装成本的上升，模块的大尺寸被提高，基板的可靠性高，生产成品率有利的是，并且以高密度集成诸如电容器，电感器和电阻器的各种电子部件。用于将半导体器件连接到诸如印刷基板的安装基板的半导体连接基板的特征在于包括绝缘基板，选自设置在绝缘基板上的电容器元件中的一个或多个元件，并且由具有不同区域的电极和电介质材料插入在电极，电感器元件和电阻元件之间，用于连接元件的金属布线，作为金属布线的一部分的金属端子部分和覆盖除了元件之外的金属布线部分周围的有机绝缘材料和金属端子部分

3. 发明申请

WO2003007379A1 電子回路部品审中-公开
标题翻译：电子电路组件
公开(公告)号：WO2003007379A1
公开(公告)日：2003-01-23
申请号：PCT/JP2002/007092
申请日：2002-07-12
申请人：株式会社日立製作所 , 佐藤俊也 , 荻野雅彦 , 三輪崇夫 , 内藤孝 , 滑川孝 , 生田目俊秀 , 元脇成久
发明人：佐藤俊也 , 荻野雅彦 , 三輪崇夫 , 内藤孝 , 滑川孝 , 生田目俊秀 , 元脇成久
IPC分类号： H01L27/01
CPC分类号： H01L27/13 , H01F17/0006 , H01L23/49822 , H01L23/49827 , H01L27/016 , H01L27/0676 , H01L27/08 , H01L2224/16 , H01L2924/01021 , H01L2924/01025 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/19011 , H01L2924/3011 , H01L2924/3025 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/28 , H05K3/3457 , H05K3/4602 , H05K3/4644 , H05K2201/09536 , H05K2201/09827 , H01L2924/00
摘要： A low−cost, small, high−performance electronic circuit component which restricts an increase in the size of a module and a rise in mounting costs due to the substrate mounting of a single passive element, is high in reliability, is excellent in production yield, and integrates at high density a variety of electronic parts such as a capacitor, inductor and resistor. An electronic circuit component characterized by comprising an insulating substrate, a capacitor element consisting of a plurality of electrodes provided on the insulating substrate and having areas different from one another and dielectric materials interposed between them, one or a plurality of elements selected from an inductor element and a resistor element, a metal wiring connecting the elements, a metal terminal unit forming a part of the metal wiring, and an organic insulating material surrounding metal wiring portions excluding the elements and the metal terminal unit.
摘要翻译：由于单个无源元件的基板安装而限制模块尺寸的增加和安装成本上升的低成本，小型，高性能的电子电路元件的可靠性高，生产成本优异并且以高密度集成各种电子部件，例如电容器，电感器和电阻器。一种电子电路部件，其特征在于包括绝缘基板，电容器元件，其由设置在所述绝缘基板上的多个电极组成，并且具有彼此不同的区域和介于其间的电介质材料，选自电感器元件中的一个或多个元件电阻元件，连接这些元件的金属布线，形成金属布线的一部分的金属端子单元和围绕金属布线部分的元件和金属端子单元的有机绝缘材料。

4. 发明申请

WO2003007370A1 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法审中-公开
标题翻译：接线玻璃基板及其制造用于接线玻璃基板的导线玻璃基板，导电性粘土和半导体模块的制造方法以及形成布线基板和导体的方法
公开(公告)号：WO2003007370A1
公开(公告)日：2003-01-23
申请号：PCT/JP2002/007096
申请日：2002-07-12
申请人：株式会社日立製作所 , 塩野修 , 石川敬郎 , 滑川孝 , 鈴木康隆 , 内藤孝 , 山本浩貴 , 嘉本大五郎 , 高橋研 , 瀬川正則 , 佐藤俊也 , 三輪崇夫 , 元脇成久
发明人：塩野修 , 石川敬郎 , 滑川孝 , 鈴木康隆 , 内藤孝 , 山本浩貴 , 嘉本大五郎 , 高橋研 , 瀬川正則 , 佐藤俊也 , 三輪崇夫 , 元脇成久
IPC分类号： H01L23/12
CPC分类号： H05K3/4061 , H01L21/486 , H01L23/49816 , H01L23/49827 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H05K1/0306 , H05K1/113 , H05K3/426 , H05K2201/0116 , H05K2201/0367 , H05K2201/09563 , H05K2201/09581 , H05K2201/09827 , H05K2201/09981 , H01L2924/00014 , H01L2924/00
摘要： A wiring glass substrate, comprising a glass substrate (41) formed of a glass pane having a plurality of holes (18) provided therein at specified positions, bumps (51) connected to conductive substance (30) buried in the holes (18), and wirings (61) installed on a surface opposite to a surface having the bumps (51) formed thereon and electrically connecting a plurality of connection terminals disposed at intervals different from those of the holes (18) to the conductive substance (30), wherein, since the shape of the conductive substance (30) is formed in a porous shape, porous electrodes are bound to each other by the internal wall surfaces of the holes (18) and an anchor effect, whereby the strength of the glass substrate (41) can be increased.
摘要翻译： 1.一种布线用玻璃基板，其特征在于，具有由玻璃板形成的玻璃基板（41），所述玻璃基板（41）由规定位置设置有多个孔（18）而形成，与埋入所述孔（18）的导电性物质（30）连接的突起（51）以及安装在与形成有凸块（51）的表面相反的表面上并将与孔（18）的间隔不同的多个连接端子电连接到导电物质（30）的布线（61），其中由于导电性物质（30）的形状形成为多孔形状，因此通过孔（18）的内壁面和锚固效应将多孔电极彼此结合，由此玻璃基板（41）的强度）可以增加。

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