专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO1985000147A1 APPARATUS FOR CONTROLLING FORKLIFT 审中-公开
标题翻译：控制叉车的装置
公开(公告)号：WO1985000147A1
公开(公告)日：1985-01-17
申请号：PCT/JP1984000328
申请日：1984-06-25
申请人： HITACHI, LTD. , KIKUCHI, Seiki , YAMAGUCHI, Kuniaki
发明人： HITACHI, LTD.
IPC分类号： B60L03/00
CPC分类号： H02P7/29
摘要： A travel DC motor (12) and a loading DC motor (18) are connected to a common battery power source (10). The motor (12) is supplied with current through a transistor chopper (28) whose on/off operation is controlled, and the motor (18) is supplied with current through a thyristor chopper (32). The transistor chopper (28) and the thyristor chopper (32) are repeatedly turned on and off in response to pulse signals P1, P2, P3 generated by chopper control circuits (30), (47). When the thyristor chopper (32) is on, the chopper control circuit (30) keeps the transistor chopper (28) off in response to an inhibition signal Va.
摘要翻译：行驶直流电动机（12）和负载直流电动机（18）连接到公共电池电源（10）。电动机（12）通过晶体管斩波器（28）被供电，其晶体管截止器（28）的开/关操作被控制，电动机（18）通过晶闸管斩波器（32）供电。根据由斩波控制电路（30），（47）产生的脉冲信号P1，P2，P3，晶体管截止器（28）和晶闸管斩波器（32）反复导通和截止。当晶闸管斩波器（32）接通时，斩波控制电路（30）响应于抑制信号Va使晶体管斩波器（28）保持断开。

2. 发明申请

WO2007032519A1 POLISHING METHOD AND POLISHING APPARATUS, AND PROGRAM FOR CONTROLLING POLISHING APPARATUS 审中-公开
标题翻译：抛光方法和抛光装置，以及用于控制抛光装置的程序
公开(公告)号：WO2007032519A1
公开(公告)日：2007-03-22
申请号：PCT/JP2006/318461
申请日：2006-09-12
申请人： EBARA CORPORATION , TORIKOSHI, Tsuneo , YAMAGUCHI, Kuniaki
发明人： TORIKOSHI, Tsuneo , YAMAGUCHI, Kuniaki
IPC分类号： B24B37/00 , B24B53/00 , H01L21/304
CPC分类号： B24B37/042 , B24B37/345 , B24B49/00
摘要： A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface; and starting polishing of a workpiece after completion of the preparatory process to polishing. Determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.
摘要翻译：抛光方法可以在恢复抛光之前将抛光表面带到抛光的最佳状态，而不使用虚拟晶片等，从而消除虚拟晶片等的成本。抛光方法包括：在抛光休息期间进行待机操作; 在完成待机操作之后，通过修整抛光表面同时向抛光表面提供抛光液体进行抛光的准备过程; 并且在完成准备处理之后开始对工件进行抛光。关于在完成备用操作之后是否进行抛光的准备过程的确定可以基于待机操作的总操作时间或备用操作的总有效数量进行。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式