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1. 发明申请

WO2012004964A1 MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE 审中-公开
标题翻译：用于固态图像拾取装置的组件和用于制造固态图像拾取装置的方法
公开(公告)号：WO2012004964A1
公开(公告)日：2012-01-12
申请号：PCT/JP2011/003795
申请日：2011-07-04
申请人： CANON KABUSHIKI KAISHA , ENDO, Nobuyuki , ITANO, Tetsuya , YAMAZAKI, Kazuo , WATANABE, Kyouhei , IWATA, Junji
发明人： ENDO, Nobuyuki , ITANO, Tetsuya , YAMAZAKI, Kazuo , WATANABE, Kyouhei , IWATA, Junji
IPC分类号： H01L27/146 , H04N5/369
CPC分类号： H01L27/1469 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14687 , H01L27/14689 , H01L31/04 , H01L2224/05655
摘要： A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.
摘要翻译：提供具有无间隙的接合面的固态摄像装置的构件及其制造方法。该制造方法包括以下步骤：在其主面上设置设置有光电转换器的第一基板和第一布线结构，在其主面上设置设置有外围电路的一部分的第二基板和第二布线结构，使得第一基板，第一布线结构，第二布线结构和第二基板按顺序布置。此外，第一布线结构的上表面和第二布线结构的上表面中的至少一个具有凹部，并且导电材料形成凹部的底面。

2. 发明申请

WO2011077709A1 SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP SYSTEM 审中-公开
标题翻译：固态图像拾取器件和图像拾取系统
公开(公告)号：WO2011077709A1
公开(公告)日：2011-06-30
申请号：PCT/JP2010/007414
申请日：2010-12-22
申请人： CANON KABUSHIKI KAISHA , ENDO, Nobuyuki , ITANO, Tetsuya , YAMAZAKI, Kazuo , WATANABE, Kyouhei , ICHIKAWA, Takeshi
发明人： ENDO, Nobuyuki , ITANO, Tetsuya , YAMAZAKI, Kazuo , WATANABE, Kyouhei , ICHIKAWA, Takeshi
IPC分类号： H01L27/146
CPC分类号： H01L27/14636 , H01L27/14632 , H01L27/14643 , H01L27/1465
摘要： The present invention relates to a solid-state image pickup device. The device includes a first substrate including a photoelectric conversion element and a transfer gate electrode configured to transfer charge from the photoelectric conversion element, a second substrate having a peripheral circuit portion including a circuit configured to read a signal based charge generated in the photoelectric conversion element, the first and second substrates being laminated. The device further includes a multilayer interconnect structure, disposed on the first substrate, including an aluminum interconnect and a multilayer interconnect structure, disposed on the second substrate, including a copper interconnect.
摘要翻译：本发明涉及一种固态摄像装置。该装置包括：第一基板，包括光电转换元件和被配置为从光电转换元件传送电荷的转移栅电极;第二基板，具有外围电路部分，其包括被配置为读取在光电转换元件中产生的基于信号的电荷，第一和第二基板被层压。该设备还包括多层互连结构，其设置在第一基板上，包括设置在第二基板上的铝互连和多层互连结构，包括铜互连。

3. 发明申请

WO2011074235A1 SOLID-STATE IMAGE PICKUP DEVICE 审中-公开
标题翻译：固态图像拾取器件
公开(公告)号：WO2011074235A1
公开(公告)日：2011-06-23
申请号：PCT/JP2010/007227
申请日：2010-12-13
申请人： CANON KABUSHIKI KAISHA , YAMAZAKI, Kazuo , ITANO, Tetsuya , ENDO, Nobuyuki , WATANABE, Kyouhei
发明人： YAMAZAKI, Kazuo , ITANO, Tetsuya , ENDO, Nobuyuki , WATANABE, Kyouhei
IPC分类号： H01L27/146
CPC分类号： H01L27/14609 , H01L27/1465
摘要： A solid-state image pickup device includes a pixel region including photoelectric conversion units, FDs, and transfer transistors, reset transistors, amplifier transistors, and a reference voltage supply line used to supply reference voltages to the photoelectric conversion units. In the device, the pixel region and the reference voltage supply line are disposed on a first semiconductor substrate, and at least the reset transistors or the amplifier transistors are disposed on a second semiconductor substrate. Furthermore, power supply lines used to supply voltages to the reference voltage supply line are disposed on the second semiconductor substrate. The device further includes second electric connection units which electrically connect the reference voltage supply line to the power supply line. The first electric connection units are disposed in the pixel region whereas the second electric connection units are disposed outside the pixel region.
摘要翻译：固态图像拾取装置包括包括光电转换单元，FD和传输晶体管的像素区域，复位晶体管，放大器晶体管和用于向光电转换单元提供参考电压的参考电压供应线。在该器件中，像素区域和参考电压供给线设置在第一半导体衬底上，并且至少复位晶体管或放大器晶体管设置在第二半导体衬底上。此外，用于向参考电压供给线供电的电源线设置在第二半导体衬底上。该装置还包括将参考电压供应线电连接到电源线的第二电连接单元。第一电连接单元设置在像素区域中，而第二电连接单元设置在像素区域的外部。

4. 发明申请

WO2012042782A1 SOLID-STATE IMAGING DEVICE 审中-公开
标题翻译：固态成像装置
公开(公告)号：WO2012042782A1
公开(公告)日：2012-04-05
申请号：PCT/JP2011/005269
申请日：2011-09-20
申请人： CANON KABUSHIKI KAISHA , YAMAZAKI, Kazuo , ITANO, Tetsuya , ENDO, Nobuyuki , WATANABE, Kyouhei
发明人： YAMAZAKI, Kazuo , ITANO, Tetsuya , ENDO, Nobuyuki , WATANABE, Kyouhei
IPC分类号： H01L27/146 , H01L27/14 , H04N5/3745
CPC分类号： H01L27/14623 , H01L27/14607 , H01L27/1463 , H01L27/14634 , H01L27/1464 , H01L27/14641 , H01L27/14643 , H01L27/148 , H04N5/3559 , H04N5/372 , H04N5/37452 , H04N5/37455 , H04N5/378
摘要： In a solid-state imaging device, a photoelectric conversion unit, a transfer transistor, and at least a part of electric charge holding unit, among pixel constituent elements, are disposed on a first semiconductor substrate. A pixel additional circuit configured to process signal electric charges transferred to the electric charge holding unit or the signal amplified by an amplifying unit is disposed on a second semiconductor substrate. And wherein a first light shielding member is disposed on the first substrate, the first light shielding member being configured to reduce light transmitted through the photoelectric conversion unit to enter the pixel additional circuit.
摘要翻译：在固态成像装置中，在像素构成要素中设置有光电转换单元，转印晶体管和电荷保持单元的至少一部分，在第一半导体基板上。被配置为处理传送到电荷保持单元的信号电荷或由放大单元放大的信号的像素附加电路设置在第二半导体衬底上。并且其中第一光屏蔽构件设置在第一基板上，第一遮光构件被构造成减少透过光电转换单元的光进入像素附加电路。

5. 发明申请

WO2011067914A1 SOLID-STATE IMAGE PICKUP DEVICE 审中-公开
标题翻译：固态图像拾取器件
公开(公告)号：WO2011067914A1
公开(公告)日：2011-06-09
申请号：PCT/JP2010/006944
申请日：2010-11-29
申请人： CANON KABUSHIKI KAISHA , ITANO, Tetsuya , YAMAZAKI, Kazuo , ENDO, Nobuyuki , WATANABE, Kyouhei
发明人： ITANO, Tetsuya , YAMAZAKI, Kazuo , ENDO, Nobuyuki , WATANABE, Kyouhei
IPC分类号： H01L27/146 , H04N5/361 , H04N5/374 , H04N5/369
CPC分类号： H04N5/361 , H01L27/14609 , H01L27/14612 , H01L27/14634 , H01L27/1464 , H04N5/3698 , H04N5/3742
摘要： Dark current from a transfer transistor is suppressed and power-supply voltage in a second semiconductor substrate is lowered. A solid-state image pickup device includes a pixel array, a plurality of common output lines receiving signals read out from a plurality of pixels, a transfer scanning unit sequentially driving the plurality of transfer transistors, a signal processing unit processing the signals output to the common signal lines, and a level shift unit making amplitude of a pulse supplied to a gate of the transfer transistor larger than amplitude of a pulse supplied to a gate of a transistor constituting the signal processing unit. The pixel array and the level shift unit are arranged on a first semiconductor substrate, whereas the plurality of common output lines and the signal processing unit are arranged on a second semiconductor substrate.
摘要翻译：来自转移晶体管的暗电流被抑制，并且第二半导体衬底中的电源电压降低。一种固态摄像装置，包括：像素阵列，多个公共输出线，接收从多个像素读出的信号;顺序地驱动多个传输晶体管的传送扫描单元;信号处理单元，处理输出到公共信号线和电平移位单元，使提供给转移晶体管的栅极的脉冲的幅度大于提供给构成信号处理单元的晶体管的栅极的脉冲的幅度。像素阵列和电平移位单元布置在第一半导体衬底上，而多个公共输出线和信号处理单元布置在第二半导体衬底上。

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