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1. 发明申请

WO2010104990A2 PIN ELECTRONICS LIQUID COOLED MULTI-MODULE FOR HIGH PERFORMANCE, LOW COST AUTOMATED TEST EQUIPMENT 审中-公开
标题翻译： PIN电子液体冷却多模块，用于高性能，低成本自动测试设备
公开(公告)号：WO2010104990A2
公开(公告)日：2010-09-16
申请号：PCT/US2010/026881
申请日：2010-03-10
申请人： TERADYNE, INC. , BREINLINGER, Keith , OSTERTAG, Edward , SARTSCHEV, Ronald A. , TENEKETGES, Nicholas J.
发明人： BREINLINGER, Keith , OSTERTAG, Edward , SARTSCHEV, Ronald A. , TENEKETGES, Nicholas J.
IPC分类号： H01L21/60 , G01R1/00
CPC分类号： G01R31/2889 , G01R31/2891
摘要： In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi- module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.
摘要翻译：在一个实施例中，提供了一种通道板到DIB结多模块，其包括封装多个性能关键通道电子模块的外壳内的性能关键通道电子模块。冷却剂分配装置设置在外壳内以在外壳内提供冷却。通道板连接装置位于通道板至DIB结多模块的通道板端，无线连接装置位于通道板至DIB结多模块的DIB端。

2. 发明申请

WO2008042129A3 LIQUID IMMERSION COOLED MULTICHIP MODULE 审中-公开
公开(公告)号：WO2008042129A3
公开(公告)日：2008-04-10
申请号：PCT/US2007/020515
申请日：2007-09-20
申请人： TERADYNE, INC. , CEPEDA-RIZO, Juan , ESMAILPOUR, Mohsen , TENEKETGES, Nicholas
发明人： CEPEDA-RIZO, Juan , ESMAILPOUR, Mohsen , TENEKETGES, Nicholas
IPC分类号： H05K7/20 , H01L23/473
摘要： In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.

3. 发明申请

WO2008042129A2 LIQUID IMMERSION COOLED MULTICHIP MODULE 审中-公开
标题翻译：液体浸渍冷却多芯片模块
公开(公告)号：WO2008042129A2
公开(公告)日：2008-04-10
申请号：PCT/US2007020515
申请日：2007-09-20
申请人： TERADYNE INC , CEPEDA-RIZO JUAN , ESMAILPOUR MOHSEN , TENEKETGES NICHOLAS
发明人： CEPEDA-RIZO JUAN , ESMAILPOUR MOHSEN , TENEKETGES NICHOLAS
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/44 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.
摘要翻译：在一个实施例中，提供了一种液浸冷却的多芯片模块，其包括其上安装有芯片并适于与印刷电路板安装的基板。盖适于固定到印刷电路板，以便与基板一起安装以在盖和基板之间形成流体室，并使基板与印刷电路板配合。在一个实施例中，弧形垫板位于印刷电路板的与盖子相对的一侧上，并且盖子固定到垫板上以将盖子固定到印刷电路板。在一些实施例中可以是可移除的挡板位于盖内并引导冷却剂流动通过流体室。

4. 发明申请

WO2006005031A1 AUTOMATED TEST EQUIPMENT WITH DIB MOUNTED THREE DIMENSIONAL TESTER ELECTRONICS BRICKS 审中-公开
标题翻译：自动测试设备与DIB安装三维测试仪电子砖
公开(公告)号：WO2006005031A1
公开(公告)日：2006-01-12
申请号：PCT/US2005/023676
申请日：2005-06-30
申请人： TERADYNE, INC. , TENEKETGES, Nicholas J.
发明人： TENEKETGES, Nicholas J.
IPC分类号： G01R31/28
CPC分类号： G01R31/2889
摘要： Automated test equipment is provided which includes a test head having a tester electronics brick (305) mounted to a device interface board. In some embodiments, support circuitry is positioned adjacent the tester electronics bricks opposite the DIB. The support circuitry may include power circuitry and/or data bus circuitry, which may be coupled to separate sides, or the same side of the tester electronics brick. A heat transfer apparatus (315) located between the DIB and the support circuitry may be provided for cooling the tester electronics bricks. A tester electronics brick may include multi-chip modules (310) arranged so that the edges generally define interface sides of the tester electronics brick. These sides may include a DIB interface side (305 1) mounted to the DIB, a data bus interface side (305 5), a power interface side, and a heat transfer interface side (315). Contacts (325) may be located at the edges of the MCMs.
摘要翻译：提供了自动测试设备，其包括具有安装到设备接口板的测试仪电子砖（305）的测试头。在一些实施例中，支撑电路位于与DIB相对的测试器电子部件砖附近。支持电路可以包括电源电路和/或数据总线电路，其可耦合到测试仪电子部件的分离侧或同一侧。可以提供位于DIB和支撑电路之间的传热装置（315），用于冷却测试仪电子砖。测试仪电子砖可以包括布置成使得边缘通常限定测试仪电子砖的界面侧的多芯片模块（310）。这些侧面可以包括安装到DIB的DIB接口侧（305 1），数据总线接口侧（305,5），电源接口侧和传热接口侧（315）。触点（325）可以位于MCM的边缘。

5. 发明申请

WO2010104990A3 PIN ELECTRONICS LIQUID COOLED MULTI-MODULE FOR HIGH PERFORMANCE, LOW COST AUTOMATED TEST EQUIPMENT 审中-公开
标题翻译： PIN电子液体冷却多模块，用于高性能，低成本自动测试设备
公开(公告)号：WO2010104990A3
公开(公告)日：2011-01-13
申请号：PCT/US2010026881
申请日：2010-03-10
申请人： TERADYNE INC , BREINLINGER KEITH , OSTERTAG EDWARD , SARTSCHEV RONALD A , TENEKETGES NICHOLAS J
发明人： BREINLINGER KEITH , OSTERTAG EDWARD , SARTSCHEV RONALD A , TENEKETGES NICHOLAS J
IPC分类号： H01L21/60 , G01R1/00
CPC分类号： G01R31/2889 , G01R31/2891
摘要： In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi- module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.
摘要翻译：在一个实施例中，提供了一种通道板到DIB结多模块，其包括封装多个性能关键通道电子模块的外壳内的性能关键通道电子模块。冷却剂分配装置设置在外壳内以在外壳内提供冷却。通道板连接装置位于通道板至DIB结多模块的通道板端，无线连接装置位于通道板至DIB结多模块的DIB端。

6. 发明申请

WO2006004869A3 HEAT EXCHANGE APPARATUS WITH PARALLEL FLOW 审中-公开
标题翻译：热交换装置并行流
公开(公告)号：WO2006004869A3
公开(公告)日：2006-06-08
申请号：PCT/US2005023174
申请日：2005-06-30
申请人： TERADYNE INC , TENEKETGES NICHOLAS J , KWOK TARZEN
发明人： TENEKETGES NICHOLAS J , KWOK TARZEN
IPC分类号： H01L23/427
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.
摘要翻译：在至少一个实施例中，本发明是一种热交换装置，其包括至少一个热交换器，进气歧管和至少一个多芯片组件。其中进气歧管与每个热交换器流体连通，并且进气歧管能够分别向每个热交换器提供热交换介质。其中每个多芯片模块至少邻近至少一个热交换器定位，使得热量可以在每个多芯片模块和至少一个热交换器之间传递。

7. 发明申请

WO2006036282A1 CIRCUIT BOARD ASSEMBLY WITH REDUCED CAPACITIVE COUPLING 审中-公开
标题翻译：具有减少电容耦合的电路板组件
公开(公告)号：WO2006036282A1
公开(公告)日：2006-04-06
申请号：PCT/US2005/026688
申请日：2005-07-27
申请人： TERADYNE, INC. , YOON, Yeong-Joo , AGUIRRE, Fernando , TENEKETGES, Nicholas J.
发明人： YOON, Yeong-Joo , AGUIRRE, Fernando , TENEKETGES, Nicholas J.
IPC分类号： H05K1/02
CPC分类号： H05K1/113 , H05K1/0216 , H05K1/0219 , H05K1/0251 , H05K3/3436 , H05K2201/0792 , H05K2201/09718 , H05K2201/09781 , H05K2201/09809 , Y10T29/49126 , Y10T29/4913
摘要： A circuit board structure is disclosed. The structure includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the conductor layer. The anti-pad further includes a spacer formed substantially coplanar with the conductor plane.
摘要翻译：公开了一种电路板结构。该结构包括具有相对设置的平坦表面和导体的平坦基板。导体形成在至少一个平面表面上并且限定导体平面。该结构还包括通过衬底层和导体层形成的超大直径的抗焊盘。防焊盘还包括基本上与导体平面共面的间隔物。

8. 发明申请

WO2006004869A2 HEAT EXCHANGE APPARATUS WITH PARALLEL FLOW 审中-公开
标题翻译：平行流换热设备
公开(公告)号：WO2006004869A2
公开(公告)日：2006-01-12
申请号：PCT/US2005/023174
申请日：2005-06-30
申请人： TERADYNE, INC. , TENEKETGES, Nicholas, J. , KWOK, Tarzen
发明人： TENEKETGES, Nicholas, J. , KWOK, Tarzen
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.
摘要翻译：在至少一个实施例中，本发明是一种热交换设备，其包括至少一个热交换器，进气歧管和至少一个多芯片模块。在进气歧管与每个热交换器流体连通并且进气歧管能够分别向每个热交换器提供热交换介质的情况下。在每个多芯片模块至少邻近至少一个热交换器定位的情况下，使得热量可以在每个多芯片模块与至少一个热交换器之间传递。

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