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1. 发明申请

WO2007037992A3 MICROELECTROMECHANICAL (MEM) FLUID HEALTH SENSING DEVICE AND FABRICATION METHOD 审中-公开
公开(公告)号：WO2007037992A3
公开(公告)日：2007-04-05
申请号：PCT/US2006/035780
申请日：2006-09-12
申请人： ROCKWELL SCIENTIFIC LICENSING, LLC , DE NATALE, Jeffrey, F. , BORWICK, Robert, L., III , STUPAR, Philip, A. , KENDIG, Martin, W.
发明人： DE NATALE, Jeffrey, F. , BORWICK, Robert, L., III , STUPAR, Philip, A. , KENDIG, Martin, W.
IPC分类号： G01N11/00
摘要： A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a "deep etch" process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.

2. 发明申请

WO2007037992A2 MICROELECTROMECHANICAL (MEM) FLUID HEALTH SENSING DEVICE AND FABRICATION METHOD 审中-公开
标题翻译：微电子医疗（MEM）流体卫生感测装置及制造方法
公开(公告)号：WO2007037992A2
公开(公告)日：2007-04-05
申请号：PCT/US2006035780
申请日：2006-09-12
申请人： ROCKWELL SCIENT LICENSING LLC , DE NATALE JEFFREY F , BORWICK ROBERT L III , STUPAR PHILIP A , KENDIG MARTIN W
发明人： DE NATALE JEFFREY F , BORWICK ROBERT L III , STUPAR PHILIP A , KENDIG MARTIN W
IPC分类号： G01N11/00
CPC分类号： G01N33/2888 , G01N11/16
摘要： A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a "deep etch" process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.
摘要翻译：微机电（MEM）流体健康感测装置包括粘度传感器，该粘度传感器提供随着浸入其中的流体的粘度而变化的输出，以及提供随流体的另一预定参数而变化的输出的至少一个其它传感器。粘度传感器优选是通过“深蚀刻”工艺制造的MEM器件。传感器优选地集成在公共基板上，尽管它们也可以单独制造并且封装在一起以形成混合装置。可以包括接收传感器输出并提供指示流体健康的一个或多个输出的数据处理装置。可以是本装置一部分的传感器类型包括例如温度传感器，MEM电化学传感器，MEM加速度计，MEM接触开关润滑性传感器和/或感应金属磨损传感器。

3. 发明申请

WO2007033178A3 MICROELECTROMECHANICAL (MEM) VISCOSITY SENSOR AND METHOD 审中-公开
标题翻译：微电子力学（MEM）粘度传感器和方法
公开(公告)号：WO2007033178A3
公开(公告)日：2007-10-25
申请号：PCT/US2006035494
申请日：2006-09-11
申请人： ROCKWELL SCIENT LICENSING LLC , DE NATALE JEFFREY F , BORWICK ROBERT L , STUPAR PHILIP A
发明人： DE NATALE JEFFREY F , BORWICK ROBERT L , STUPAR PHILIP A
IPC分类号： G01N11/00
CPC分类号： G01N11/16
摘要： A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart . A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.
摘要翻译： MEM粘度传感器包括基底，第一和第二支撑结构固定到基底并间隔开。柔性构件被固定到支撑结构，使得它被悬挂在上方并且可以相对于基底垂直弯曲。该构件具有高密度的穿孔，通过该穿孔密度可以流动要检测粘度的流体。传感器包括用于向部件施加力的驱动装置和用于响应于所施加的力来感测部件的垂直运动的感测装置。该成员的穿孔确保其运动的阻力本质上是剪切性的，并且使对颗粒的敏感性最小化。衬底还优选地被穿孔以进一步减小非剪切力并促进流体交换。

4. 发明申请

WO2007033178A2 MICROELECTROMECHANICAL (MEM) VISCOSITY SENSOR AND METHOD 审中-公开
标题翻译：微电子（MEM）粘度传感器和方法
公开(公告)号：WO2007033178A2
公开(公告)日：2007-03-22
申请号：PCT/US2006/035494
申请日：2006-09-11
申请人： ROCKWELL SCIENTIFIC LICENSING, LLC , DE NATALE, Jeffrey, F. , BORWICK, Robert, L. , STUPAR, Philip, A.
发明人： DE NATALE, Jeffrey, F. , BORWICK, Robert, L. , STUPAR, Philip, A.
IPC分类号： H01L29/84
CPC分类号： G01N11/16
摘要： A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart . A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.
摘要翻译： MEM粘度传感器包括衬底，其具有固定到衬底并间隔开的第一和第二支撑结构。柔性构件固定到支撑结构上，使得其被悬挂在相对于衬底上方并且可垂直地弯曲。该构件具有高密度的穿孔，通过该穿孔，待粘度被感测的流体能流过。传感器包括向构件施加力的驱动装置，以及响应于所施加的力感测构件的垂直运动的感测装置。成员的穿孔确保其对运动的抵抗力本质上是剪切的，并且最小化对颗粒的敏感性。衬底还优选被穿孔以进一步降低非剪切力并促进流体交换。

5. 发明申请

WO2007030327A2 HIGH TEMPERATURE MICROELECTROMECHANICAL (MEM) DEVICES AND FABRICATION METHOD 审中-公开
标题翻译：高温微电子（MEM）器件和制造方法
公开(公告)号：WO2007030327A2
公开(公告)日：2007-03-15
申请号：PCT/US2006/032960
申请日：2006-08-22
申请人： TELEDYNE LICENSING, LLC , DE NATALE, Jeffrey, F. , BORWICK, Robert, L. , STUPAR, Philip, A.
发明人： DE NATALE, Jeffrey, F. , BORWICK, Robert, L. , STUPAR, Philip, A.
IPC分类号： H01L21/00
CPC分类号： B81C1/0069 , B81C2203/032
摘要： A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer - typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments .
摘要翻译：根据本发明的微机电（MEM）装置包括半导体晶片 - 通常是SOI晶片，衬底和将晶片结合到衬底以形成复合结构的高温接合。复合结构的部分被图案化和蚀刻以限定静止和可移动的MEM元件，其中可移动元件机械地联接到固定元件。高温键优选是机械结合，其中晶片和衬底具有对准和机械连接以形成热压接以实现结合的各自的焊盘。金属化层通常沉积在复合结构上并被图案化以为器件提供电互连。金属化层优选地包括诸如铂的导电耐火材料以承受高温环境。

6. 发明申请

WO2007030327A3 HIGH TEMPERATURE MICROELECTROMECHANICAL (MEM) DEVICES AND FABRICATION METHOD 审中-公开
标题翻译：高温微电子（MEM）器件和制造方法
公开(公告)号：WO2007030327A3
公开(公告)日：2009-05-07
申请号：PCT/US2006032960
申请日：2006-08-22
申请人： TELEDYNE LICENSING LLC , DE NATALE JEFFREY F , BORWICK ROBERT L , STUPAR PHILIP A
发明人： DE NATALE JEFFREY F , BORWICK ROBERT L , STUPAR PHILIP A
IPC分类号： H01L21/00 , G01N11/00 , H01L21/46 , H01L29/84
CPC分类号： B81C1/0069 , B81C2203/032
摘要： A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer - typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments .
摘要翻译：根据本发明的微机电（MEM）装置包括半导体晶片 - 通常是SOI晶片，衬底和将晶片结合到衬底以形成复合结构的高温接合。复合结构的部分被图案化和蚀刻以限定静止和可移动的MEM元件，其中可移动元件机械地联接到固定元件。高温键优选是机械结合，其中晶片和衬底具有对准和机械连接以形成热压接以实现结合的各自的焊盘。金属化层通常沉积在复合结构上并被图案化以为器件提供电互连。金属化层优选地包括诸如铂的导电耐火材料以承受高温环境。

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