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    • 5. 发明申请
    • FLUIDIC MIXING STRUCTURE, METHOD FOR FABRICATING SAME, AND MIXING METHOD
    • 流体混合结构,其制造方法和混合方法
    • WO2007024410A2
    • 2007-03-01
    • PCT/US2006/029469
    • 2006-07-26
    • TELEDYNE LICENSING, LLCDE NATALE, Jeffrey, F.CHEN, Chung-LungCAI, QingjunTSAI, Chialun
    • DE NATALE, Jeffrey, F.CHEN, Chung-LungCAI, QingjunTSAI, Chialun
    • B81B1/00
    • B01F13/0084B01F13/0086B81C1/00206
    • A fluidic micromixer comprises a plurality of fluid inlets in communication with a mixing chamber, the plurality of fluid inlets being adapted to introduce into the chamber a corresponding plurality of distinct fluid streams. The mixing chamber comprises at least one surface patterned to define hydrophobic and hydrophilic regions spaced apart along a principal direction of fluid flow within the chamber from the fluid inlets to a fluid outlet, the regions being adapted to induce fluid flow in a direction transverse to the principal direction of fluid flow to mix the fluid streams. At least one of the hydrophobic regions may comprise microstructures patterned on the at least one surface. Also disclosed are a method for fabricating the micromixer, a method of mixing a plurality of fluid streams by vortex mixing or instability mixing, and a system comprising the micromixer, fluid reservoirs and a pump for generating flow of fluids from the reservoirs to the micromixer .
    • 流体微混合器包括与混合室连通的多个流体入口,多个流体入口适于将相应的多个不同的流体流引入室中。 混合室包括图案化的至少一个表面,以限定沿腔室内的流体流的主要方向与流体出口间隔开的疏水和亲水区域,该区域适于在横向于流体出口的方向上引起流体流动 流体流动的主要方向以混合流体流。 疏水区域中的至少一个可以包括在至少一个表面上图案化的微结构。 还公开了一种制造微混合器的方法,通过涡流混合或不稳定混合混合多个流体流的方法,以及包括微混合器,流体储存器和用于产生流体从储存器到微混合器的流体的泵的系统。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE WITH A CONDUCTION ENHANCEMENT LAYER
    • 具有导热增强层的半导体器件
    • WO2007001825A2
    • 2007-01-04
    • PCT/US2006/022922
    • 2006-06-12
    • TELEDYNE LICENSING, LLCZHANG, Qingchun
    • ZHANG, Qingchun
    • H01L29/7722H01L29/0692H01L29/8083
    • A semiconductor device includes a drift layer of a first conductivity type having a doping concentration and a conduction layer also of the first conductivity type on the drift layer that has a doping concentration greater than the doping concentration of the drift layer. The device also includes a pair of trench structures, each including a trench contact at one end and a region of a second conductivity type opposite the first conductivity type, at another end. Each trench structure extends into and terminates within the conduction layer such that the second-conductivity-type region is within the conduction layer. A first contact structure is on the drift layer opposite the conduction layer while a second contact structure is on the conduction layer.
    • 半导体器件包括具有掺杂浓度的第一导电类型的漂移层和漂移层上的第一导电类型的导电层,所述漂移层具有大于掺杂浓度的掺杂浓度 漂移层。 该器件还包括一对沟槽结构,在一端包括沟槽触点,在另一端包括与第一导电类型相反的第二导电类型的区域。 每个沟槽结构延伸到导电层中并终止于导电层内,使得第二导电类型区域位于导电层内。 第一接触结构在漂移层上与导电层相对,而第二接触结构在导电层上。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE WITH A CONDUCTION ENHANCEMENT LAYER
    • 具有导电增强层的半导体器件
    • WO2007001825A3
    • 2007-06-28
    • PCT/US2006022922
    • 2006-06-12
    • TELEDYNE LICENSING LLCZHANG QINGCHUN
    • ZHANG QINGCHUN
    • H01L29/772H01L29/808
    • H01L29/7722H01L29/0692H01L29/8083
    • A semiconductor device includes a drift layer of a first conductivity type having a doping concentration and a conduction layer also of the first conductivity type on the drift layer that has a doping concentration greater than the doping concentration of the drift layer. The device also includes a pair of trench structures, each including a trench contact at one end and a region of a second conductivity type opposite the first conductivity type, at another end. Each trench structure extends into and terminates within the conduction layer such that the second-conductivity-type region is within the conduction layer. A first contact structure is on the drift layer opposite the conduction layer while a second contact structure is on the conduction layer.
    • 半导体器件包括具有掺杂浓度的第一导电类型的漂移层和在漂移层上也具有大于漂移层的掺杂浓度的掺杂浓度的第一导电类型的导电层。 该装置还包括一对沟槽结构,每个沟槽结构在另一端包括在一端处的沟槽接触和与第一导电类型相反的第二导电类型的区域。 每个沟槽结构延伸到导电层内并终止于导电层,使得第二导电型区域在导电层内。 第一接触结构在与导电层相对的漂移层上,而第二接触结构在导电层上。