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1. 发明申请

WO2003032374A2 WORKPIECE CARRIER WITH ADJUSTABLE PRESSURE ZONES AND BARRIERS 审中-公开
标题翻译：具有可调节压力区和障碍物的工作承载能力
公开(公告)号：WO2003032374A2
公开(公告)日：2003-04-17
申请号：PCT/US2002/029930
申请日：2002-09-20
申请人： SPEEDFAM-IPEC CORPORATION
发明人： MALLERY, Daniel, S. , LOGAN, Sean, S. , LEE, James, F.
IPC分类号： H01L21/00
CPC分类号： H01L21/6838 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/67253
摘要： A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.
摘要翻译：具有可调节压力区域和区域之间的可调节隔板的载体，用于在晶片的背面分配压力。可以使用弹性腹板隔膜来产生压力区域。在隔膜的表面中形成一个或多个凹槽以减轻隔膜和晶片之间形成的真空。

2. 发明申请

WO2003021641A3 METHOD AND APPARATUS FOR SENSING A WAFER IN A CARRIER 审中-公开
公开(公告)号：WO2003021641A3
公开(公告)日：2003-03-13
申请号：PCT/US2002/027168
申请日：2002-08-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： HERB, John, D. , TEENY, Ned, W. , SCHULTZ, Stephen, C.
IPC分类号： H01L21/00
摘要： The invention is a carrier that determines if a wafer has been properly loaded. The carrier includes a body having a cavity covered by a membrane, thereby forming an initial plenum. One or more annular ribs may extend from the body to the membrane to divide the initial plenum into a plurality of plenums. A sensor is positioned within one of the plenums to detect the presence of the wafer. Pump(s) with pressure regulators may be used to pressurize the plenum(s). A first plenum may be pressurized sufficient to hold the wafer to the membrane by creating a partial vacuum between the membrane and the wafer. A second plenum may be pressurized sufficient to urge the membrane away from the sensor if the wafer is not properly loaded in the carrier. If the membrane is near the sensor, the wafer has been properly loaded into the carrier.

3. 发明申请

WO2002033737A3 MULTIPROBE DETECTION SYSTEM FOR CHEMICAL-MECHANICAL PLANARIZATION TOOL 审中-公开
公开(公告)号：WO2002033737A3
公开(公告)日：2002-04-25
申请号：PCT/US2001/032201
申请日：2001-10-16
申请人： SPEEDFAM-IPEC CORPORATION
发明人： WELDON, Matthew , LAURSEN, Thomas , GRIEF, Malcolm , HOLZAPFEL, Paul , MELONI, Mark, A. , EATON, Robert
IPC分类号： B24B37/04
摘要： The invention is a method and apparatus for planarizing a wafer (100). Discrete measurements are taken across the surface of the wafer (100) at a desired spatial density. The measurements may be generated using a flash lamp (317) to reflect a light signal off the surface of the wafer (100) with a spectrometer (318) analyzing the reflected light. A plurality of probes (306a-c) may be used at different locations to shorten the time necessary for taking measurements across the full front surface of the wafer (100) and for allowing a plurality of areas to be sampled substantially simultaneously. A control system receives the measurements and their corresponding locations. The control system (311) is then able to analyze the data looking for areas or bands on the front surface of the wafer (100) that need an increase or decrease in material removal rate. The control system (311) is then able to adjust one or more planarization parameters to improve the process for the current wafer or for future wafers.

4. 发明申请

WO2003043783A1 METHOD AND APPARATUS FOR CONTROLLING SLURRY DISTRIBUTION 审中-公开
标题翻译：用于控制浆料分布的方法和装置
公开(公告)号：WO2003043783A1
公开(公告)日：2003-05-30
申请号：PCT/US2002/035632
申请日：2002-11-06
申请人： SPEEDFAM-IPEC CORPORATION
发明人： LAURSEN, Thomas , ZHANG, Guangying
IPC分类号： B24B57/02
CPC分类号： B24B57/02 , B24B37/26 , B24B55/02 , C23F3/00 , G11B5/8404 , H01L21/30625 , H01L21/67219
摘要： A method and apparatus (100) for "through-the-pad" delivery of slurry polishing agents directly to the land areas of a polishing pad (1305) is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove (1310) modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad (1305) and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.
摘要翻译：公开了一种用于将浆料抛光剂直接传送到抛光垫（1305）的岸台区域的方法和装置（100）。本发明还提供改进的浆料化学成分的控制，以解决在抛光循环期间浆料的化学反应性的损失。此外，还公开了对抛光垫的抛光表面的各种凹槽（1310）的修改，以改善在抛光垫（1305）的基本上整个表面上的浆料保持率并减少慢带效应。因此，本发明提供了从加工的工件的表面去除的材料的更高程度的平坦化和均匀性，以便消除或以其他方式减小小尺度粗糙度和大规模地形差异，以及降低成本 - 与浆料成本相关的所有权。

5. 发明申请

WO2003032374A3 WORKPIECE CARRIER WITH ADJUSTABLE PRESSURE ZONES AND BARRIERS 审中-公开
公开(公告)号：WO2003032374A3
公开(公告)日：2003-04-17
申请号：PCT/US2002/029930
申请日：2002-09-20
申请人： SPEEDFAM-IPEC CORPORATION
发明人： MALLERY, Daniel, S. , LOGAN, Sean, S. , LEE, James, F.
IPC分类号： B24B37/04
摘要： A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.

6. 发明申请

WO2002091438A1 METHOD OF REMOVING DEBRIS FROM CLEANING PADS IN WORK PIECE CLEANING EQUIPMENT 审中-公开
标题翻译：清洁工作清洁设备清洁垫片的方法
公开(公告)号：WO2002091438A1
公开(公告)日：2002-11-14
申请号：PCT/US2002/014547
申请日：2002-05-07
申请人： SPEEDFAM-IPEC CORPORATION
发明人： EPSHTEYN, Yakov , KRUPA, Frank , HARVEY, Ellis
IPC分类号： H01L21/00
CPC分类号： H01L21/67046 , Y10S134/902
摘要： The cleaning pads (102, 104) that are used to clean work pieces (200), such as semiconductor wafers, are cyclically compressed against one another and rinsed with a rinsing fluid. By cyclically compressing the cleaning pads (102, 104) together and rinsing them, the debris that the cleaning pads remove from the work pieces (200) and that becomes embedded in, and adhered to, the cleaning pads (102, 104) is subsequently removed therefrom.
摘要翻译：用于清洁诸如半导体晶片的工件（200）的清洁垫（102,104）彼此循环地压缩并用冲洗流体冲洗。随后将清洁垫（102,104）周期性地压缩在一起并将其清洗，随后将清洁垫从工件（200）上移除并嵌入清洁垫（102,104）中并粘附到清洁垫（102,104）上的碎屑从中移除。

7. 发明申请

WO2002089181A2 MODIFICATION TO FILL LAYERS FOR INLAYING SEMICONDUCTOR PATTERNS 审中-公开
标题翻译：用于嵌入半导体图案的填充层的修改
公开(公告)号：WO2002089181A2
公开(公告)日：2002-11-07
申请号：PCT/US2001/051639
申请日：2001-10-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： LAURSEN, Thomas
IPC分类号： H01L
CPC分类号： H01L21/76224 , H01L21/31053 , H01L21/7684
摘要： The invention provides a method of fabricating semiconductor chips that includes modifying physical properties of selected deposited fill layers over patterns having up-features and down-features, with fill to be retained in down-features. The modification enhances chemical mechanical polishing rates, or other polishing, of the modified fill layers to reduce dishing of fill material and achieves this without substantially affecting the electrical properties of the final semiconductor chip product. The invention also provides intermediate chip products and final chip products of the method.
摘要翻译：本发明提供一种制造半导体芯片的方法，其包括通过具有上特征和下特征的图案改变所选择的沉积填充层的物理性质，其中填充物被保持在向下特征中。修改增强了改性填充层的化学机械抛光速率或其它抛光，以减少填充材料的凹陷，并且实现这一点，而基本上不影响最终半导体芯片产品的电性能。本发明还提供了该方法的中间芯片产品和最终芯片产品。

8. 发明申请

WO2002087826A1 METHOD FOR CONTROLLING A PROCESS IN A MULTI-ZONAL APPARATUS 审中-公开
标题翻译：用于控制多区域设备中的过程的方法
公开(公告)号：WO2002087826A1
公开(公告)日：2002-11-07
申请号：PCT/US2002/013305
申请日：2002-04-26
申请人： SPEEDFAM-IPEC CORPORATION
发明人： KOROVIN, Nikolay, N.
IPC分类号： B24B41/06
CPC分类号： B24B37/042 , B24B41/061 , B24B49/16
摘要： A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Z i ) in each of the zones of that apparatus includes processing a test work piece in the apparatus with initial values J 1 (Z i ) of the parameters in each zone i to achieve a process result Q 1 (x). Then a process result Q f (x) to be expected from incremental changes in the parameters to values J f (x) is calculated. The expected process results Q f (x) are related to the initial process results Q 1 (x) by the relationship Q f (x)=Q 1 (x) * J f (x)/J 1 (x). After determining optimum values of J(Z i ) to reduce the difference between the expected process result and a target process result, a work piece is processed through the process apparatus using those optimum values of J(Z i ).
摘要翻译：一种用于控制多区域处理装置中的处理并且具体地用于确定为该设备的每个区域中的处理参数J（Zi）设置的最佳值的方法包括：在初始值J1中对设备中的测试工件进行处理（Zi），以获得处理结果Q1（x）。然后计算从参数的增量变化到值Jf（x）的期望的处理结果Qf（x）。预期的过程结果Qf（x）通过关系Qf（x）= Q1（x）* Jf（x）/ J1（x）与初始过程结果Q1（x）相关。在确定J（Zi）的最佳值以减小预期处理结果与目标处理结果之间的差异之后，通过使用J（Zi）的最佳值的处理装置处理工件。

9. 发明申请

WO2002084714A3 METHOD AND APPARATUS FOR ELECTROCHEMICALLY DEPOSITING A MATERIAL ONTO A WORKPIECE SURFACE 审中-公开
公开(公告)号：WO2002084714A3
公开(公告)日：2002-10-24
申请号：PCT/US2002/011428
申请日：2002-04-10
申请人： SPEEDFAM-IPEC CORPORATION
发明人： EMESH, Ismail , CHADDA, Saket , KOROVIN, Nikolay, N. , MUELLER, Brian, L.
IPC分类号： C25D7/12
摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

10. 发明申请

WO2002050893A3 PROCESS FOR MONITORING A PROCESS, PLANARIZING A SURFACE, AND FOR QUANTIFYING THE RESULTS OF A PLANARIZATION PROCESS 审中-公开
公开(公告)号：WO2002050893A3
公开(公告)日：2002-06-27
申请号：PCT/US2001/048988
申请日：2001-12-19
申请人： SPEEDFAM-IPEC CORPORATION
发明人： KOROVIN, Nikolay
IPC分类号： H01L21/66
摘要： A process for quantifying the results of a planarization process provides metrics that can be applied to process parameters that affect the localized planarization results. A surface of a work piece is planarized and the amount of material removed as a function of the location on the surface of the work piece is measured and recorded. The data from the measurements are fitted to a first polynomial to construct an approximation of a low spatial frequency scan. The work piece surface is then divided into a plurality of regions, each of the regions influenced by a planarization process variable. The approximation of the low spatial frequency scan is then analyzed in each of the regions by fitting the low spatial frequency scan in that region to an nth order polynomial. The coefficient of the nth order term is used as a metric for the results in that region.

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