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1. 发明申请

WO2012118896A3 APPARATUS AND METHODS RELATED TO WIRE BOND PADS AND REDUCING IMPACT OF HIGH RF LOSS PLATING 审中-公开
公开(公告)号：WO2012118896A3
公开(公告)日：2012-09-07
申请号：PCT/US2012/027130
申请日：2012-02-29
申请人： SKYWORKS SOLUTIONS, INC. , SUN, Weimin , ZAMPARDI, JR., Peter, Joseph , SHAO, Hongxiao
发明人： SUN, Weimin , ZAMPARDI, JR., Peter, Joseph , SHAO, Hongxiao
IPC分类号： H01L23/48 , H01L21/60
摘要： To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, the solder mask can be reconfigured to prevent the edges and sidewalls of the wire-bond areas from being plated in some embodiments. Leaving the edges and sidewalls of the wire-bond areas free from high RF loss plating, such as Ni/Pd/Au plating, provides a path for the RF current to flow around the high resistivity material, which reduces the RF signal loss associated with the high resistivity plating material. Also, to reduce the RF losses associated with high RF loss plating, such as, for example, Ni/Pd/Au plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) can be placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.

2. 发明申请

WO2015066711A1 SYSTEM AND METHOD FOR MIXING A GAS AND A LIQUID 审中-公开
标题翻译：用于混合气体和液体的系统和方法
公开(公告)号：WO2015066711A1
公开(公告)日：2015-05-07
申请号：PCT/US2014/063926
申请日：2014-11-04
申请人： SHI, Yang , SHAO, Hongxiao
发明人： SHI, Yang , SHAO, Hongxiao
IPC分类号： B01F3/04 , B01F5/08 , B01F11/02
CPC分类号： B01F3/04978 , B01F5/0451 , B01F5/0463 , B01F11/0208 , B01F11/0258 , B01F2215/0454
摘要： A system and method for mixing a gas and a liquid includes, receiving a liquid at a liquid inlet of a convergent nozzle and ejecting the liquid at a predetermined output velocity from a liquid outlet of the convergent nozzle into a mixing chamber, the mixing chamber comprising a cantilevered reed positioned within the mixing chamber. The ejection of the liquid from the liquid outlet causes the cantilevered reed to vibrate at an intrinsic frequency. The vibration of the cantilevered reed induces resonance between the liquid and the cantilevered reed and the resonance results in an ultrasound wave within the liquid. Upon the introduction of a gas into the liquid within the mixing chamber, the mixing of the gas into the liquid is effected by the ultrasound wave generated by the cantilevered reed.
摘要翻译：用于混合气体和液体的系统和方法包括：在会聚喷嘴的液体入口处接收液体并以预定的输出速度将液体从会聚喷嘴的液体出口喷射到混合室中，所述混合室包括位于混合室内的悬臂簧片。从液体出口排出液体使得悬臂式芦苇以固有频率振动。悬臂式芦苇的振动引起液体与悬臂式芦苇之间的共振，并且共振导致液体内的超声波。当在混合室内的液体中引入气体时，通过由悬臂式簧片产生的超声波将气体混合到液体中。

3. 发明申请

WO2012118896A2 APPARATUS AND METHODS RELATED TO WIRE BOND PADS AND REDUCING IMPACT OF HIGH RF LOSS PLATING 审中-公开
标题翻译：与焊接垫相关的装置和方法，并减少高射频损伤的影响
公开(公告)号：WO2012118896A2
公开(公告)日：2012-09-07
申请号：PCT/US2012027130
申请日：2012-02-29
申请人： SKYWORKS SOLUTIONS INC , SUN WEIMIN , ZAMPARDI JR PETER JOSEPH , SHAO HONGXIAO
发明人： SUN WEIMIN , ZAMPARDI JR PETER JOSEPH , SHAO HONGXIAO
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/49 , H01L23/49838 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2223/6611 , H01L2223/6672 , H01L2224/04042 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2224/48599 , H01L2224/48611 , H01L2224/48616 , H01L2224/48644 , H01L2224/48655 , H01L2224/49111 , H01L2224/85411 , H01L2224/85416 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, the solder mask can be reconfigured to prevent the edges and sidewalls of the wire-bond areas from being plated in some embodiments. Leaving the edges and sidewalls of the wire-bond areas free from high RF loss plating, such as Ni/Pd/Au plating, provides a path for the RF current to flow around the high resistivity material, which reduces the RF signal loss associated with the high resistivity plating material. Also, to reduce the RF losses associated with high RF loss plating, such as, for example, Ni/Pd/Au plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) can be placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.
摘要翻译：为了减少与高RF损耗电镀（例如镍/钯/金（Ni / Pd / Au）电镀）相关的射频（RF）损耗，可以重新配置焊接掩模以防止焊接掩模的边缘和侧壁在一些实施例中，电镀的线接合区域不被电镀。离开没有高RF损耗电镀（例如Ni / Pd / Au电镀）的引线键合区域的边缘和侧壁提供了用于RF电流围绕高电阻率材料流动的路径，这降低了与高电阻率电镀材料。此外，为了减少与高RF损耗电镀（例如Ni / Pd / Au电镀）相关的RF损耗，与射频集成相关的诸如电容器，电阻器或电感器的片上无源器件电路（RFIC）可以相对于RFIC的RF信号输出放置在RF上信号路径中。通过将片上无源器件放置在RF上信号路径中，RF电流不直接通过无源器件焊盘的高RF损耗电镀材料。

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