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1. 发明申请

WO2008153885A1 COMPONENT SENSOR FOR PICK AND PLACE MACHINE USING IMPROVED SHADOW IMAGING 审中-公开
标题翻译：使用改进的阴影成像的拾取和放置机器的组件传感器
公开(公告)号：WO2008153885A1
公开(公告)日：2008-12-18
申请号：PCT/US2008/007043
申请日：2008-06-05
申请人： CYBEROPTICS CORPORATION , RUDD, Eric, P. , KONICEK, John, P. , GAIDA, John, D.
发明人： RUDD, Eric, P. , KONICEK, John, P. , GAIDA, John, D.
IPC分类号： H05K13/04
CPC分类号： H05K13/08
摘要： A method (100) of sensing a component (30) held by a nozzle (24) of a pick and place machine is provided. The method (100) includes engaging (102) a source of illumination (60) and recording (104) a reference background image when no component is held by the nozzle (24). Then, a component (30) is adhered (108) to the nozzle (24). A shadow image of the component is detected (110) while the component (30) is held by the nozzle (24). The detected shadow image of the component (30) is adjusted (112) based upon the recorded reference background image. Positional information relative to the component held on the nozzle is computed (118) using the adjusted shadow image. The component (30) is then mounted upon a workpiece using the positional information.
摘要翻译：提供一种感测由拾放机的喷嘴（24）保持的部件（30）的方法（100）。方法（100）包括当没有部件被喷嘴（24）保持时，接合（102）照明源（60）并记录（104）参考背景图像。然后，将部件（30）粘附（108）到喷嘴（24）。当部件（30）被喷嘴（24）保持时，检测到部件的阴影图像（110）。基于所记录的参考背景图像来调整（112）所检测到的分量（30）的阴影图像。使用调整后的阴影图像来计算相对于保持在喷嘴上的部件的位置信息（118）。然后使用位置信息将部件（30）安装在工件上。

2. 发明申请

WO2011056976A1 HIGH SPEED OPTICAL INSPECTION SYSTEM WITH ADAPTIVE FOCUSING 审中-公开
标题翻译：具有自适应聚焦的高速光学检测系统
公开(公告)号：WO2011056976A1
公开(公告)日：2011-05-12
申请号：PCT/US2010/055452
申请日：2010-11-04
申请人： CYBEROPTICS CORPORATION , HAUGAN, Carl, E. , SKUNES, Timothy, A. , RUDD, Eric, P. , CARUSO, Beverly
发明人： HAUGAN, Carl, E. , SKUNES, Timothy, A. , RUDD, Eric, P.
IPC分类号： G01N21/956
CPC分类号： H05K13/08 , G01N21/8806 , G01N21/8903 , G01N21/956 , G01N2021/8812 , G01N2021/8816 , G01N2021/8822 , G01N2021/8924 , G01N2021/95638 , G01N2201/0635 , G01R31/304
摘要： An optical inspection system (41, 42, 43, 44, 45) for inspecting a substrate (10) is provided. The system (41, 42, 43, 44, 45) includes an array (4) of cameras (2A-2H) configured to acquire a plurality of sets of images as the substrate (10) and the array (4) undergo relative motion with respect to each other. At least one focus actuator (9A-9H) is operably coupled to each camera (2A-2H) of the array (4) of cameras (2A-2H) to cause displacement of at least a portion of each camera (2A-2H) that affects focus. A substrate range calculator (16) is configured to receive at least portions of images from the array (4) and to calculate range between the array (4) of cameras (2A-2H) and the substrate (10). A controller (80) is coupled to the array (4) of cameras (2A-2H) and to the range calculator (16). The controller (80) is configured to provide a control signal to each of the at least one focus actuator (9A-9H) to adaptively focus each camera (2A-2H) of the array (4) during the relative motion.
摘要翻译：提供了一种用于检查基板（10）的光学检查系统（41,42,43,44,45）。系统（41,42,43,44,45）包括被配置为获取多组图像作为基板（10）并且阵列（4）经历相对运动的相机（2A-2H）阵列（4）相对于彼此。至少一个聚焦致动器（9A-9H）可操作地耦合到相机（2A-2H）的阵列（4）的每个相机（2A-2H），以引起每个相机（2A-2H）的至少一部分的位移，影响重点。衬底范围计算器（16）被配置为接收来自阵列（4）的图像的至少一部分，并且计算摄像机（2A-2H）的阵列（4）和衬底（10）之间的距离。控制器（80）耦合到相机（2A-2H）的阵列（4）和范围计算器（16）。控制器（80）被配置为向至少一个聚焦致动器（9A-9H）中的每一个提供控制信号，以在相对运动期间自适应地聚焦阵列（4）的每个相机（2A-2H）。

3. 发明申请

WO2007053557A1 ELECTRONICS ASSEMBLY MACHINE WITH EMBEDDED SOLDER PASTE INSPECTION 审中-公开
标题翻译：电子组装机具有嵌入式焊膏检测
公开(公告)号：WO2007053557A1
公开(公告)日：2007-05-10
申请号：PCT/US2006/042337
申请日：2006-10-31
申请人： CYBEROPTICS CORPORATION , DUQUETTE, David, W. , MANICKAM, Swaminathan , KONICEK, John, P. , CASE, Steven, K. , RUDD, Eric, P.
发明人： DUQUETTE, David, W. , MANICKAM, Swaminathan , KONICEK, John, P. , CASE, Steven, K. , RUDD, Eric, P.
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , B23K3/087 , B23K2201/42 , H05K1/0269 , H05K3/3484 , Y10T29/49131 , Y10T29/53087 , Y10T29/53091 , Y10T29/53178 , Y10T29/532
摘要： A pick and place machine (10, 201) includes a placement head (206) configured to releasably grasp a component (304) for placement. A robotic system is coupled to the placement head (206) to generate relative movement between the placement head (206) and a workpiece (203). An image acquisition system (350) is configured to acquire at least one image of an intended placement (352) location of the component (304) before the component (304) is placed. A controller (298) is operably coupled to the image acquisition system (350), the controller (298) is configured to process at least one before-placement image to generate a metric relative to solder (354, 356) deposited at the intended placement location (352).
摘要翻译：拾取和放置机器（10,201）包括配置为可释放地抓住用于放置的部件（304）的放置头（206）。机器人系统耦合到放置头（206）以在放置头（206）和工件（203）之间产生相对运动。图像采集系统（350）被配置为在放置组件（304）之前获取组件（304）的预期放置位置（352）的至少一个图像。控制器（298）可操作地耦合到图像采集系统（350），控制器（298）被配置为处理至少一个放置前图像以产生相对于在预期放置处沉积的焊料（354,356）的度量位置（352）。

4. 发明申请

WO2006125102A8 METHOD AND APPARATUS FOR EVALUATING A COMPONENT PICK ACTION IN AN ELECTRONICS ASSEMBLY MACHINE 审中-公开
标题翻译：用于评估电子组装机中组分捕捉作用的方法和装置
公开(公告)号：WO2006125102A8
公开(公告)日：2007-02-01
申请号：PCT/US2006019281
申请日：2006-05-18
申请人： CYBEROPTICS CORP , CASE STEVEN K , KONICEK JOHN P , DUQUETTE DAVID W , RUDD ERIC P , MANICKAM SWAMINATHAN
发明人： CASE STEVEN K , KONICEK JOHN P , DUQUETTE DAVID W , RUDD ERIC P , MANICKAM SWAMINATHAN
IPC分类号： H05K13/04
CPC分类号： H05K13/08
摘要： An electronics assembly apparatus (10, 201) with improved pick evaluation is provided. The apparatus (10, 201) includes a placement head (206) having at least one nozzle (208, 210, 212) for releasably picking up and holding a component (304) . A robotic system is provided for generating relative movement between the placement head (206) and a workpiece (203) , such as a circuit board. An image acquisition system (300) is disposed to obtain at least one before -pick image of a component pick up location (16) and at least one after-pick image of the component pick up location (16) . The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要翻译：提供了具有改进的拾取评估的电子组装装置（10,201）。装置（10,201）包括具有至少一个喷嘴（208,210,212）的放置头（206），用于可释放地拾取和保持部件（304）。提供了一种机器人系统，用于在放置头（206）和诸如电路板的工件（203）之间产生相对运动。设置图像采集系统（300）以获得组件拾取位置（16）的至少一个先前图像和组件拾取位置（16）的至少一个后拾取图像。拾取后图像包含多个图像部分，每个图像部分从不同的观点看待拾取位置，而拾取后图像包含多个图像部分，每个图像部分都可以看到拾取位置，从不同的角度看待位置。

5. 发明申请

WO2006125102A1 METHOD AND APPARATUS FOR EVALUATING A COMPONENT PICK ACTION IN AN ELECTRONICS ASSEMBLY MACHINE 审中-公开
标题翻译：用于评估电子组装机中组分捕捉作用的方法和装置
公开(公告)号：WO2006125102A1
公开(公告)日：2006-11-23
申请号：PCT/US2006/019281
申请日：2006-05-18
申请人： CYBEROPTICS CORPORATION , CASE, Steven, K. , KONICEK, John, P. , DUQUETTE, David, W. , RUDD, Eric, P. , MANICKAM, Swaminathan
发明人： CASE, Steven, K. , KONICEK, John, P. , DUQUETTE, David, W. , RUDD, Eric, P. , MANICKAM, Swaminathan
IPC分类号： H05K13/04
CPC分类号： H05K13/08
摘要： An electronics assembly apparatus (10, 201) with improved pick evaluation is provided. The apparatus (10, 201) includes a placement head (206) having at least one nozzle (208, 210, 212) for releasably picking up and holding a component (304) . A robotic system is provided for generating relative movement between the placement head (206) and a workpiece (203) , such as a circuit board. An image acquisition system (300) is disposed to obtain at least one before -pick image of a component pick up location (16) and at least one after-pick image of the component pick up location (16) . The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要翻译：提供了具有改进的拾取评估的电子组装装置（10,201）。装置（10,201）包括具有至少一个喷嘴（208,210,212）的放置头（206），用于可释放地拾取和保持部件（304）。提供了一种机器人系统，用于在放置头（206）和诸如电路板的工件（203）之间产生相对运动。设置图像采集系统（300）以获得组件拾取位置（16）的至少一个先前图像和组件拾取位置（16）的至少一个后拾取图像。拾取后图像包含多个图像部分，每个图像部分从不同的观点看待拾取位置，而拾取后图像包含多个图像部分，每个图像部分都可以看到拾取位置，从不同的角度看待位置。

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