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1. 发明申请

WO2008036701A2 HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR 审中-公开
标题翻译：耐高温固体压力传感器
公开(公告)号：WO2008036701A2
公开(公告)日：2008-03-27
申请号：PCT/US2007078831
申请日：2007-09-19
申请人： ROSEMOUNT AEROSPACE INC , GUO SHUWEN , ERIKSEN ODD HARALD STEEN , POTASEK DAVID P
发明人： GUO SHUWEN , ERIKSEN ODD HARALD STEEN , POTASEK DAVID P
CPC分类号： C23C14/021 , C23C14/022 , C23C14/025 , C23C14/0682 , C23C14/5806 , C23C14/5846 , C23C14/5873 , G01L9/0042 , G01L19/0061 , G01L19/0609 , G01L19/147 , H01L2224/48472
摘要： A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.
摘要翻译：一种恶劣环境换能器，包括具有第一表面和第二表面的基底，其中第二表面与环境连通。换能器包括位于基板上的用于测量与环境有关的参数的装置层传感器装置。传感器装置包括厚度小于约0.5微米的单晶半导体材料。换能器还包括位于基板上并与传感器装置电连通的输出触点。换能器包括具有内部封装空间和用于与环境通信的端口的封装。该封装件在内部封装空间中容纳衬底，使得衬底的第一表面基本上与环境隔离，并且衬底的第二表面基本上通过端口暴露于环境中。换能器还包括耦合到封装件的连接部件和将连接部件和输出触头电连接的导线，使得可以传送传感器装置的输出。导线的外表面基本上是铂，并且输出触点和连接部件中的至少一个的外表面基本上是铂。

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