专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2023033433A1 ELECTRO-CONDUCTIVE CONTACT PIN AND VERTICAL PROBE CARD HAVING SAME 审中-公开
公开(公告)号：WO2023033433A1
公开(公告)日：2023-03-09
申请号：PCT/KR2022/012563
申请日：2022-08-23
申请人： POINT ENGINEERING CO., LTD.
发明人： AHN, Bum Mo , PARK, Seung Ho , HONG, Chang Hee
IPC分类号： G01R1/073 , G01R1/067
摘要： Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.

2. 发明申请

WO2023033372A1 VERTICAL PROBE CARD 审中-公开
公开(公告)号：WO2023033372A1
公开(公告)日：2023-03-09
申请号：PCT/KR2022/011156
申请日：2022-07-29
申请人： POINT ENGINEERING CO., LTD.
发明人： AHN, Bum Mo , PARK, Seung Ho , BYUN, Sung Hyun
IPC分类号： G01R1/073 , G01R1/067
摘要： Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.

3. 发明申请

WO2023018043A1 MICRO-BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMICONDUCTOR PACKAGE HAVING SAME, MULTI-STACKED SEMICONDUCTOR DEVICE HAVING SAME, AND DISPLAY HAVING SAME 审中-公开
公开(公告)号：WO2023018043A1
公开(公告)日：2023-02-16
申请号：PCT/KR2022/010482
申请日：2022-07-19
申请人： POINT ENGINEERING CO., LTD.
发明人： AHN, Bum Mo , PARK, Seung Ho , BYUN, Sung Hyun
IPC分类号： H01L23/00 , H01L23/498
摘要： Proposed are a micro-bump, an interposer for electrical connection having the same, a semiconductor package having the same, a multi-stacked semiconductor device having the same, and a display having the same that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part.

4. 发明申请

WO2022124785A1 MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHOD USING SAME 审中-公开
公开(公告)号：WO2022124785A1
公开(公告)日：2022-06-16
申请号：PCT/KR2021/018518
申请日：2021-12-08
申请人： POINT ENGINEERING CO., LTD. [KR]/[KR]
发明人： AHN, Bum Mo , PARK, Seung Ho , LEE, Jeong Hyuk
IPC分类号： H01L33/20 , H01L23/00 , H01L21/67 , H01L21/68
摘要： A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.

5. 发明申请

WO2011122847A8 OPTICAL DEVICE MODULE AND METHOD FOR FABRICATING SAME 审中-公开
标题翻译：光学装置模块及其制造方法
公开(公告)号：WO2011122847A8
公开(公告)日：2014-03-27
申请号：PCT/KR2011002178
申请日：2011-03-30
申请人： POINT ENGINEERING CO LTD , NAM KI-MYUNG , SONG TAE-HWAN , JUN YOUNG-CHUL
发明人： NAM KI-MYUNG , SONG TAE-HWAN , JUN YOUNG-CHUL
IPC分类号： H01L33/62
CPC分类号： H05K1/05 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48227 , H05K2201/09663 , H05K2201/10106 , H05K2203/0315 , H01L2224/48091 , H01L2924/00014
摘要： The present invention relates to an optical device module and to a method for fabricating same, which enable the production of a desired circuit configuration by forming at least one optical device package on a module substrate, wherein the optical device module is capable of easily dissipating heat. A disclosed optical device module according to one example of the present invention comprises at least one optical device package and a module substrate. The optical device package comprises: an optical device substrate including a first optical device region, a second optical device region separated from the first optical device region, and an optical device insulation layer formed between the first module region and the second module region; and an optical device formed at the upper portion of the optical device substrate. The module substrate is formed at the lower portion of the optical device package and comprises: a first module region; a second module region separated from the first module region; and a first module insulation layer formed between the first module region and the second module region. The first module region and the second module region are electrically connected to the first optical device region and the second optical device region, respectively, and are made of metal.
摘要翻译：光学器件模块及其制造方法技术领域本发明涉及一种光学器件模块及其制造方法，其能够通过在模块衬底上形成至少一个光学器件封装来制造所需的电路结构，其中光学器件模块能够容易地散热。根据本发明的一个示例的公开的光学器件模块包括至少一个光学器件封装和模块衬底。光学器件封装包括：光学器件衬底，包括第一光学器件区域，与第一光学器件区域分离的第二光学器件区域以及形成在第一模块区域和第二模块区域之间的光学器件绝缘层; 以及形成在光学器件衬底的上部的光学器件。模块基板形成在光学器件封装的下部，并包括：第一模块区域; 与所述第一模块区域分离的第二模块区域; 以及形成在所述第一模块区域和所述第二模块区域之间的第一模块绝缘层。第一模块区域和第二模块区域分别电连接到第一光学器件区域和第二光学器件区域，并且由金属制成。

6. 发明申请

WO2007074971A1 METHOD AND APPARATUS FOR FABRICATING POLYCRYSTALLINE SILICON FILM USING TRANSPARENT SUBSTRATE 审中-公开
标题翻译：使用透明基板制造多晶硅薄膜的方法和装置
公开(公告)号：WO2007074971A1
公开(公告)日：2007-07-05
申请号：PCT/KR2006/004768
申请日：2006-11-14
申请人： POINT ENGINEERING CO., LTD. , AHN, Bum Mo
发明人： AHN, Bum Mo
IPC分类号： H01L29/786
CPC分类号： H01L27/1259 , H01L27/1214 , H01L29/78603 , H01L29/78675
摘要： Provided is a method and apparatus for fabricating a polycrystalline silicon film using a transparent substrate. The method includes forming a light absorption layer on a surface of the transparent substrate; and heating the light absorption layer using irradiation of Rapid Thermal Process (RTP) light source, while depositing the polycrystalline silicon film on the light absorption layer.
摘要翻译：提供了使用透明基板制造多晶硅膜的方法和装置。该方法包括在透明基板的表面上形成光吸收层; 以及使用快速热处理（RTP）光源的照射加热光吸收层，同时将多晶硅膜沉积在光吸收层上。

7. 发明申请

WO2022265325A1 SUPPORTING PLATE FOR ELECTRICAL TEST SOCKET, SOCKET PIN FOR ELECTRICAL TEST SOCKET, AND ELECTRICAL TEST SOCKET 审中-公开
公开(公告)号：WO2022265325A1
公开(公告)日：2022-12-22
申请号：PCT/KR2022/008312
申请日：2022-06-13
申请人： POINT ENGINEERING CO., LTD.
发明人： AHN, Bum Mo , PARK, Seung Ho , HONG, Chang Hee
IPC分类号： G01R1/04 , G01R1/067 , G01R31/28
摘要： Proposed are a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket that are advantageous for testing high-frequency characteristics of a semiconductor package and are capable of coping with a narrower pitch between external terminals of the semiconductor package.

8. 发明申请

WO2021215786A1 PROBE CARD 审中-公开
公开(公告)号：WO2021215786A1
公开(公告)日：2021-10-28
申请号：PCT/KR2021/004936
申请日：2021-04-20
申请人： POINT ENGINEERING CO., LTD.
发明人： AHN, Bum Mo , PARK, Seung Ho , BYUN, Sung Hyun
IPC分类号： G01R1/073 , G01R31/28
摘要： Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

9. 发明申请

WO2011122846A3 OPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：WO2011122846A3
公开(公告)日：2012-01-12
申请号：PCT/KR2011002177
申请日：2011-03-30
申请人： POINT ENGINEERING CO LTD , NAM KI-MYUNG , SONG TAE-HWAN , JUN YOUNG-CHUL
发明人： NAM KI-MYUNG , SONG TAE-HWAN , JUN YOUNG-CHUL
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , H01L24/73 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H05K1/05 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to an optical device and to a method for manufacturing same. The technical aim of the invention is to easily dissipate heat generated by a light-emitting chip, and configure a surface light-emitting body having a single or a plurality of light-emitting chips arranged in series, in parallel, or in series and in parallel on the surface light-emitting body, without requiring a separate wiring layer. To achieve said aim, an optical device of the present invention comprises: a substrate; a plurality of light-emitting chips disposed on the substrate; a plurality of conductive wires electrically connecting the substrate and the light-emitting chips, such that the plurality of light-emitting chips are connected to the substrate in series, in parallel, or in series and in parallel; and a protective layer covering the light-emitting chips and the conductive wires on the substrate.
摘要翻译：光学装置及其制造方法技术领域本发明涉及光学装置及其制造方法。本发明的技术目的是容易地散发由发光芯片产生的热量，并且构成具有单个或多个发光芯片的表面发光体，其串联，并联或串联布置平行于表面发光体，而不需要单独的布线层。为了实现上述目的，本发明的光学装置包括：基板; 设置在所述基板上的多个发光芯片; 电连接所述基板和所述发光芯片的多个导线，使得所述多个发光芯片串联连接到所述基板，并联或并联连接; 以及覆盖基板上的发光芯片和导线的保护层。

10. 发明申请

WO2011034304A3 SUBSTRATE FOR AN OPTICAL DEVICE, OPTICAL DEVICE, AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：用于光学装置的基板，光学装置及用于制造该装置的方法
公开(公告)号：WO2011034304A3
公开(公告)日：2011-05-19
申请号：PCT/KR2010006037
申请日：2010-09-06
申请人： POINT ENGINEERING CO LTD , AHN BUM MO , NAM KI MYUNG , SONG TAE HWAN
发明人： AHN BUM MO , NAM KI MYUNG , SONG TAE HWAN
IPC分类号： H01L33/64
CPC分类号： H01L33/62 , H01L24/73 , H01L33/486 , H01L33/64 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2933/0066 , H05K1/05 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a substrate for an optical device, which can easily dissipate heat from the optical device, to an optical device, and to a method for manufacturing same. According to one embodiment, a substrate for an optical device is disclosed, comprising: a metal substrate having an upper surface on which the optical device is mounted; a pair of insulating layers formed on the metal substrate and spaced apart from each other with the optical device interposed therebetween; and a pair of electrode layers formed on the insulating layers.
摘要翻译：光学装置用基板及光学装置及其制造方法技术领域本发明涉及能够容易地从光学装置散热的光学装置用基板，光学装置及其制造方法。根据一个实施例，公开了一种用于光学装置的基板，包括：金属基板，具有上表面，光学装置安装在该上表面上; 一对绝缘层，形成在所述金属基板上并且隔着所述光学器件而相互隔开; 以及形成在绝缘层上的一对电极层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式