会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • METHODS FOR MAKING SPUTTERING TARGETS
    • 制造喷射目标的方法
    • WO2008060917A3
    • 2009-04-02
    • PCT/US2007083903
    • 2007-11-07
    • HONEYWELL INT INCKARDOKUS JANINEWERNER HORTSTROTHERS SUSAN DHAUSMAN CHRISTIE JHUBERT KEVIN TMORALES DIANEPAYTON MICHAEL D
    • KARDOKUS JANINEWERNER HORTSTROTHERS SUSAN DHAUSMAN CHRISTIE JHUBERT KEVIN TMORALES DIANEPAYTON MICHAEL D
    • C23C14/34
    • C23C14/3414
    • Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.
    • 本文描述了具有减少的烧伤时间的溅射靶,其包括:a)具有平均晶粒尺寸的机加工的表面材料,以及b)具有平均晶粒尺寸的芯材,其中机加工表面材料具有平均 表面粗糙度(Ra)等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 本文描述了具有减少的老化时间的溅射靶,其包括:表面材料和芯材料,其中至少一个表面材料或芯材料包含相对无带的结晶取向。 此外,生产具有减少的老化时间的溅射靶的方法包括:提供具有至少一些残余表面损伤的表面材料,提供芯材料,将表面材料耦合到芯材料,以及将表面材料机加工成 平均表面粗糙度(Ra)等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 此外,生产具有减少的烧成时间的溅射靶的方法包括:提供与芯材组合的表面材料,其中表面材料具有至少一些残余表面损伤并将表面材料机加工成平均表面粗糙度(Ra )等于或小于表面材料或芯材料中的至少一种的平均晶粒尺寸。
    • 6. 发明申请
    • NOVEL MANUFACTURING DESIGN AND PROCESSING METHODS AND APPARATUS FOR SPUTTERING TARGETS
    • 新型溅射靶材的制造设计和加工方法及装置
    • WO2008060917A9
    • 2008-07-31
    • PCT/US2007083903
    • 2007-11-07
    • HONEYWELL INT INCKARDOKUS JANINEWERNER HORTSTROTHERS SUSAN DHAUSMAN CHRISTIE JHUBERT KEVIN TMORALES DIANEPAYTON MICHAEL D
    • KARDOKUS JANINEWERNER HORTSTROTHERS SUSAN DHAUSMAN CHRISTIE JHUBERT KEVIN TMORALES DIANEPAYTON MICHAEL D
    • C23C14/34
    • C23C14/3414
    • Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.
    • 本文描述了具有减少的老化时间的溅射靶,其包括:a)具有平均晶粒尺寸的机器表面材料,和b)具有平均晶粒尺寸的芯材,其中机器表面材料具有平均粒度 表面粗糙度(Ra)等于或小于表面材料或芯材中的至少一种的平均粒度。 本文描述了具有减少的老化时间的溅射靶,其包括:表面材料和芯材料,其中表面材料或芯材料中的至少一种包含相对无带结晶学取向。 此外,生产具有减少的老化时间的溅射靶的方法包括:提供具有至少一些残余表面损伤的表面材料,提供芯材,将表面材料结合到芯材,以及将表面材料机加工成 平均表面粗糙度(Ra)等于或小于表面材料或芯材中的至少一种的平均粒度。 另外,生产具有减少的老化时间的溅射靶的方法包括:提供与芯材相结合的表面材料,其中表面材料具有至少一些残余表面损伤并且将表面材料机加工至平均表面粗糙度(Ra )等于或小于表面材料或芯材中的至少一种的平均粒度。
    • 8. 发明申请
    • NOVEL MANUFACTURING DESIGN AND PROCESSING METHODS AND APPARATUS FOR SPUTTERING TARGETS
    • 新型制造设计与处理方法及设备用于溅射目标
    • WO2008060917A2
    • 2008-05-22
    • PCT/US2007/083903
    • 2007-11-07
    • HONEYWELL INTERNATIONAL INC.KARDOKUS, JanineWERNER, HortSTROTHERS, Susan D.HAUSMAN, Christie J.HUBERT, Kevin T.MORALES, DianePAYTON, Michael D.
    • KARDOKUS, JanineWERNER, HortSTROTHERS, Susan D.HAUSMAN, Christie J.HUBERT, Kevin T.MORALES, DianePAYTON, Michael D.
    • C23C14/34
    • C23C14/3414
    • Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.
    • 本文描述了具有减少的老化时间的溅射靶,其包括:a)具有平均晶粒尺寸的机加工的表面材料,以及b)具有平均晶粒尺寸的芯材,其中机加工表面材料具有平均 表面粗糙度(Ra)等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 本文描述了具有减少的老化时间的溅射靶,其包括:表面材料和芯材料,其中至少一个表面材料或芯材料包含相对无带的结晶取向。 此外,生产具有减少的老化时间的溅射靶的方法包括:提供具有至少一些残余表面损伤的表面材料,提供芯材料,将表面材料耦合到芯材料,以及将表面材料机加工成 平均表面粗糙度(Ra)等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 此外,生产具有减少的烧成时间的溅射靶的方法包括:提供与芯材组合的表面材料,其中表面材料具有至少一些残余表面损伤并将表面材料机加工成平均表面粗糙度(Ra )等于或小于表面材料或芯材料中的至少一种的平均晶粒尺寸。