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    • 1. 发明申请
    • ICE MAKER AND ICE TRAY THEREOF
    • 制冰机和冰箱
    • WO2008056957A2
    • 2008-05-15
    • PCT/KR2007005646
    • 2007-11-09
    • LG ELECTRONICS INCPARK JIN SUNGLEE DONG HOONLEE WOOK YONG
    • PARK JIN SUNGLEE DONG HOONLEE WOOK YONG
    • F25C1/10
    • F25C5/06F25C2400/02
    • An ice tray having an enhanced thermal conductivity to achieve an enhancement in ice- making speed, a reduction in ice-making time, and an increase in the amount of ice produced within a given time is disclosed. An ice maker equipped with the ice tray is also disclosed. The ice tray includes a body including a plurality of cavities each defining a space to produce ice. The body is made of a thermally non-conductive material and has a predetermined elasticity such that the body can be twisted and then recovered. The ice tray also includes a thermal conductor partially or completely formed on at least one of inner and outer surfaces of the body, to achieve an enhancement in thermal conductivity. The thermal conductor has a structure including at least one layer.
    • 公开了一种具有增强的导热性以提高制冰速度,降低制冰时间以及在给定时间内产生的冰量增加的冰盘。 还披露了装有冰盘的制冰机。 冰托盘包括一个主体,该主体包括多个空腔,每个空腔限定产生冰的空间。 身体由不导热材料制成,并具有预定的弹性,使得身体可以扭曲然后被回收。 冰托盘还包括部分地或完全地形成在主体的内表面和外表面中的至少一个上的热导体,以实现导热性的增强。 热导体具有包括至少一层的结构。
    • 7. 发明申请
    • METHOD, SYSTEM AND A COMPUTER-READABLE RECORDING MEDIUM FOR CONTROLLING STORAGE OF DATA IN MEMORY AND SYSTEM THEREFOR
    • 方法,系统和用于控制存储器及其系统中的数据存储的计算机可读记录介质
    • WO2005081647A3
    • 2005-10-20
    • PCT/KR2005000572
    • 2005-03-02
    • HISMARTECH CO LTDKOO KYUNG-BONPARK JIN-SUNGKWON BEUM-JOONPARK JOO-CHUL
    • KOO KYUNG-BONPARK JIN-SUNGKWON BEUM-JOONPARK JOO-CHUL
    • G06F12/00
    • G06F12/00
    • A memory control system used for storage of data and a control method thereof are provided. The memory control system includes a memory unit including a plurality of memory cells storing data, a recording counter unit counting recording number for each memory cell of the memory unit, and a central processing unit (CPU). The CPU selects a first cell for the data recording operation when data recording operation is requested. The CPU determines whether a recording number of the selected first cell reaches a predetermined recordable threshold value. When the recording number of the selected first cell does not reach the recordable threshold value, the CPU performs the requested data recording operation to the selected first cell. When the recording number of the selected first cell reaches the recordable threshold value, the CPU selects a second cell different from the first cell and determining whether a recording number of the second cell reaches the recordable threshold value, and performs the requested data recording operation to the second cell when the recording number of the second cell does not reach the recordable threshold value.
    • 提供了用于存储数据的存储器控​​制系统及其控制方法。 存储器控制系统包括存储单元,存储单元包括存储数据的多个存储单元,对存储单元的每个存储单元计数记录数的记录计数单元,以及中央处理单元(CPU)。 当请求数据记录操作时,CPU选择用于数据记录操作的第一单元。 CPU确定所选择的第一单元的记录编号是否达到预定的可记录阈值。 当所选择的第一单元的记录编号未达到可记录阈值时,CPU对所选择的第一单元执行所请求的数据记录操作。 当所选择的第一单元的记录号达到可记录阈值时,CPU选择与第一单元不同的第二单元,并且确定第二单元的记录编号是否达到可记录阈值,并且执行所请求的数据记录操作 第二单元,当第二单元的记录编号未达到可记录阈值时。
    • 10. 发明申请
    • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    • 发光二极管封装及制造发光二极管封装的方法
    • WO2013081328A1
    • 2013-06-06
    • PCT/KR2012/009904
    • 2012-11-22
    • PARK, Jin Sung
    • PARK, Jin SungYOO, Ho SangKWON, Sang BumLEE, Kum Jung
    • H01L25/075H01L33/38H01L33/48H01L33/62
    • H01L33/20H01L24/24H01L33/0079H01L33/486H01L33/62H01L2924/01322H01L2924/12041H01L2933/0066H01L2924/00
    • A light emitting diode (LED) package having two vias (101, 102) and one epitaxial (epi) via (102) for electrical connections includes a carrier substrate (100), an LED chip, an epi layer (200), a bonding layer (110), two electrodes (210, 230), two conductors through the vias, two pads (250, 260) on the bottom of the carrier substrate and a passivation layer (240). The two vias are formed through the carrier substrate. The epi layer via is formed through the epi layer and the first electrode. Another LED package having a via and an epi layer via for electrical connections includes sub strate, an LED chip, an epi layer, a bonding layer, two electrodes, two conductors the via, two passivation layers (241, 242) for electrical insulation and two pads on the bottom of the carrier substrate. All electrical connections are formed through the single via and the epi layer via. The two conductors are isolated by the second passivation layer. A
    • 具有用于电连接的两个通孔(101,102)和一个外延(epi)通孔(102)的发光二极管(LED)封装包括载体衬底(100),LED芯片,外延层(200),接合 层(110),两个电极(210,230),穿过通孔的两个导体,在载体衬底的底部上的两个焊盘(250,260)和钝化层(240)。 通过载体基板形成两个通孔。 外延层通孔通过外延层和第一电极形成。 具有用于电连接的通孔和外延层通孔的另一LED封装包括子步骤,LED芯片,外延层,结合层,两个电极,通孔的两个导体,用于电绝缘的两个钝化层(241,242)和 载体基底底部有两个垫。 所有电气连接通过单个通孔和外延层通孔形成。 两个导体被第二钝化层隔离。 一个