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1. 发明申请

WO2010002724A3 PERIPHERALLY ENGAGING ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 审中-公开
公开(公告)号：WO2010002724A3
公开(公告)日：2010-01-07
申请号：PCT/US2009/048797
申请日：2009-06-26
申请人： LAM RESEARCH CORPORATION , AUGUSTINO, Jason , AVOYAN, Armen , FANG, Yan , OUTKA, Duane , SHIH, Hong , WHITTEN, Stephen
发明人： AUGUSTINO, Jason , AVOYAN, Armen , FANG, Yan , OUTKA, Duane , SHIH, Hong , WHITTEN, Stephen
IPC分类号： H05H1/34
摘要： In accordance with one embodiment of the present disclosure, an assembly is provided comprising a multi-component electrode and a peripherally engaging electrode carrier. The peripherally engaging electrode carrier comprises a carrier frame and a plurality of reciprocating electrode supports. The multi-component electrode is positioned in the electrode accommodating aperture of the carrier frame. The backing plate of the electrode comprises a plurality of mounting recesses formed about its periphery. The reciprocating electrode supports can be reciprocated into and out of the mounting recesses. Additional embodiments of broader and narrower scope are contemplated.

2. 发明申请

WO2010002724A2 PERIPHERALLY ENGAGING ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 审中-公开
标题翻译：外围接触电极载体和组装体
公开(公告)号：WO2010002724A2
公开(公告)日：2010-01-07
申请号：PCT/US2009048797
申请日：2009-06-26
申请人： LAM RES CORP , AUGUSTINO JASON , AVOYAN ARMEN , FANG YAN , OUTKA DUANE , SHIH HONG , WHITTEN STEPHEN
发明人： AUGUSTINO JASON , AVOYAN ARMEN , FANG YAN , OUTKA DUANE , SHIH HONG , WHITTEN STEPHEN
IPC分类号： H05H1/34
CPC分类号： H01J37/32541 , H01J37/32009 , H01J37/32605 , H01L21/67069
摘要： In accordance with one embodiment of the present disclosure, an assembly is provided comprising a multi-component electrode and a peripherally engaging electrode carrier. The peripherally engaging electrode carrier comprises a carrier frame and a plurality of reciprocating electrode supports. The multi-component electrode is positioned in the electrode accommodating aperture of the carrier frame. The backing plate of the electrode comprises a plurality of mounting recesses formed about its periphery. The reciprocating electrode supports can be reciprocated into and out of the mounting recesses. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：根据本公开的一个实施例，提供了包括多组分电极和外围接合电极载体的组件。外围接合电极载体包括载体框架和多个往复电极支撑件。多组分电极位于载体框架的电极容纳孔中。电极的背板包括围绕其周边形成的多个安装凹部。往复式电极支撑件可以往复运动进入和离开安装凹槽。考虑到更广泛和更窄范围的另外的实施例。

3. 发明申请

WO2009048702A1 CLEANING FIXTURES AND METHODS OF CLEANING ELECTRODE ASSEMBLY PLENUMS 审中-公开
标题翻译：清洁装置和清洁电极组件的方法
公开(公告)号：WO2009048702A1
公开(公告)日：2009-04-16
申请号：PCT/US2008/075675
申请日：2008-09-09
申请人： LAM RESEARCH CORPORATION , OUTKA, Duane , DENTY, Bill , DHINDSA, Rajinder
发明人： OUTKA, Duane , DENTY, Bill , DHINDSA, Rajinder
IPC分类号： H01L21/3065 , H01L21/302 , C23C16/50
CPC分类号： B08B3/04
摘要： According to one embodiment of the present invention, a method of cleaning one or more fluid plenums of an electrode assembly is provided. According to the method, a plurality of fluid ports in communication with the fluid plenum are isolated and differentiated into respective sets of plenum input ports and plenum output ports. The input and output ports are engaged with respective cleaning fluid couplings. A cleaning fluid is directed through the fluid plenum by creating a fluid pressure differential ΔP = P IN - P ouτ across the plenum input and output ports. The pressure differential ΔP is large enough to force cleaning fluid from the cleaning fluid supply duct to the cleaning fluid waste duct through the fluid plenum. Additional embodiments are disclosed and claimed.
摘要翻译：根据本发明的一个实施例，提供一种清洁电极组件的一个或多个流体增压室的方法。根据该方法，与流体增压室连通的多个流体端口被隔离并分成相应的一组增压室输入端口和增压室输出端口。输入和输出端口与相应的清洁液体接头接合。清洁流体通过在整流室输入和输出端口上产生流体压差ΔP= PIN-Pout而引导通过流体通风室。压力差ΔP足够大以将清洁流体从清洁流体供应管道通过流体通风室强制到清洁流体废物管道。公开并要求保护附加实施例。

4. 发明申请

WO2005123282A3 METHODS FOR WET CLEANING QUARTZ SURFACES OF COMPONENTS FOR PLASMA PROCESSING CHAMBERS 审中-公开
公开(公告)号：WO2005123282A3
公开(公告)日：2005-12-29
申请号：PCT/US2005/019466
申请日：2005-06-03
申请人： LAM RESEARCH CORPORATION , SHIH, Hong , HUANG, Tuochuan , OUTKA, Duane , KUO, Jack , LIU, Shenjian , MOREL, Bruno , CHEN, Anthony
发明人： SHIH, Hong , HUANG, Tuochuan , OUTKA, Duane , KUO, Jack , LIU, Shenjian , MOREL, Bruno , CHEN, Anthony
IPC分类号： C23G1/02 , B08B3/00 , B08B3/04 , B08B3/14
摘要： Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.

5. 发明申请

WO2012061362A3 ELECTRODE SECURING PLATENS AND ELECTRODE POLISHING ASSEMBLIES INCORPORATING THE SAME 审中-公开
标题翻译：电极固定平板和电极抛光组件并入其中
公开(公告)号：WO2012061362A3
公开(公告)日：2012-09-07
申请号：PCT/US2011058745
申请日：2011-11-01
申请人： LAM RES CORP , LA CROIX CLIFF , AVOYAN ARMEN , OUTKA DUANE , ZHOU CATHERINE , SHIH HONG
发明人： LA CROIX CLIFF , AVOYAN ARMEN , OUTKA DUANE , ZHOU CATHERINE , SHIH HONG
IPC分类号： H01L21/304
CPC分类号： B24B37/30 , B24B41/061
摘要： In one embodiment, an electrode polishing assembly may include an electrode securing platen, a plurality of electrode locating fasteners, and an electrode. Each of the electrode locating fasteners may include an electrode spacing shoulder, a variance cancelling shoulder extending from the electrode spacing shoulder, a threaded platen clamping portion extending from the variance cancelling shoulder, and a threaded nut that engages the threaded platen clamping portion. The electrode locating fasteners clamp the electrode securing platen between the threaded nut and the electrode spacing shoulder. The variance cancelling shoulder is at least partially within one of a plurality of variance cancelling passages of the electrode securing platen. A minimum position stack-up is equal to a minimum passage size minus a maximum shoulder size. A maximum position stack-up is equal to a maximum passage size minus a minimum shoulder size. The maximum position stack-up is greater than the minimum position stack-up.
摘要翻译：在一个实施例中，电极抛光组件可以包括电极固定台板，多个电极定位紧固件和电极。每个电极定位紧固件可以包括电极间隔肩部，从电极间隔肩部延伸的变化抵消肩部，从变化抵消肩部延伸的螺纹压板夹紧部分以及与螺纹压板夹紧部分接合的螺纹螺母。电极定位紧固件将电极固定板夹紧在螺母和电极间隔肩之间。方差消除肩部至少部分在电极固定台板的多个方差消除通道中的一个之内。最小位置叠加等于最小通道尺寸减去最大肩部尺寸。最大位置叠加等于最大通道尺寸减去最小肩部尺寸。最大位置叠加大于最小位置叠加。

6. 发明申请

WO2010002722A3 BACKSIDE MOUNTED ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 审中-公开
公开(公告)号：WO2010002722A3
公开(公告)日：2010-01-07
申请号：PCT/US2009/048794
申请日：2009-06-26
申请人： LAM RESEARCH CORPORATION , AUGUSTINO, Jason , AVOYAN, Armen , FANG, Yan , OUTKA, Duane , SHIH, Hong , WHITTEN, Stephen
发明人： AUGUSTINO, Jason , AVOYAN, Armen , FANG, Yan , OUTKA, Duane , SHIH, Hong , WHITTEN, Stephen
IPC分类号： H05H1/38 , H05H1/34 , H05H1/24
摘要： A carrier assembly is provided comprising a backside mounted electrode carrier and electrode mounting hardware. The backside mounted electrode carrier comprises an electrode accommodating aperture, which in turn comprises a sidewall structure that is configured to limit lateral movement of an electrode positioned in the aperture. The electrode accommodating aperture further comprises one or more sidewall projections that support the weight of an electrode positioned in the aperture. The electrode mounting hardware is configured to engage an electrode positioned in the electrode accommodating aperture from the backside of the carrier and urge the electrode against the sidewall projections so as to limit axial movement of the electrode in the electrode accommodating aperture. Additional embodiments of broader and narrower scope are contemplated.

7. 发明申请

WO2008121290A1 CLEANING OF BONDED SILICON ELECTRODES 审中-公开
标题翻译：粘结硅电极的清洁
公开(公告)号：WO2008121290A1
公开(公告)日：2008-10-09
申请号：PCT/US2008/003972
申请日：2008-03-27
申请人： LAM RESEARCH CORPORATION , OUTKA, Duane , AUGUSTINO, Jason , AVOYAN, Armen , WHITTEN, Stephen , SHIH, Hong , FANG, Yan
发明人： OUTKA, Duane , AUGUSTINO, Jason , AVOYAN, Armen , WHITTEN, Stephen , SHIH, Hong , FANG, Yan
IPC分类号： H01L21/306
CPC分类号： B08B3/04 , H01J37/32862
摘要： Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.
摘要翻译：清洁等离子体处理室部件的方法包括将部件的表面与清洁溶液接触，同时避免清洁溶液损坏其它表面或部件区域。要清洁的示例性等离子体处理室部件是具有硅构件的弹性体接合电极组件，其具有等离子体暴露的硅表面，背衬构件和在硅表面和背衬构件之间的弹性体接合材料。

8. 发明申请

WO2012061362A2 ELECTRODE SECURING PLATENS AND ELECTRODE POLISHING ASSEMBLIES INCORPORATING THE SAME 审中-公开
标题翻译：电极安装板和电极抛光组件
公开(公告)号：WO2012061362A2
公开(公告)日：2012-05-10
申请号：PCT/US2011/058745
申请日：2011-11-01
申请人： LAM RESEARCH CORPORATION , LA CROIX, Cliff , AVOYAN, Armen , OUTKA, Duane , ZHOU, Catherine , SHIH, Hong
发明人： LA CROIX, Cliff , AVOYAN, Armen , OUTKA, Duane , ZHOU, Catherine , SHIH, Hong
IPC分类号： H01L21/304
CPC分类号： B24B37/30 , B24B41/061
摘要： In one embodiment, an electrode polishing assembly may include an electrode securing platen, a plurality of electrode locating fasteners, and an electrode. Each of the electrode locating fasteners may include an electrode spacing shoulder, a variance cancelling shoulder extending from the electrode spacing shoulder, a threaded platen clamping portion extending from the variance cancelling shoulder, and a threaded nut that engages the threaded platen clamping portion. The electrode locating fasteners clamp the electrode securing platen between the threaded nut and the electrode spacing shoulder. The variance cancelling shoulder is at least partially within one of a plurality of variance cancelling passages of the electrode securing platen. A minimum position stack-up is equal to a minimum passage size minus a maximum shoulder size. A maximum position stack-up is equal to a maximum passage size minus a minimum shoulder size. The maximum position stack-up is greater than the minimum position stack-up.
摘要翻译：在一个实施例中，电极抛光组件可以包括电极固定压板，多个电极定位紧固件和电极。每个电极定位紧固件可以包括电极间隔肩部，从电极间隔肩部延伸的方差消除肩部，从变形消除肩部延伸的螺纹压板夹持部分和与螺纹压板夹持部分接合的螺纹螺母。电极定位紧固件将电极固定压板夹在螺母和电极间隔肩之间。方差消除肩部至少部分地在电极固定台板的多个方差消除通路之一内。最小位置叠加等于最小通道尺寸减去最大肩部尺寸。最大位置叠加等于最大通道尺寸减去最小肩部尺寸。最大位置叠加大于最小位置叠加。

9. 发明申请

WO2011133207A2 A COATING METHOD FOR GAS DELIVERY SYSTEM 审中-公开
标题翻译：一种气体输送系统的涂装方法
公开(公告)号：WO2011133207A2
公开(公告)日：2011-10-27
申请号：PCT/US2011/000683
申请日：2011-04-15
申请人： LAM RESEARCH CORPORATION , KENWORTHY, Ian , OUTKA, Duane , HAO, Fangli , SHARPLESS, Leonard , DU, Yijun
发明人： KENWORTHY, Ian , OUTKA, Duane , HAO, Fangli , SHARPLESS, Leonard , DU, Yijun
IPC分类号： C23C16/50 , H01L21/205 , H05H1/46
CPC分类号： F17D5/005 , B05D1/30 , B05D7/222 , F17D1/04 , H01J37/3244 , H01J37/32495 , H01J2237/3341 , H01L21/67069 , Y10T137/8593
摘要： A method of coating the inner surfaces of gas passages of a gas delivery system for a plasma process system such as a plasma etching system includes (a) flowing a fluidic precursor of a corrosion-resistant material through the gas passages and depositing a layer of the fluidic precursor to completely coat the inner surfaces of the gas passages; (b) removing excess fluidic precursor from the inner surfaces; (c) curing the deposited layer of the fluidic precursor to form a corrosion-resistant material coating.
摘要翻译：涂覆等离子体处理系统例如等离子体蚀刻系统的气体输送系统的气体通道的内表面的方法包括（a）使耐腐蚀材料的流体前体流过气体通道并沉积一层流体前体，以完全涂覆气体通道的内表面; （b）从内表面除去多余的流体前体; （c）固化流体前体的沉积层以形成耐腐蚀材料涂层。

10. 发明申请

WO2010068753A2 IMMERSIVE OXIDATION AND ETCHING PROCESS FOR CLEANING SILICON ELECTRODES 审中-公开
标题翻译：用于清洁硅电极的强力氧化和蚀刻工艺
公开(公告)号：WO2010068753A2
公开(公告)日：2010-06-17
申请号：PCT/US2009067495
申请日：2009-12-10
申请人： LAM RES CORP , ZHOU CATHERINE , OUTKA DUANE , AVOYAN ARMEN , SHIH HONG
发明人： ZHOU CATHERINE , OUTKA DUANE , AVOYAN ARMEN , SHIH HONG
IPC分类号： H05H1/34 , H05H1/42
CPC分类号： B24B41/06 , B08B3/08 , B08B3/12 , C11D7/08 , C11D7/261 , C11D7/265 , C11D11/0047
摘要： A process for cleaning a silicon electrode is provided where the silicon electrode is soaked in an agitated aqueous detergent solution and rinsed with water following removal from the aqueous detergent solution. The rinsed silicon electrode is then soaked in an agitated isopropyl alcohol (IPA) solution and rinsed. The silicon electrode is then subjected to an ultrasonic cleaning operation in water following removal from the IPA solution. Contaminants are then removed from the silicon electrode by soaking the silicon electrode in an agitated mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water. The silicon electrode is subjected to an additional ultrasonic cleaning operation following removal from the mixed acid solution and is subsequently rinsed and dried. In other embodiments of the present disclosure, it is contemplated that the silicon electrode can be soaked in either the agitated aqueous detergent solution, the agitated isopropyl alcohol (IPA) solution, or both. Additional embodiments are contemplated, disclosed, and claimed.
摘要翻译：提供一种清洁硅电极的方法，其中硅电极浸泡在搅拌的含水洗涤剂溶液中，并且在从洗涤剂水溶液中除去之后用水漂洗。然后将冲洗的硅电极浸泡在搅拌的异丙醇（IPA）溶液中并漂洗。然后在从IPA溶液中除去之后，将硅电极进行超声波清洗操作。然后通过将硅电极浸入包含氢氟酸，硝酸，乙酸和水的搅拌的混合酸溶液中从硅电极中除去污染物。在从混合酸溶液中除去之后，对硅电极进行附加的超声波清洗操作，随后漂洗并干燥。在本公开的其它实施例中，预期硅电极可以浸泡在搅拌的含水洗涤剂溶液，搅拌的异丙醇（IPA）溶液中或两者中。额外的实施例被设想，公开和要求保护。

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