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1. 发明申请

WO2008084878A1 LIGHT SOURCE 审中-公开
标题翻译：光源
公开(公告)号：WO2008084878A1
公开(公告)日：2008-07-17
申请号：PCT/JP2008/050559
申请日：2008-01-10
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , SHIDA, Satoshi , NAITO, Hiroyuki , UEMOTO, Takaari
发明人： SHIDA, Satoshi , NAITO, Hiroyuki , UEMOTO, Takaari
IPC分类号： F21K7/00 , H01L33/00
CPC分类号： F21K9/00 , H01L25/0753 , H01L33/50 , H01L33/60 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/00
摘要： A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate 5; LED elements D21, D22, D23, D41, D42 that have been implemented on a main surface of the substrate 5; projections 11 that have been formed in areas of the main surface of the substrate 5 in which any of the LED elements D21, D22, D23, D41, D42 have not been implemented; and a translucent sealing member 7 that has been formed on the substrate in a state that the LED elements D21, D22, D23, D41, D42 and the projections 11 are covered and sealed with the sealing member 7. The sealing member 7 includes a phosphor 13 that converts light from the LED elements D21, D22, D23, D41, D42 into light of a predetermined color. The heat conductivity of the projections 11 is higher than the heat conductivity of the sealing member 7.
摘要翻译：限制荧光体中的热积聚的光源。光源包括：基板5; 已经实现在基板5的主表面上的LED元件D21，D22，D23，D41，D42; 已经形成在其中没有实现任何LED元件D21，D22，D23，D41，D42的基板5的主表面的区域中的突起11; 以及在LED元件D21，D22，D23，D41，D42和突起11被密封构件7覆盖和密封的状态下在基板上形成的半透明密封构件7.密封构件7包括荧光体将来自LED元件D21，D22，D23，D41，D42的光转换为预定颜色的光。突起11的导热率高于密封部件7的导热率。

2. 发明申请

WO2006134953A1 SEMICONDUCTOR DEVICE BONDING APPARATUS AND METHOD FOR BONDING SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：半导体器件接合装置和使用该半导体器件的半导体器件的连接方法
公开(公告)号：WO2006134953A1
公开(公告)日：2006-12-21
申请号：PCT/JP2006/311894
申请日：2006-06-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , NAITO, Hiroyuki , SHIDA, Satoshi , UENO, Yasuharu , MORIKAWA, Makoto
发明人： NAITO, Hiroyuki , SHIDA, Satoshi , UENO, Yasuharu , MORIKAWA, Makoto
IPC分类号： H01L21/00 , B23K20/10
CPC分类号： B23K20/10 , H01L21/67138 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81205 , H01L2224/81801 , H01L2924/00014 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/09701 , H01L2924/15787 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.
摘要翻译：本发明的半导体器件接合装置1包括：在半导体器件10和基板11之间设置凸点14的状态下将半导体器件10向基板11侧按压的按压部件15; 通过对半导体装置10和基板11中的至少一个施加超声波振动来使半导体装置10和基板11相对振动的超声波振动施加部件16; 时间测量构件17，其测量从开始施加超声波振动的时间到半导体器件10被按压预定距离的时间的所需时间段; 以及控制构件18，其基于由时间测量构件17测量的时间段来控制后续接合期间的超声波振动的输出。

3. 发明申请

WO2006013800A1 LIGHT SOURCE, MANUFACTURING METHOD OF LIGHT SOURCE, LIGHTING APPARATUS, AND DISPLAY APPARATUS 审中-公开
标题翻译：光源，光源的制造方法，照明装置和显示装置
公开(公告)号：WO2006013800A1
公开(公告)日：2006-02-09
申请号：PCT/JP2005/013997
申请日：2005-07-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , UEMOTO, Takaari , NAITO, Hiroyuki
发明人： UEMOTO, Takaari , NAITO, Hiroyuki
IPC分类号： H01L33/00
CPC分类号： H01L24/11 , F21K9/20 , F21K9/233 , F21K9/90 , F21V5/007 , F21Y2105/10 , F21Y2115/10 , H01L33/38 , H01L33/62 , H01L2224/1134 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2224/0401
摘要： Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).
摘要翻译：提供了具有高可靠性并且几乎不引起发光器件和导电焊盘之间的导电故障的光源。在本发明的LED光源中，使用凸块（55a，55b）将LED裸芯片安装到基板的导电焊盘。 LED裸芯片（D65）在后表面设置有p电极（Lp）和n电极（Ln）。 p电极（Lp）的面积比n电极（Ln）大。 p电极（Lp）经由四个凸块（55a）与相应的导电焊盘接合，而n电极（Ln）通过一个凸块（55b）与相应的导电焊盘接合。 n电极（Ln）和凸块（55b）之间的接合面积（Sn）大于p电极（Lp）和凸块（55a）之间的接合面积（Sp）。

4. 发明申请

WO2003081644A2 COMPONENT MOUNTING METHOD, COMPONENT MOUNTING APPARATUS, AND ULTRASONIC BONDING HEAD 审中-公开
标题翻译：组件安装方法，组件安装设备和超声波接头
公开(公告)号：WO2003081644A2
公开(公告)日：2003-10-02
申请号：PCT/JP2003/003906
申请日：2003-03-27
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MINAMITANI, Shozo , MAE, Takaharu , UENO, Yasuharu , YAMADA, Akira , KANAYAMA, Shinji , AKITA, Makoto , WATANABE, Nobuhisa , MORI, Akira , NAITO, Hiroyuki , MARUMO, Shinya , MORIKAWA, Makoto
发明人： MINAMITANI, Shozo , MAE, Takaharu , UENO, Yasuharu , YAMADA, Akira , KANAYAMA, Shinji , AKITA, Makoto , WATANABE, Nobuhisa , MORI, Akira , NAITO, Hiroyuki , MARUMO, Shinya , MORIKAWA, Makoto
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , B23K20/10 , B23K2201/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
摘要翻译：一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8）所述基板以及将所述部件与所述基板对准的定位装置（6,7）。安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。因此，即使该部件的表面上具有多个凸起电极（2a），也可以高可靠性地进行超声波接合。

5. 发明申请

WO2018181027A1 THREE-DIMENSIONAL MODELING COMPOSITION SET, THREE-DIMENSIONAL MODEL MANUFACTURING METHOD, AND THREE-DIMENSIONAL MODELING APPARATUS 审中-公开
公开(公告)号：WO2018181027A1
公开(公告)日：2018-10-04
申请号：PCT/JP2018/011800
申请日：2018-03-23
申请人： RICOH COMPANY, LTD. , SHIMADA, Yoshihito , NORIKANE,Yoshihiro , SUGIURA, Kenji , NAITO, Hiroyuki
发明人： SHIMADA, Yoshihito , NORIKANE,Yoshihiro , SUGIURA, Kenji , NAITO, Hiroyuki
IPC分类号： B29C64/40 , C08F2/50 , C08F290/06 , B33Y70/00 , B33Y10/00 , B33Y30/00
摘要： A disclosed three-dimensional modeling composition set includes a first composition, and a second composition, where at least one of a cured product of the first composition and a cured product of the second composition has water disintegratability, and when STl represents surface tension of the first composition and ST2 represents surface tension of the second composition, the following formula (1) is satisfied: IST1 - ST2I≤2 (1) where in the formula (1), the unit of the surface tension is mN/m. A method and an apparatus using the three-diemsional modeling composition set are also disclosed.

6. 发明申请

WO2007010879A2 LIGHT-EMITTING MODULE AND MOUNTING BOARD USED THEREFOR 审中-公开
标题翻译：发光模块和用于此的安装板
公开(公告)号：WO2007010879A2
公开(公告)日：2007-01-25
申请号：PCT/JP2006/314118
申请日：2006-07-10
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MORIKAWA, Makoto , UEMOTO, Takaari , NISHIMOTO, Keiji , SHIDA, Satoshi , UENO, Yasuharu , NAITO, Hiroyuki
发明人： MORIKAWA, Makoto , UEMOTO, Takaari , NISHIMOTO, Keiji , SHIDA, Satoshi , UENO, Yasuharu , NAITO, Hiroyuki
IPC分类号： H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： F21K9/00 , F21Y2105/10 , F21Y2105/12 , H01L25/0753 , H01L33/62 , H01L2224/16145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/0102 , H01L2924/01063 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
摘要翻译：发光模块（2）包括具有导体图案的安装板（1）和经由导线（21）安装在导体图案上的多个发光元件（15）。当垂直于安装板（1）观察时，每根导线（21）朝向导体图案的延伸方向不规则地取向。这可以防止导线（21）的阴影重叠，从而可以抑制亮度不均匀。

7. 发明申请

WO0005230A8 PYRAZOLE DERIVATIVES AND SALTS THEREOF 审中-公开
标题翻译：吡咯衍生物及其盐
公开(公告)号：WO0005230A8
公开(公告)日：2000-03-09
申请号：PCT/JP9903962
申请日：1999-07-23
申请人： DAIICHI SEIYAKU CO , EJIMA AKIO , OHSUKI SATORU , OHKI HITOSHI , NAITO HIROYUKI , MAKINO CHIE
发明人： EJIMA AKIO , OHSUKI SATORU , OHKI HITOSHI , NAITO HIROYUKI , MAKINO CHIE
IPC分类号： C07D403/04 , C07D403/14 , C07D471/04 , C07D487/04 , C07D498/04 , C07D401/14 , A61K31/505 , A61K31/53 , A61K31/535
CPC分类号： C07D403/04 , C07D403/14 , C07D471/04 , C07D487/04
摘要： Compounds represented by general formula (I) or (Ia) wherein G and G are each a heterotricyclic fused ring, and salts thereof, which exhibit an antitumor effect; and compounds represented by general formula (Ib) and salts thereof.
摘要翻译：由通式（I）或（Ia）表示的化合物，其中G和G 1各自是异三环稠合环及其盐，其具有抗肿瘤效果; 和由通式（Ib）表示的化合物及其盐。

8. 发明申请

WO9965028A3 MAGNETIC TAPE CASSETTE AND TAPE REEL 审中-公开
标题翻译：磁带盒和胶带
公开(公告)号：WO9965028A3
公开(公告)日：2000-03-02
申请号：PCT/JP9903120
申请日：1999-06-11
申请人： FUJI PHOTO FILM CO LTD , ASHIKAWA TERUO , ONMORI SHOZO , HIRAGUCHI KAZUO , MORITA KIYOO , NAITO HIROYUKI
发明人： ASHIKAWA TERUO , ONMORI SHOZO , HIRAGUCHI KAZUO , MORITA KIYOO , NAITO HIROYUKI
IPC分类号： G11B23/037 , G11B23/087 , G11B23/113
CPC分类号： G11B23/113 , G11B23/037 , G11B23/08735 , G11B23/08785
摘要： The magnetic tape cassette comprises a lid for covering magnetic tape in a freely opening and closing manner, a lid lock for locking the lid in its closed state, and a lid spring (71) not only for energizing the lid lock in its locking direction but also for energizing the lid in its closing direction. The lid spring (71) is structured such that a coil portion (71c) thereof is mounted on a support shaft pin (61a) of the side plate (55a) of an outer lid (51) in a loose fit manner, one leg portion (71a) thereof is secured to a projection portion (65) provided on the side plate (55a), and the other leg portion (71b) thereof is secured to a projection (6) provided on the side surface of an upper half (2) and can be engaged with the lid lock from the upper half (2) side to thereby energize the lid lock in the locking direction of the lid. On the upper half (2), there is provided position restrict means (5) which can be contacted with the coil portion (71c) of the lid spring (71) to thereby restrict the position of the coil portion (71c). Accordingly, it is possible to provide a magnetic tape cassette which can prevent the shaving of a support shaft pin caused by mutual contact between the support shaft pin and the coil portion of a lid spring.
摘要翻译：磁带盒包括用于以自由开启和关闭的方式覆盖磁带的盖子，用于将盖子锁定在其关闭状态的盖子锁定器，以及盖弹簧（71），不仅用于在锁定方向上激活盖子锁定件也用于使盖在其关闭方向上通电。盖弹簧（71）的构造使得其线圈部（71c）以松配合方式安装在外盖（51）的侧板（55a）的支撑轴销（61a）上，一个脚部（71a）被固定到设置在侧板（55a）上的突出部分（65）上，另一个脚部（71b）固定到设置在上半部（2）的侧表面上的突起（6）），并且可以从上半部（2）侧与盖锁定接合，从而在盖的锁定方向上激活盖锁。在上半部（2）上设置有能够与盖弹簧（71）的线圈部（71c）接触的位置限制装置（5），从而限制线圈部（71c）的位置。因此，可以提供一种磁带盒，其可以防止由支撑轴销和盖弹簧的线圈部分之间的相互接触引起的支撑轴销的剃刮。

9. 发明申请

WO2003081644A3 ELECTRONIC COMPONENT MOUNTING METHOD AND APPARATUS AND ULTRASONDIC BONDING HEAD 审中-公开
公开(公告)号：WO2003081644A3
公开(公告)日：2003-10-02
申请号：PCT/JP2003/003906
申请日：2003-03-27
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MINAMITANI, Shozo , MAE, Takaharu , UENO, Yasuharu , YAMADA, Akira , KANAYAMA, Shinji , AKITA, Makoto , WATANABE, Nobuhisa , MORI, Akira , NAITO, Hiroyuki , MARUMO, Shinya , MORIKAWA, Makoto
发明人： MINAMITANI, Shozo , MAE, Takaharu , UENO, Yasuharu , YAMADA, Akira , KANAYAMA, Shinji , AKITA, Makoto , WATANABE, Nobuhisa , MORI, Akira , NAITO, Hiroyuki , MARUMO, Shinya , MORIKAWA, Makoto
IPC分类号： H01L21/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

10. 发明申请

WO2017217273A1 ACTIVE-ENERGY-RAY-CURABLE LIQUID COMPOSITION, THREE-DIMENSIONAL OBJECT FORMING MATERIAL SET, METHOD FOR PRODUCING THREE-DIMENSIONAL OBJECT, AND THREE-DIMENSIONAL OBJECT PRODUCING APPARATUS 审中-公开
标题翻译：活性能量射线固化液体组合物，三维物体成形材料组件，三维物体生产方法和三维物体生产设备
公开(公告)号：WO2017217273A1
公开(公告)日：2017-12-21
申请号：PCT/JP2017/020866
申请日：2017-06-05
申请人： RICOH COMPANY, LTD. , NAITO, Hiroyuki , IWATA, Hiroshi , NORIKANE, Yoshihiro , SHIMADA, Yoshihito , SUGIURA, Kenji
发明人： NAITO, Hiroyuki , IWATA, Hiroshi , NORIKANE, Yoshihiro , SHIMADA, Yoshihito , SUGIURA, Kenji
IPC分类号： C09D11/101 , C09D11/30
摘要： Provided is an active-energy-ray-curable liquid composition containing a monomer (A) having a hydrogen-bonding capacity and a solvent (B) having a hydrogen-bonding capacity, wherein the active-energy-ray-curable liquid composition satisfies conditions below, a cured product obtained by irradiating the active-energy-ray-curable liquid composition with 500 mJ/cm 2 of an active energy ray is a solid having a compressive stress of 2.0 kPa or greater when compressed by 1% at 25 degrees C, and the cured product has a water decaying property.
摘要翻译：提供包含具有氢键合能力的单体（A）和具有氢键合能力的溶剂（B）的活性能量射线固化性液体组合物，其中活性能量射线固化性液体组合物 X-射线固化液体组合物满足以下条件，＆lt;条件＆gt; 通过用500mJ / cm 2的活性能量射线照射活性能量射线固化型液体组合物而得到的固化物为压缩1时的压缩应力为2.0kPa以上的固体％在25摄氏度，并且固化产品具有水腐败性能。

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