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1. 发明申请

WO2007101112A1 METHOD AND APPARATUS FOR DELIVERY OF PULSED LASER RADIATION 审中-公开
标题翻译：用于传送脉冲激光辐射的方法和装置
公开(公告)号：WO2007101112A1
公开(公告)日：2007-09-07
申请号：PCT/US2007/062732
申请日：2007-02-23
申请人： UVTECH SYSTEMS, INC. , CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
发明人： CHAPLICK, Victoria M. , HARTE, Kenneth J. , MILLMAN, JR., Ronald P. , ELLIOTT, David J.
IPC分类号： B08B7/00 , B23K26/08
CPC分类号： B08B7/0042 , B23K26/0622 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/12 , B23K26/123 , B23K26/127 , H01L21/268
摘要： A method and apparatus delivers pulsed laser energy to a damage-sensitive surface. The pulse scanning method and apparatus allow for the deposition of a total dose of laser radiation that could not be attained by any conventional means without damaging the substrate being exposed. Using a solid- state diode pumped YAG laser (110) and an enclosure (150) with a gas ambient, laser pulses are scanned across a substrate (170) according to one of several programmed approaches. Pulses are deposited that are non-adjacent in time, or non-adjacent in space, or both; conventional methods have the pulses adjacent in both time and space. Using the various approaches of the invention, the degree of spatial and temporal adjacency can be precisely controlled to permit significant laser radiation doses without causing any substrate damage. The present invention novel method and apparatus can be carried out by integrating a computer (120), laser (110) and scan head (300) with a small chamber (150) into which gas can flow to permit a variety of surface reactions on damage-sensitive substrates.
摘要翻译：一种方法和装置将脉冲激光能量传递给损伤敏感表面。脉冲扫描方法和装置允许沉积总的剂量的激光辐射，这是通过任何常规方法无法获得的，而不损害被暴露的基底。使用具有气体环境的固态二极管泵浦YAG激光器（110）和外壳（150），根据几种编程方法之一，激光脉冲跨越衬底（170）扫描。脉冲在时间上不相邻或在空间不相邻或两者沉积; 常规方法在时间和空间都具有相邻的脉冲。使用本发明的各种方法，可以精确地控制空间和时间邻接的程度以允许显着的激光辐射剂量而不引起任何基底损伤。本发明的新颖方法和装置可以通过将计算机（120），激光（110）和扫描头（300）与小室（150）集成，气体可以流动的方式和装置进行，以允许各种表面反应损坏敏感基材。

2. 发明申请

WO2011084896A3 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 审中-公开
公开(公告)号：WO2011084896A3
公开(公告)日：2011-07-14
申请号：PCT/US2011/000036
申请日：2011-01-10
申请人： UVTECH SYSTEMS, INC. , HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
发明人： HARTE, Kenneth J. , MILLMAN, Jr., Ronald P. , CHAPLICK, Victoria M. , ELLIOTT, David J. , DEGENKOLB, Eugene O. , TARDIF, Murray Leo
IPC分类号： B08B6/00
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.

3. 发明申请

WO2011084896A2 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 审中-公开
标题翻译：用于处理基板边的方法和装置
公开(公告)号：WO2011084896A2
公开(公告)日：2011-07-14
申请号：PCT/US2011000036
申请日：2011-01-10
申请人： UVTECH SYSTEMS , HARTE KENNETH J , MILLMAN JR RONALD P , CHAPLICK VICTORIA M , ELLIOTT DAVID J , DEGENKOLB EUGENE O , TARDIF MURRAY LEO
发明人： HARTE KENNETH J , MILLMAN JR RONALD P , CHAPLICK VICTORIA M , ELLIOTT DAVID J , DEGENKOLB EUGENE O , TARDIF MURRAY LEO
IPC分类号： C03C15/00 , H01L21/268
CPC分类号： H01L21/268 , B23K26/0648 , B23K26/0665 , B23K26/0676 , B23K26/082 , B23K26/0823 , B23K26/123 , B23K26/142 , G03F7/2028 , H01L21/02087 , H01L21/6708
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.
摘要翻译：公开了一种用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光学系统，用于在大气中将辐射束引导到由卡盘支撑的旋转基底上。光学系统精确和精确地引导光束从衬底的顶部边缘，顶部斜面，顶点，底部斜面和底部边缘去除或转换有机或无机膜，膜堆，残余物或颗粒。可选的气体注入器系统将气体引导到衬底边缘以帮助反应。通过包围反应部位的排气管除去加工副产物。本发明允许边缘排除区域的精确控制，导致晶片上可用的管芯数量的增加。用本发明的晶片边缘加工替代了现有的溶剂和/或研磨方法，从而提高了模具产量。

4. 发明申请

WO2006031270A1 SYSTEM AND METHODS FOR SURFACE CLEANING 审中-公开
标题翻译：用于表面清洁的系统和方法
公开(公告)号：WO2006031270A1
公开(公告)日：2006-03-23
申请号：PCT/US2005/021228
申请日：2005-06-16
申请人： UVTECH SYSTEMS, INC. , ELLIOTT, David J. , MILLMAN, JR., Ronald, P. , TARDIF, Murray , AIELLO, Krista
发明人： ELLIOTT, David J. , MILLMAN, JR., Ronald, P. , TARDIF, Murray , AIELLO, Krista
IPC分类号： H01L21/311 , G03F7/42 , B23K26/12 , B08B7/00
CPC分类号： B08B7/0042 , G03F7/427 , H01L21/31138 , H01L21/67005
摘要： A system for removing photoresist from semiconductor wafers is disclosed. The system utilizes a solid-state laser having wavelengths in the near-visible and visible portions of the electromagnetic spectrum to remove photoresist without requiring hazardous gases or wet solutions. In addition, the system does not damage the substrate being cleaned, nor leave a carbon residue requiring further processing to remove. The system uses photon energy, oxygen, water vapor and ozone to interact with contaminants on a surface, forming a gas reaction zone (GRZ). The GRZ reacts and completely removes the photoresist or other unwanted contamination.
摘要翻译：公开了一种用于从半导体晶片去除光致抗蚀剂的系统。该系统利用在电磁光谱的近可见和可见部分中具有波长的固态激光去除光致抗蚀剂而不需要有害气体或湿溶液。此外，该系统不会损坏被清洁的基板，也不会留下需要进一步处理以除去的碳残留物。该系统使用光子能量，氧气，水蒸汽和臭氧与表面上的污染物相互作用，形成气体反应区（GRZ）。 GRZ反应并完全去除光致抗蚀剂或其他不需要的污染物。

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