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1. 发明申请

WO2015187403A1 HIGH PHOSPHORUS ELECTROLESS NICKEL 审中-公开
标题翻译：高磷电极镍
公开(公告)号：WO2015187403A1
公开(公告)日：2015-12-10
申请号：PCT/US2015/032390
申请日：2015-05-26
申请人： MACDERMID ACUMEN, INC.
发明人： JANIK, Robert , MICYUS, Nicole, J.
IPC分类号： C23C18/32 , C23C18/34 , C23C18/54
CPC分类号： C22C19/03 , C23C18/36
摘要： An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
摘要翻译：一种化学镀镍浴，其包括：i）镍离子源; ii）有效量的硫脲; iii）有效量的糖精; iv）次磷酸根离子源; v）一种或多种螯合剂; 和vi）任选地，其它添加剂及其使用方法在基材上提供高磷无电镀镍沉积物。高磷无电镍沉积物能够通过RCA硝酸试验，由此将具有高磷镍沉积物的基底浸入浓缩的镍酸中30秒，并且不会变成黑色或灰色的沉积物被认为已经通过 RCA硝酸试验。

2. 发明申请

WO2015134690A1 PASSIVATION OF MICRO-DISCONTINUOUS CHROMIUM DEPOSITED FROM A TRIVALENT ELECTROLYTE 审中-公开
标题翻译：微量不连续铬的钝化从一种多电解质沉积
公开(公告)号：WO2015134690A1
公开(公告)日：2015-09-11
申请号：PCT/US2015/018848
申请日：2015-03-05
申请人： MACDERMID ACUMEN, INC.
发明人： MERTENS, Marc , TOOTH, Richard , HERDMAN, Roderick, D. , CLARKE, Terence , PEARSON, Trevor
IPC分类号： C25D3/06 , C25D5/10 , C25D5/12 , C25D5/14 , C25B1/02
CPC分类号： C25D3/06 , C25D5/48 , C25D9/08 , Y10T428/12854
摘要： A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
摘要翻译：描述了一种处理衬底的方法，其中衬底包括由三价铬电解质沉积的层。该方法包括以下步骤：在电解质中提供阳极和镀有铬（III）的底物作为阴极，其包括（i）三价铬盐; 和（ii）复合物; 并在阳极和阴极之间通过电流以钝化镀铬（III）的衬底。可以首先将衬底镀覆镀镍层，以使镀铬层（III）沉积在镀镍层上。

3. 发明申请

WO2013078077A3 METHOD FOR TREATING METAL SURFACES 审中-公开
标题翻译：处理金属表面的方法
公开(公告)号：WO2013078077A3
公开(公告)日：2015-06-11
申请号：PCT/US2012065419
申请日：2012-11-16
申请人： MACDERMID ACUMEN INC
发明人： TOSCANO LENORA M , LONG ERNEST , PAW WITOLD , KOLOGE DONNA , KOYASU KATSUTSUGU , NISHU KEISUKE
IPC分类号： C23C18/31 , C23C18/34
CPC分类号： B23K1/203 , B23K1/0012 , B23K2201/42 , C23C18/1651 , C23C18/1653 , C23C18/36 , C23C18/54 , H01L33/60 , H01L2933/0025
摘要： A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the ekctroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).
摘要翻译：一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在无电镀镍表面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着改善。该处理方法对于增加金属表面的可焊性是有用的，例如在电子封装应用和制造发光二极管（LED）中。

4. 发明申请

WO2014164272A1 ELECTROLYTIC GENERATION OF MANGANESE (III) IONS IN STRONG SULFURIC ACID 审中-公开
标题翻译：锰（III）在强硫酸中的电解生成
公开(公告)号：WO2014164272A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/021618
申请日：2014-03-07
申请人： MACDERMID ACUMEN, INC.
发明人： PEARSON, Trevor , CLARKE, Terence , CHAPANERI, Roshan, V. , ROBINSON, Craig , HYSLOP, Alison , SINGH, Amrik
IPC分类号： C25C1/10
CPC分类号： C25B1/21 , C23C18/2086 , C23C18/24 , C25B11/0473 , C25B11/12 , C25B15/02 , C25D5/56
摘要： An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
摘要翻译：描述了一种电解槽和电解槽中锰（II）离子向锰（III）离子电化学氧化的方法。电解槽包括（1）在至少一种酸的溶液中的锰（II）离子的电解液; （2）浸入电解液中的阴极; 和（3）浸在电解质溶液中并与阴极间隔开的阳极。描述了各种阳极材料，包括玻璃碳，网状玻璃碳，编织碳纤维，铅和铅合金。一旦电解质被氧化形成锰（III）离子的亚稳态络合物，可镀的塑料可与亚稳态络合物接触以蚀刻可镀塑料。此外，还可以在将可镀塑料与亚稳态复合物接触之前在可镀塑料上进行预处理步骤以调节塑料表面。

5. 发明申请

WO2011093943A3 NANO-OXIDE PROCESS FOR BONDING COPPER/COPPER ALLOY AND RESIN 审中-公开
标题翻译：用于粘结铜/铜合金和树脂的纳米氧化工艺
公开(公告)号：WO2011093943A3
公开(公告)日：2014-03-27
申请号：PCT/US2010058312
申请日：2010-11-30
申请人： MACDERMID ACUMEN INC , DE WANG MING , CASTALDI STEVEN A , FENG KESHENG
发明人： DE WANG MING , CASTALDI STEVEN A , FENG KESHENG
IPC分类号： B08B7/00
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound, The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译：提高铜或铜合金层与聚合物树脂之间粘合力的方法。该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 所述浸渍后组合物是碱性溶液，其包含（i）磷酸盐;和（ⅴ）硫化合物。（ii）钼离子源; 和（iii）噻唑。本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。

6. 发明申请

WO2012106037A3 ALUMINUM TREATMENT COMPOSITIONS 审中-公开
标题翻译：铝处理组合物
公开(公告)号：WO2012106037A3
公开(公告)日：2014-03-13
申请号：PCT/US2011065337
申请日：2011-12-16
申请人： MACDERMID ACUMEN INC , ZOBOLI ROBERTO , SALSA SARA , GARZONE MASSIMO
发明人： ZOBOLI ROBERTO , SALSA SARA , GARZONE MASSIMO
IPC分类号： B05D3/00
CPC分类号： C23C22/34 , C08K3/16 , C08K5/0041 , C08K5/098 , C09D133/04
摘要： A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
摘要翻译：提供了一种制备铝或铝合金基底以在其上接受粘附涂层的方法。该方法包括以下步骤：使基底脱脂，使基底脱氧，并在脱脂和脱氧的基底上提供预涂层转化涂层。涂料转化涂料组合物包括：i）氟离子源; ii）锆离子源; iii）丙烯酸树脂; 和iv）荧光增白剂，并且在铝基板上形成无色，无铬的转化涂层，其可以通过将经处理的基材暴露于UV光下来观察。

7. 发明申请

WO2005048663A3 IMPROVED METHODS OF CLEANING COPPER SURFACES IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：印刷电路板制造中清洗铜表面的改进方法
公开(公告)号：WO2005048663A3
公开(公告)日：2005-09-22
申请号：PCT/US2004031434
申请日：2004-09-24
申请人： MACDERMID ACUMEN INC
发明人： DING YING , REDLINE RONALD N , RETALLICK RICHARD C , WOJTASZEK MARK
IPC分类号： C23F1/18 , C23G1/10 , H05K3/38 , B44C1/22
CPC分类号： H05K3/383 , C23F1/18 , C23G1/103 , H05K2203/0796
摘要： The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
摘要翻译：本发明提出了通过使基材与包含过硫酸钠或过氧化氢氧化剂，酸和一种或多种添加剂的水性组合物接触来对金属基材进行微蚀刻的改进方法。当氧化剂是过硫酸钠时，一种或多种添加剂通常包括脂肪族饱和二羧酸。当氧化剂是过氧化氢时，一种或多种添加剂通常包含稳定剂和氨基三（亚甲基膦酸）。

8. 发明申请

WO2005044550B1 PROTECTIVE U.V. CURABLE COVER LAYER FOR OPTICAL MEDIA 审中-公开
标题翻译：保护性U.V. 光学介质的可固化覆盖层
公开(公告)号：WO2005044550B1
公开(公告)日：2005-09-22
申请号：PCT/US2004030347
申请日：2004-09-16
申请人： MACDERMID ACUMEN INC
发明人： BALDWIN KYLE
IPC分类号： B32B7/06 , G11B7/254 , G11B7/26 , B32B3/02
CPC分类号： B32B27/18 , B32B7/06 , G11B7/2542 , G11B7/26 , Y10T428/21
摘要： The invention relates to a protective U.V. curable or photoimageable cover layer for an optical disk substrate and a method of applying the protective cover layer to an optical substrate. The U.V. curable or photoimageable layer is applied as a dry film and has high clarity and cures to a flexible, scratch resistant, non-shrinking film, which has good adhesion to the underlying substrate.
摘要翻译：本发明涉及一种保护性U.V. 用于光盘基板的可固化或可光成像覆盖层以及将该保护覆盖层应用于光学基板的方法。 U.V. 可光固化或可光成像层作为干膜施加，并且具有高透明度并固化成柔韧，耐刮擦，不收缩的膜，其对下面的基底具有良好的粘附性。

9. 发明申请

WO2017031183A1 SOLUTIONS OF ORGANIC SALTS AS PRETREATMENTS FOR PLASTICS PRIOR TO ETCHING 审中-公开
标题翻译：有机废物作为预防腐蚀前预处理的解决方案
公开(公告)号：WO2017031183A1
公开(公告)日：2017-02-23
申请号：PCT/US2016/047306
申请日：2016-08-17
申请人： MACDERMID ACUMEN, INC.
发明人： PEARSON, Trevor , ROBINSON, Craig , HERDMAN, Roderick, D.
IPC分类号： C23C18/20 , C23C18/22 , B05D3/00 , C25D5/56
CPC分类号： C23C18/2086 , C23C18/22 , C23C18/24
摘要： A method of preparing a plastic substrate to accept metal plating thereon is described. The method includes the steps of pretreating the plastic substrate by contacting the plastic substrate with an aqueous electrolyte comprising an organic salt to raise the surface energy of the plastic substrate. Thereafter, the plastic substrate can be etched and metal plated.
摘要翻译：描述了制备塑料基板以在其上接受金属电镀的方法。该方法包括以下步骤：通过使塑料基材与包含有机盐的含水电解质接触以提高塑料基材的表面能来预处理塑料基材。此后，可以蚀刻塑料基板并进行金属电镀。

10. 发明申请

WO2016022535A1 TREATMENT FOR ELECTROPLATING RACKS TO AVOID RACK METALLIZATION 审中-公开
标题翻译：电镀架的处理避免了机架金属化
公开(公告)号：WO2016022535A1
公开(公告)日：2016-02-11
申请号：PCT/US2015/043570
申请日：2015-08-04
申请人： MACDERMID ACUMEN, INC.
发明人： CHAPANERI, Roshan, V. , PEARSON, Trevor , HERDMAN, Roderick, D. , HYSLOP, Alison
IPC分类号： C25D5/54 , C25D5/56 , C25D17/08
CPC分类号： C25D17/08 , C09D181/00 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C25D5/34
摘要： a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.
摘要翻译：一种在电镀工艺中涂覆用于支撑非导电衬底的电镀架的方法。该方法包括以下步骤：使电镀架的至少一部分与增塑溶胶组合物接触，增塑溶胶组合物中分散有有效量的具有以下结构的添加剂：式（I）其中R，R'，R“和R “”相同或独立地选自苄基，取代的苄基，苯基或取代的苯基; 或者：式（II）其中R，R'，R“和R”“相同或独立地选自C 1 -C 10烷基（直链或支链），苄基，取代的苄基，苯基或取代的苯基 M是二价金属阳离子，优选选自镍，铜和锌; 并将其上的增塑溶胶组合物的电镀架加热到合适的温度并持续足够的时间固化增塑溶胶并在电镀架上形成固体绝缘涂层。然后可以将涂覆的电镀架用于安装非导电衬底以用于随后的金属化步骤。

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