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    • 1. 发明申请
    • DEVICE FOR DETERMINING AND/OR MONITORING A PROCESS VARIABLE AND METHOD FOR CONTACTING
    • 一种用于确定和/或监视一个进程的大小和方法,用于接触
    • WO2008065093A2
    • 2008-06-05
    • PCT/EP2007062842
    • 2007-11-27
    • ENDRESS & HAUSER WETZER GMBHBOGHUN DIRKUMKEHRER ALFREDKONRAD STEPHANLIPPOLD GUNDOLF
    • BOGHUN DIRKUMKEHRER ALFREDKONRAD STEPHANLIPPOLD GUNDOLF
    • H05K1/18
    • G01D11/245G01F1/6845G01F1/692G01K7/183H05K1/181H05K3/3442H05K2201/10151H05K2201/10477Y02P70/611Y02P70/613
    • The invention relates to a device for determining and/or monitoring at least one process variable. The invention is characterized in that at least one sensor unit (1) is provided, that the sensor unit (1) is applied with a lower side thereof to an upper side of a substrate (2), that the sensor unit (1) is connected to at least one contact pad (3) for electrical contact, that at least one contact plate (5) is provided, that a lower side of said contact plate (5) is provided with a conductor structure (6), said conductor structure (6) being designed so as to correspond to the arrangement of the contact pad (3). The invention is further characterized in that the conductor structure (6) and the contact pad (3) are contacted with each other in an electrically conducting manner, and that the contact plate (5) has at least one contacting unit (7) on an upper side, said contacting unit (7) and the conductor structure (6) being contacted with each other in an electrically conducting manner. The invention also relates to a method for contacting the sensor unit (1).
    • 本发明涉及一种设备,用于确定和/或监视至少一个工艺变量。 本发明包括至少一个传感器单元(1)被提供,即(1)具有在基板的顶部上的底部的传感器单元(2)被施加,使得传感器单元(1)用于制造电接触的至少一个接触垫(3) 被连接到至少一个接触板(5)设置,所述接触板(5)被设置在底侧具有导向结构(6),其中,所述导体图案(6)被设计成对应于所述接触垫(3),所述的布置 导体结构(6)和所述接触垫(3)彼此电接触,并且在其上的至少一个接触单元的上表面上的接触板(5)(7),其中所述接触单元(7)和导体图案(6)彼此导电接触 是。 此外,本发明涉及一种用于接触的传感器单元(1)。