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1. 发明申请

WO2011133301A1 DISPLAY, DISPLAY MANUFACTURING METHOD AND APPARATUS FOR DISPLAY MANUFACTURING 审中-公开
标题翻译：显示器，显示器制造方法和显示器制造的装置
公开(公告)号：WO2011133301A1
公开(公告)日：2011-10-27
申请号：PCT/US2011/030558
申请日：2011-03-30
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LIN, Peng, Cheng , MATHEW, Mithran, Cheriyan
发明人： LIN, Peng, Cheng , MATHEW, Mithran, Cheriyan
IPC分类号： G02F1/13 , G02B26/00
CPC分类号： H05K1/189 , G02B26/001 , G02F1/13452 , H05K2201/10128
摘要： An apparatus comprises a flexible substrate (905) with a driver chip (960a, 960b). The flexible substrate (905) is substantially enclosing a backplate (910), which covers a display array (940) that is disposed on an array substrate (945). Leads (915) on the array substrate (945) extend beyond the backplate (910) on all four sides of the display array (940) in four lead areas (925) surrounding the display array (940) and are attached to the flexible substrate (905).
摘要翻译：一种装置包括具有驱动芯片（960a，960b）的柔性基板（905）。柔性基板（905）基本上包围背板（910），该背板覆盖设置在阵列基板（945）上的显示阵列（940）。在阵列基板（945）上的引线（915）在围绕显示阵列（940）的四个引线区域（925）中在显示器阵列（940）的所有四个侧面上延伸超过背板（910），并且附接到柔性基板（905）。

2. 发明申请

WO2010002496A3 GROOVE ON COVER PLATE OR SUBSTRATE 审中-公开
公开(公告)号：WO2010002496A3
公开(公告)日：2010-01-07
申请号：PCT/US2009/043194
申请日：2009-05-07
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LIN, Peng Cheng
发明人： LIN, Peng Cheng
IPC分类号： B81C1/00
摘要： An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.

3. 发明申请

WO2013019515A1 METAL THIN SHIELD ON ELECTRICAL DEVICE 审中-公开
标题翻译：电气设备上的金属薄膜
公开(公告)号：WO2013019515A1
公开(公告)日：2013-02-07
申请号：PCT/US2012/048172
申请日：2012-07-25
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LIN, Peng Cheng , VELEZ, Mario Francisco
发明人： LIN, Peng Cheng , VELEZ, Mario Francisco
IPC分类号： B81B7/00
CPC分类号： B81B7/0058 , B81B2201/0221 , B81B2201/0235 , B81B2207/095 , B81C2203/0136 , B81C2203/0163 , G01P1/023 , H01G5/16 , H01L23/315 , H01L23/552 , H01L2924/0002 , Y10T29/49146 , H01L2924/00
摘要： This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.
摘要翻译：本公开提供了用于在薄膜盖上形成金属薄膜屏蔽以保护下面空腔中的机电系统装置的系统和方法。在一个方面，使用双层或多层薄膜结构来密封机电装置。例如，金属薄膜屏蔽可以配合在氧化物薄膜帽上以封装机电装置，并防止由于晶片变薄，切割和封装组件引起的应力引起的劣化，从而增强机电装置在封装空腔中的生存性。在再分配层处理期间，在晶片表面上形成诸如铜层的金属薄膜屏蔽，被图案化和金属化。

4. 发明申请

WO2010002496A2 GROOVE ON COVER PLATE OR SUBSTRATE 审中-公开
标题翻译：盖在盖板或底板上
公开(公告)号：WO2010002496A2
公开(公告)日：2010-01-07
申请号：PCT/US2009043194
申请日：2009-05-07
申请人： QUALCOMM MEMS TECHNOLOGIESL IN , LIN PENG CHENG
发明人： LIN PENG CHENG
IPC分类号： B81C1/00
CPC分类号： G02B26/001 , B81C1/00333 , B81C1/00873
摘要： An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.
摘要翻译：改进的基板或盖板设计，具有用于单独显示装置的有效分割的凹槽。在一个实施例中，显示装置包括在基板或盖板的内表面上的预制凹槽，以便于将MEMS装置与形成基板的多个MEMS装置分离。在一些实施例中，预制凹槽通过在划刻区处减薄和削弱基板或盖板而简化了伪划线，并且作为改进的断裂指导。 Scribe切割浮雕保留部件，结构完整性，并产生干净的断裂，而不会在MEMS芯中引起过大或不必要的应力，并确保在面板凸缘处不会对随后的互连组件造成损坏。

5. 发明申请

WO2012054355A1 WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPRINT SENSOR 审中-公开
标题翻译：用于组合触摸，手写和指纹传感器的封装组件
公开(公告)号：WO2012054355A1
公开(公告)日：2012-04-26
申请号：PCT/US2011/056454
申请日：2011-10-14
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , GANAPATHI, Srinivasan, Kodaganallur , BUCHAN, Nicholas Ian , PETERSEN, Kurt, Edward , SHENOY, Ravindra, Vaman , LIN, Peng, Cheng , CHENG, Ericson
发明人： GANAPATHI, Srinivasan, Kodaganallur , BUCHAN, Nicholas Ian , PETERSEN, Kurt, Edward , SHENOY, Ravindra, Vaman , LIN, Peng, Cheng , CHENG, Ericson
IPC分类号： G06F3/041
CPC分类号： G06F3/044 , G02B26/0833 , G06F3/03547 , G06F3/045 , G06F21/32 , G06F21/83 , G06F2203/04103 , G06F2203/04106 , G06K9/0002
摘要： This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
摘要翻译：本公开提供了用于组合的传感器装置的系统，方法和装置。在一些实施方式中，组合传感器装置包括环绕构型，其中上柔性衬底在延伸部分上具有图案化的导电材料，以允许信号线，电接地和功率的路由。可以将包括连接插座的一个或多个集成电路或无源组件安装在柔性层上以降低成本和复杂性。这样的实现可以消除柔性电缆并且可以允许无边框配置。

6. 发明申请

WO2009111660A1 SYSTEM AND METHOD OF PREVENTING DAMAGE TO METAL TRACES OF FLEXIBLE PRINTED CIRCUITS 审中-公开
标题翻译：防止柔性印刷电路金属触媒损伤的系统及方法
公开(公告)号：WO2009111660A1
公开(公告)日：2009-09-11
申请号：PCT/US2009/036225
申请日：2009-03-05
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LIN, Peng, Cheng
发明人： LIN, Peng, Cheng
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： H05K1/0281 , H05K3/361 , H05K2201/09145 , H05K2201/09354 , H05K2201/09781 , H05K2201/1028 , H05K2201/2009 , Y10T29/49124
摘要： Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses.
摘要翻译：增强器设置在柔性印刷电路中，以防止由弯曲，折叠和其他应力引起的柔性电路的引线和痕迹的损坏。

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