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    • 1. 发明申请
    • INTERFACE BOARD OF A TESTING HEAD FOR A TEST EQUIPMENT OF ELECTRONIC DEVICES AND CORRESPONDING TESTING HEAD
    • 电子设备测试设备的测试头接口板和相应的测试头
    • WO2014009980A1
    • 2014-01-16
    • PCT/IT2012000214
    • 2012-07-11
    • TECHNOPROBE SPACAMPARDO GIOVANNIMAGGIONI FLAVIOLIBERINI RICARDO
    • CAMPARDO GIOVANNIMAGGIONI FLAVIOLIBERINI RICARDO
    • G01R31/319G01R1/04G01R31/28
    • G01R1/0408G01R31/2889G01R31/31905
    • An interface board (50) of a testing head (31) for a test equipment of electronic devices is described, such a testing head (31) comprising a plurality of contact probes (34), each contact probe (34) having at least one contact tip suitable to abut against contact pads of a device to be tested (35), as well as a contact element for the connection with a board (36) of the test equipment. Suitably, the interface board (50) comprises a substrate (51) and at least one redirecting die (40) housed on a first surface of that substrate (51) and a plurality of contact pins (53) projecting from a second surface of that substrate (51) opposed to the first surface, the redirecting die (40) comprising at least one semiconductor substrate (41) whereon at least a first plurality of contact pads (42A) is realized, suitable to contact a contact element of a contact probe (34) of the testing head (31), the contact pins (53) being suitable to contact the board (36).
    • 描述了用于电子设备的测试设备的测试头(31)的接口板(50),这种测试头(31)包括多个接触探针(34),每个接触探针(34)具有至少一个 接触尖端适于抵靠待测试装置(35)的接触垫,以及用于与测试装置的板(36)连接的接触元件。 合适地,接口板(50)包括衬底(51)和容纳在该衬底(51)的第一表面上的至少一个改向模(40),以及从该衬底的第二表面突出的多个触针(53) (40)包括至少一个半导体衬底(41),在所述半导体衬底上实现至少第一多个接触垫(42A),所述半导体衬底适于接触接触探针的接触元件 (31)的所述接触销(34),所述接触销(53)适于接触所述板(36)。