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    • 1. 发明申请
    • SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
    • 半导体结构及其形成方法
    • WO2013078950A1
    • 2013-06-06
    • PCT/CN2012/084694
    • 2012-11-15
    • LI, YuanGUO, Lei
    • LI, YuanGUO, Lei
    • H01L27/00
    • H01L33/0062H01L33/007H01L33/16H01L33/20
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a substrate (100); and a plurality of zigzag structures (200) formed on a surface of the substrate (100), in which each zigzag structure (200) has a first long side (202) and a first short side (204), the first long side (202) of one zigzag structure (200) is adjacent to the first short side (204) of another zigzag structure (200) adjacent to the one zigzag structure (200), each first long side (202) defines a first surface (300) of each zigzag structure (200), each first short side (204) defines a second surface (302) of each zigzag structure, and each first surface (300) is a growth surface for a compound semiconductor layer.
    • 提供半导体结构及其形成方法。 半导体结构包括:衬底(100); 以及形成在所述基板(100)的表面上的多个锯齿形结构(200),其中每个锯齿形结构(200)具有第一长边(202)和第一短边(204),所述第一长边 一个之字形结构(200)的第一表面(202)与邻近一个之字形结构(200)的另一个锯齿形结构(200)的第一短边(204)相邻,每个第一长边(202)限定第一表面(300) 每个Z字形结构(200)的每个第一短边(204)限定每个锯齿形结构的第二表面(302),并且每个第一表面(300)是化合物半导体层的生长表面。
    • 2. 发明申请
    • SYSTEMS AND METHODS FOR MATCHING VISUAL OBJECT COMPONENTS
    • 用于匹配视觉对象组件的系统和方法
    • WO2013009422A3
    • 2013-05-16
    • PCT/US2012042095
    • 2012-06-12
    • GOOGLE INCLI YUANADAM HARTWIG
    • LI YUANADAM HARTWIG
    • G06T7/00
    • G06K9/6256G06K9/00624G06K9/00718G06K9/6201
    • Systems and methods for modeling the occurrence of common image components (e.g., sub-regions) in order to improve visual object recognition are disclosed. In one example, a query image may be matched to a training image of an object. A matched region within the training image to which the query image matches may be determined and a determination may be made whether the matched region is located within an annotated image component of the training image. When the matched region matches only to the image component, an annotation associated with the component may be identified. In another example, sub-regions within a plurality of training image corpora may be annotated as common image components including associated information (e.g., metadata). Matching sub-regions appearing in many training images of objects may be down-weighted in the matching process to reduce possible false matches to query images including common image components.
    • 公开了用于对共同图像分量(例如,子区域)的发生进行建模以便改进视觉对象识别的系统和方法。 在一个示例中,查询图像可以与对象的训练图像匹配。 可以确定训练图像中与查询图像匹配的匹配区域,并且可以确定匹配区域是否位于训练图像的注释图像分量内。 当匹配区域仅与图像分量匹配时,可以识别与该组件相关联的注释。 在另一示例中,多个训练图像语料库中的子区域可以被注释为包括关联信息(例如,元数据)的公共图像分量。 出现在对象的许多训练图像中的匹配子区域可以在匹配处理中被加权,以减少对包括公共图像分量的查询图像的可能的假匹配。
    • 3. 发明申请
    • SELF-ADAPTIVE STUDY EVALUATION
    • 自适应研究评估
    • WO2010065347A2
    • 2010-06-10
    • PCT/US2009065379
    • 2009-11-20
    • SHANGHAI XYZ KNOWLEDGE TECHNOLLIANG CHANGNIANYAN PINGYIZHANG XIAOFENGLI YUAN
    • LIANG CHANGNIANYAN PINGYIZHANG XIAOFENGLI YUAN
    • G06Q50/00
    • G09B7/04
    • A study evaluation system used for computer-based learning uses evaluation contents arranged in a multilevel arrangement for self-adaptive study evaluation. The study evaluation system provides a present evaluation content to a user through user interaction, and determines a subsequent evaluation content or a subsequent knowledge point to be studied by the user at least partially based on the user feedback on the present evaluation content, the multilevel arrangement of the evaluation contents, and a characteristic information of the user. The study evaluation system may further establish a data set for each user to record the user feedbacks on the evaluation contents, and use the data set in combination with certain basic user information to realize individualized study evaluation.
    • 用于计算机学习的研究评估系统使用以多层次排列的评估内容进行自适应学习评估。 研究评估系统通过用户交互为用户提供现在的评估内容,并且至少部分地基于用户对当前评估内容的反馈来确定用户要研究的后续评估内容或后续知识点,多级布置 的评估内容,以及用户的特征信息。 研究评估系统可以进一步建立每个用户的数据集,以记录用户对评估内容的反馈,并结合某些基本用户信息使用数据集,实现个性化的学习评估。
    • 4. 发明申请
    • APPARATUS AND METHOD FOR AUDIO CLONING AND REDIRECTION
    • 用于音频克隆和重定向的装置和方法
    • WO2009140794A1
    • 2009-11-26
    • PCT/CN2008/000988
    • 2008-05-22
    • INTEL CORPORATIONYANG, ZhenrongLI, YuanWANG, Brett P.
    • YANG, ZhenrongLI, YuanWANG, Brett P.
    • H04S3/00
    • H04S3/008H04R27/00H04R2227/003
    • In some embodiments, a computer system may include a processor, a memory coupled to the processor, and two or more different audio output devices associated with the computer system. In some embodiments, an audio driver capable of being loaded in the memory and executed by the processor may be configured to identify one or more audio sources associated with the computer system, identify two or more different audio endpoints associated with the two or more different audio output devices, and process an audio signal from one of the audio sources, the received audio signal having N different audio channels, where N is a positive integer greater than one. In some embodiments, the audio processor may generate X audio channels from the N different audio channels in the audio signal, where X is an integer less than N, generate Y audio channels from the N different audio channels in the audio signal, where Y is an integer less than N and wherein at least two of the X and Y audio channels are generated from different ones of the N different audio channels, direct the X audio channels to one of the two or more different audio endpoints, and direct the Y audio channels to a different one of the two or more different audio endpoints. Other embodiments are disclosed and claimed.
    • 在一些实施例中,计算机系统可以包括处理器,耦合到处理器的存储器以及与计算机系统相关联的两个或更多个不同的音频输出设备。 在一些实施例中,能够被加载到存储器中并由处理器执行的音频驱动器可以被配置为识别与计算机系统相关联的一个或多个音频源,识别与两个或更多个不同音频相关联的两个或多个不同音频端点 输出设备,并且处理来自音频源之一的音频信号,所接收的音频信号具有N个不同的音频通道,其中N是大于1的正整数。 在一些实施例中,音频处理器可以从音频信号中的N个不同音频通道生成X个音频通道,其中X是小于N的整数,从音频信号中的N个不同音频通道生成Y个音频通道,其中Y是 小于N的整数,并且其中X和Y音频通道中的至少两个从N个不同音频通道中的不同音频通道生成,将X个音频通道引导到两个或多个不同的音频端点中的一个,并将Y音频 通道到两个或更多个不同的音频端点中的不同的一个。 公开和要求保护其他实施例。
    • 5. 发明申请
    • TRUNCATED GLUCAGON-LIKE PEPTIDE-1 (sGLP-1) AND ITS PREPARING METHOD AND USE
    • 截留的GLUCAGON-LIKE PEPTIDE-1(sGLP-1)及其制备方法和用途
    • WO2007056907A1
    • 2007-05-24
    • PCT/CN2006000562
    • 2006-03-30
    • DALIAN D N BIO ENGINEERING COLI YUAN
    • LI YUAN
    • C07K14/47A61K38/26A61P3/10C07K1/04C07K1/06C07K1/14C07K14/605
    • C07K14/605A61K38/00C07K14/61
    • Glucagon-like peptide-1 (GLP-1) analogs for promoting secretion of insulin, named as truncated glucagon-like peptide-1 (sGLP-1), is composed of 26 amino acid residues with the sequence of His-X1-Glu-Gly-Thr-Phe-Thr-Ser-Asp-Val-Ser-Ser-Tyr-Leu-Glu-Gly-Gln-Ala-Ala-Lys-Glu-Phe-Ile-Ala-Trp-Leu. The sGLP-1 according to the present invention has marked merits compared with current GLP-1 analogs, as follows: a) stronger binding affinity to insulin cell receptor and enhanced capacity to stimulate insulin secretion; b) resistance to degradation of dipeptidyl peptidase because of the substitution of Gly or Ser for Ala at amino-acid position 2, resulting in longer in vivo half life and improved curative effect; c) lowering synthetic cost due to shorter sequence.
    • 用于促进胰岛素分泌的胰高血糖素样肽-1(GLP-1)类似物由26个氨基酸残基组成,其具有His-X1-Glu-序列的序列,其被称为截短胰高血糖素样肽-1(sGLP-1) 甘氨酸 - 苏氨酸 - 苯丙氨酸 - 苏氨酸 - 丝氨酸 - 天冬氨酸 - 缬氨酸 - 丝氨酸 - 丝氨酸 - 酪氨酸 - 亮氨酸 - 谷氨酸 - 甘氨酸 - 谷氨酰胺 - 丙氨酸 - 丙氨酸 - 赖氨酸的Glu-PHE-ILE-ALA-TRP-亮氨酸。 根据本发明的sGLP-1与当前GLP-1类似物相比具有显着的优点,如下:a)对胰岛素细胞受体的更强的结合亲和力和增强的刺激胰岛素分泌的能力; b)由于在氨基酸位置2将Gly或Ser取代为Ala而导致二肽基肽酶降解的抗性,导致更长的体内半衰期和改善的疗效; c)由于序列较短而降低综合成本。
    • 9. 发明申请
    • SEMICONDUCTOR CHIP PACKAGE WITH EMBEDDED CAPACITORS
    • 具有嵌入式电容器的半导体芯片封装
    • WO0203421A3
    • 2002-03-14
    • PCT/US0119364
    • 2001-06-14
    • INTEL CORPCHUNG CHEE YEEFIGUEROA DAVID GLI YUAN LIANG
    • CHUNG CHEE-YEEFIGUEROA DAVID GLI YUAN-LIANG
    • H01L23/64H05K1/18H01L23/66H01L23/498H01L23/50
    • H05K1/0231H01L23/642H01L2224/16225H01L2924/01078H01L2924/01087H01L2924/15311H01L2924/3011H05K1/185Y10S257/916
    • A capacitor assembly having one or more capacitors (120) embedded in the core layer of a package having integrated circuits (ICs) mounted thereon. Each embedded capacitor has plural pairs of first and second electrodes (130) and the package core layer has plural sets of first and second vias (140) dispersed over the pairs of electrodes and being connected thereto. A metal layer (150) is provided on the core layer and includes a first portion having at least one metal strip and a second portion, electrically isolated from each strip. Each metal strip is positioned such that it is extended to overlie both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent, succeeding pair of electrodes and effects a mutual electrical connection between them through first and second vias associated therewith, respectively. A wiring layer (160) which may be a dielectric interlevel connection layer, provided on the metal layer, has plural sets of third vias (170) that are disposed over the center of the capacitor such that adjacently disposed sets of third vias alternate between contacting the individual ones of the metal strips and contacting the second portion of the metal layer to provide interlayer electrical connections therethrough, respectively, to wirings or terminals in the package. The individual metal strips associated with the first portion of the metal layer are to be applied with one of the power and ground reference signals of the package assembly and the second portion thereof is to be applied with the other one of the power and ground voltages. These capacitors may be employed as bypass capacitors in a package assembly for integrated circuits.
    • 一种电容器组件,其具有嵌入在其上安装有集成电路(IC)的封装的芯层中的一个或多个电容器(120)。 每个嵌入式电容器具有多对第一和第二电极(130),并且封装芯层具有分散在该对电极上并与之连接的多组第一和第二通孔(140)。 金属层(150)设置在芯层上,并且包括具有至少一个金属带的第一部分和与每个带电隔离的第二部分。 每个金属条被定位成使得其延伸以覆盖不同对电极的第一电极和相邻的后一对电极的第二电极,并且通过与其相关联的第一和第二通孔来实现它们之间的相互电连接, 分别。 设置在金属层上的可以是电介质层间连接层的布线层(160)具有设置在电容器中心的多组第三通孔(170),使得相邻设置的第三通孔组在接触之间交替 单独的金属条并且与金属层的第二部分接触以分别提供到包装中的布线或端子之间的夹层电连接。 与金属层的第一部分相关联的单个金属带将被施加到封装组件的电源和接地参考信号中的一个,并且其第二部分将被施加电源和接地电压中的另一个。 这些电容器可以用作用于集成电路的封装组件中的旁路电容器。