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1. 发明申请

WO2012047790A3 MULTIPLE CONFIGURATION LIGHT EMITTING DEVICES AND METHODS 审中-公开
标题翻译：多种配置发光装置和方法
公开(公告)号：WO2012047790A3
公开(公告)日：2012-07-19
申请号：PCT/US2011054563
申请日：2011-10-03
申请人： CREE INC , ANDREWS PETER S , ROSADO RAYMOND , LAUGHNER MICHAEL P , EMERSON DAVID T , BRITT JEFFREY C
发明人： ANDREWS PETER S , ROSADO RAYMOND , LAUGHNER MICHAEL P , EMERSON DAVID T , BRITT JEFFREY C
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
摘要翻译：公开了多配置发光二极管（LED）装置和方法，其中装置内的LED可被选择性地配置为用于较高电压或可变电压应用。可以配置LED的可变布置。布置可以包括串联，并联和/或其组合的一个或多个LED。可以安装一个或多个LED的表面可以包括一个或多个电隔离部分和/或热隔离部分。

2. 发明申请

WO2012047790A2 MULTIPLE CONFIGURATION LIGHT EMITTING DEVICES AND METHODS 审中-公开
标题翻译：多配置发光器件和方法
公开(公告)号：WO2012047790A2
公开(公告)日：2012-04-12
申请号：PCT/US2011/054563
申请日：2011-10-03
申请人： CREE, INC. , ANDREWS, Peter, S. , ROSADO, Raymond , LAUGHNER, Michael, P. , EMERSON, David, T. , BRITT, Jeffrey, C.
发明人： ANDREWS, Peter, S. , ROSADO, Raymond , LAUGHNER, Michael, P. , EMERSON, David, T. , BRITT, Jeffrey, C.
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
摘要翻译：公开了多种配置发光二极管（LED）器件和方法，其中器件内的LED可以被选择性地配置用于更高电压或可变电压应用。可以配置LED的可变布置。装置可以包括串联，并联和/或其组合的一个或多个LED。一个或多个LED可以安装在其上的表面可以包括一个或多个电和/或热隔离部分。

3. 发明申请

WO2012040084A1 MULTI-CHIP LED DEVICES 审中-公开
标题翻译：多芯片LED器件
公开(公告)号：WO2012040084A1
公开(公告)日：2012-03-29
申请号：PCT/US2011/052102
申请日：2011-09-19
申请人： CREE, INC. , ANDREWS, Peter Scott , ROSADO, Raymond , LAUGHNER, Michael P. , EMERSON, David T. , BRITT, Jeffrey C.
发明人： ANDREWS, Peter Scott , ROSADO, Raymond , LAUGHNER, Michael P. , EMERSON, David T. , BRITT, Jeffrey C.
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , Y10T29/49002 , H01L2924/00014
摘要： Multi-chip LED devices (200, 300) are described. Embodiments of the present invention provide multi-chip LED devices (200, 300) with relatively high efficiency and good color rendering. The LED device (200, 300) includes a plurality of interconnected LED chips (202, 302) and an optical element such as a lens. The optical element may be molded from silicone. The LED chips (202, 302) may be connected in parallel. In some embodiments, the LED device (200, 300) includes a submount (100), which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds (204, 304, 305) can be connected to the LED chips (202, 302) so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.
摘要翻译：描述了多芯片LED器件（200,300）。本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件（200,300）。 LED装置（200,300）包括多个互连的LED芯片（202,302）和诸如透镜的光学元件。光学元件可以由硅树脂模制而成。 LED芯片（202,302）可以并联连接。在一些实施例中，LED装置（200,300）包括底座（100），其可由诸如氧化铝或氮化铝的陶瓷材料制成。引线键合（204,304,305）可以连接到LED芯片（202,302），使得所有的引线键合趋向于一组LED芯片的外部。可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧面LED芯片。

4. 发明申请

WO2012040085A1 HIGH DENSITY MULTI-CHIP LED DEVICES 审中-公开
标题翻译：高密度多芯片LED器件
公开(公告)号：WO2012040085A1
公开(公告)日：2012-03-29
申请号：PCT/US2011/052103
申请日：2011-09-19
申请人： CREE, INC. , ANDREWS, Peter Scott , ROSADO, Raymond , LAUGHNER, Michael P. , EMERSON, David T. , ABARE, Amber C. , BRITT, Jeffrey C.
发明人： ANDREWS, Peter Scott , ROSADO, Raymond , LAUGHNER, Michael P. , EMERSON, David T. , ABARE, Amber C. , BRITT, Jeffrey C.
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , Y10T29/49002 , H01L2924/00014
摘要： High density multi-chip LED devices (600, 700, 800, 900, 1100, 1200) are described. Embodiments of the present invention provide high-density, multi-chip LED devices (600, 700, 800, 900, 1100, 1200) with relatively high efficiency and light output in a compact size. An LED device (600, 700, 800, 900, 1100, 1200) includes a plurality of interconnected LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) and an optical element such as a lens (1150). The LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device (600, 700, 800, 900, 1100, 1200) includes a submount (500, 1000), which may be made of ceramic. The submount (500, 1000) may include a connection bus and semicircular areas to which chips are bonded. Wire bonds (614, 616, 618, 620, 716, 718, 720, 814, 816, 820, 914, 916, 917, 918, 920, 921, 1122, 1123, 1125, 1126, 1221, 1240, 1242, 1244) can be connected to the LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
摘要翻译：描述了高密度多芯片LED器件（600,700,800,900,1100,1200）。本发明的实施例提供了具有较高效率和光输出的紧凑尺寸的高密度多芯片LED器件（600,700,800,900,1100,1200）。 LED装置（600,700,800,900,1100,1200）包括多个相互连接的LED芯片（610,612,710,712,810,812,910,911,912,913,1120,1121,1212,212， 1240）和诸如透镜（1150）的光学元件。 LED芯片（610,612,710,712,810,812,910,911,912,913,1120,1121,1221,1240）可以分成两组，每组中的LED芯片并联连接并且这些组是串联的。在一些实施例中，LED装置（600,700,800,900,1100,1200）包括可由陶瓷制成的底座（500,1000）。基座（500,1000）可以包括连接总线和与芯片结合的半圆形区域。线接合（614,616,618,620,716,718,720,814,816,820,914,916,917,918,920,921,1122,1123,1125,1126,1221,1240,1242,1244））可以连接到LED芯片（610,612,710,712,810,812,910,911,912,913,1120,1121,1221,1240），使得所有引线键都布置在一组LED芯片，以尽量减少光吸收。

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