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1. 发明申请

WO2007127079A2 A BONDING PLATE MECHANISM FOR USE IN ANODIC BONDING 审中-公开
标题翻译：用于阳极结合的粘合板机构
公开(公告)号：WO2007127079A2
公开(公告)日：2007-11-08
申请号：PCT/US2007009216
申请日：2007-04-16
申请人： CORNING INC , CADY RAYMOND C , COSTELLO III JOHN J , LAKOTA ALEXANDER , LOCK WILLIAM E , THOMAS JOHN C
发明人： CADY RAYMOND C , COSTELLO III JOHN J , LAKOTA ALEXANDER , LOCK WILLIAM E , THOMAS JOHN C
IPC分类号： D06F75/26
CPC分类号： H01L21/67092 , H01L21/67121 , H01L21/68 , H01L21/76254
摘要： A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.
摘要翻译：一种用于将第一和第二材料片阳极接合在一起的粘合板机构，所述装置包括：基部，包括第一和第二间隔开的表面; 由所述基座的第二表面支撑并且可操作以阻止对所述基座的热传递的绝热绝缘体; 直接或间接地耦合到所述绝缘体并且可操作以响应于电功率产生热量的加热盘; 以及直接或间接地联接到所述加热盘并且可操作以至少将来自所述加热盘的热传递到所述第一材料片的热扩散器，并且向所述第一材料片施加电压，其中施加到所述第一材料片的热和电压根据相应的加热和电压分布以帮助第一和第二材料片的阳极接合，并且接合板机构的热惯性相对较低，使得第一材料片材的加热达到约600℃或更高的温度在不到一个半小时。

2. 发明申请

WO2013181477A1 METHODS OF APPLYING A LAYER OF MATERIAL TO A NON-PLANAR GLASS SHEET 审中-公开
标题翻译：将一层材料应用于非平面玻璃板的方法
公开(公告)号：WO2013181477A1
公开(公告)日：2013-12-05
申请号：PCT/US2013/043502
申请日：2013-05-31
申请人： CORNING INCORPORATED , BRACKLEY, Douglas Edward , DAIGLER, Christopher Paul , FRISKE, Mark Stephen , LAKOTA, Alexander
发明人： BRACKLEY, Douglas Edward , DAIGLER, Christopher Paul , FRISKE, Mark Stephen , LAKOTA, Alexander
IPC分类号： C03B23/023 , C03B23/025 , C03B23/035 , C03C17/00 , B41M5/00
CPC分类号： B05D3/12 , B33Y10/00 , B41M1/12 , B41M1/34 , B41M5/0011 , B41M5/0047 , B41M5/007 , B41M5/0088 , C03B23/025 , C03B23/0256 , C03B23/0355 , C03B23/0357 , C03C17/002 , C03C2218/119
摘要： Methods apply a layer of material to a glass sheet having a non-planar shape. The methods can each include the step of providing the glass sheet having an initial non-planar shape including a thickness defined between a first sheet surface and a second sheet surface. The method further includes the step of at least partially flattening the glass sheet into an application shape. The method further includes the step of applying the layer of material to the first sheet surface while the glass sheet is in the application shape. The method then includes the step of releasing the glass sheet to relax into a post non-planar shape.
摘要翻译：方法将一层材料施加到具有非平面形状的玻璃板上。这些方法各自可以包括提供具有初始非平面形状的玻璃片的步骤，该初始非平面形状包括限定在第一片材表面和第二片材表面之间的厚度。该方法还包括将玻璃板至少部分地变平为应用形状的步骤。该方法还包括在玻璃板处于应用形状时将材料层施加到第一片材表面的步骤。该方法然后包括释放玻璃片以松弛成后非平面形状的步骤。

3. 发明申请

WO2007127111A3 HIGH TEMPERATURE ANODIC BONDING APPARATUS 审中-公开
标题翻译：高温阳极结合装置
公开(公告)号：WO2007127111A3
公开(公告)日：2008-12-11
申请号：PCT/US2007009423
申请日：2007-04-18
申请人： CORNING INC , CADY RAYMOND C , COSTELLO III JOHN J , LAKOTA ALEXANDER , LOCK WILLIAM E , THOMAS JOHN C
发明人： CADY RAYMOND C , COSTELLO III JOHN J , LAKOTA ALEXANDER , LOCK WILLIAM E , THOMAS JOHN C
IPC分类号： B32B41/00
CPC分类号： H01L21/67092 , H01L21/67121 , H01L21/67144 , H01L21/76254
摘要： An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.
摘要翻译：阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

4. 发明申请

WO2007127111A2 HIGH TEMPERATURE ANODIC BONDING APPARATUS 审中-公开
标题翻译：高温阳极结合装置
公开(公告)号：WO2007127111A2
公开(公告)日：2007-11-08
申请号：PCT/US2007/009423
申请日：2007-04-18
申请人： CORNING INCORPORATED , CADY, Raymond, C. , COSTELLO III, John, J. , LAKOTA, Alexander , LOCK, William, E. , THOMAS, John, C.
发明人： CADY, Raymond, C. , COSTELLO III, John, J. , LAKOTA, Alexander , LOCK, William, E. , THOMAS, John, C.
IPC分类号： D06F75/26
CPC分类号： H01L21/67092 , H01L21/67121 , H01L21/67144 , H01L21/76254
摘要： An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.
摘要翻译：阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

5. 发明申请

WO2012166761A1 PRECISION GLASS ROLL FORMING PROCESS AND APPARATUS 审中-公开
标题翻译：精密玻璃滚筒成型工艺及设备
公开(公告)号：WO2012166761A1
公开(公告)日：2012-12-06
申请号：PCT/US2012/039933
申请日：2012-05-30
申请人： CORNING INCORPORATED , LAKOTA, Alexander , LOCK, William Edward , SCHULTES, Joel Andrew , THOMAS, John Christopher
发明人： LAKOTA, Alexander , LOCK, William Edward , SCHULTES, Joel Andrew , THOMAS, John Christopher
IPC分类号： C03B13/04 , C03B17/06
CPC分类号： C03B13/16 , C03B13/04 , C03B17/064 , Y02P40/57
摘要： A process and apparatus for precision glass roll forming includes a glass feed device for supplying a supplied stream of molten glass at a glass temperature of 1000° C or higher. A pair of hot forming rolls maintained at a surface temperature of about 500° C or higher or about 600° C or higher located vertically below the glass feed device receives the supplied stream of molten glass and thins the supplied stream of molten glass to form a formed ribbon of glass having a thickness near a desired thickness. A pair of cold sizing rolls maintained at a surface temperature of from about 400° C or lower, about 300° C or lower, or about 200° C or lower are located vertically below the forming rolls receives the formed ribbon of glass and thins the formed ribbon of molten glass to produce a sized ribbon of glass having a desired thickness and a desired thickness uniformity. The thickness of the sized ribbon of glass varies by no more than +/- 0.025 mm. The sized ribbon of glass produced by the sizing rolls has a thickness 1mm or less or 0.8mm or less, or 0.75 mm or less.
摘要翻译：用于精密玻璃辊成型的方法和装置包括玻璃供给装置，用于在玻璃温度为1000℃或更高的温度下供应所供应的熔融玻璃流。保持在垂直于玻璃供给装置的500℃或更高或约600℃或更高的表面温度的一对热成型辊接收供应的熔融玻璃流，并使所供应的熔融玻璃流形成形成具有接近期望厚度的厚度的玻璃带。保持在约400℃或更低，约300℃或更低或约200℃或更低的表面温度的一对冷定型辊位于成形辊的垂直下方，接收所形成的玻璃带，并使形成熔融玻璃带以产生具有所需厚度和所需厚度均匀性的尺寸的玻璃带。尺寸的玻璃带的厚度变化不超过+/- 0.025mm。由定型辊生产的大小的玻璃带的厚度为1mm以下或0.8mm以下或0.75mm以下。

6. 发明申请

WO2007127079A3 A BONDING PLATE MECHANISM FOR USE IN ANODIC BONDING 审中-公开
公开(公告)号：WO2007127079A3
公开(公告)日：2007-11-08
申请号：PCT/US2007/009216
申请日：2007-04-16
申请人： CORNING INCORPORATED , CADY, Raymond C , COSTELLO III, John J , LAKOTA, Alexander , LOCK, William E , THOMAS, John C
发明人： CADY, Raymond C , COSTELLO III, John J , LAKOTA, Alexander , LOCK, William E , THOMAS, John C
IPC分类号： H05B3/68
摘要： A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

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