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    • 1. 发明申请
    • SUBSTRATE-INSPECTING DEVICE
    • 基板检测装置
    • WO2011087337A3
    • 2011-12-08
    • PCT/KR2011000343
    • 2011-01-18
    • KOH YOUNG TECH INCHONG JONG-KYUJEON MOON-YOUNGKIM HONG-MINHUR JUNGYUN SANG-KYU
    • HONG JONG-KYUJEON MOON-YOUNGKIM HONG-MINHUR JUNGYUN SANG-KYU
    • G01B11/24G01B11/30G01N21/88H01L21/66
    • G01N21/9501
    • Disclosed is a substrate-inspecting device, which can improve the accuracy of inspection. The substrate-inspecting device comprises at least one lighting module, an imaging lens, a first beam splitter, and a first camera and a second camera. The lighting module sheds light on a substrate being inspected, and the imaging lens transmits light reflected from the substrate being inspected. The first beam splitter transmits a portion of light transmitted through the imaging lens, and reflects the rest of the light. The first camera receives light transmitted through the first beam splitter and captures images, and the second camera receives the light reflected by the first beam splitter and captures images. According to the present invention, as the substrate is inspected using only one imaging lens, degradation in the accuracy of inspection is prevented, in contrast to conventional devices which use multiple imaging lenses which have variations in optical axes or magnifications.
    • 公开了一种能够提高检查精度的基板检查装置。 基板检查装置包括至少一个照明模块,成像透镜,第一分束器以及第一相机和第二相机。 照明模块在被检查的基板上照射光,并且成像透镜透射从被检查的基板反射的光。 第一分束器透射透过成像透镜的光的一部分,并反射剩余的光。 第一相机接收通过第一分束器传输的光并捕获图像,并且第二相机接收由第一分束器反射的光并捕获图像。 根据本发明,与仅使用一个成像透镜检查基板的情况相反,与使用具有光轴或放大率变化的多个成像透镜的常规装置相比,防止了检查精度的劣化。
    • 8. 发明申请
    • LIGHT EMITTING DIODE PACKAGE
    • 发光二极管封装
    • WO2009082177A2
    • 2009-07-02
    • PCT/KR2008007692
    • 2008-12-24
    • SAMSUNG ELECTRO MECHPYEON IN-JOONKIM HONG-MIN
    • PYEON IN-JOONKIM HONG-MIN
    • H01L33/48H01L33/60H01L33/62
    • H01L33/62H01L33/486H01L33/60H01L2224/48091H01L2224/48247H01L2924/01021H01L2924/01068H01L2924/00014
    • There is provided a light emitting diode (LED) package. The LED package includes A light emitting diode (LED) package includes a pair of lead frames connected with at least one LED chip through a metal wire, a package body integrally fixed with the lead frames and having a cavity having an open top, a lead frame bent downwardly to a lower part of an external mounting surface of the package body, a light-transmissive, transparent resin covering the LED chip and filling the cavity, a recess formed in a bottom surface of the cavity, in which the LED chip is mounted, and a transparent resin including a fluorescent material formed in the recess and the cavity. Accordingly, the amount of light-transmissive, transparent resin filling the cavity is reduced to save on manufacturing costs, and the height of the resin is lowered to improve the luminance of light. Also, the height of the package body is lowered, contributing to manufacturing a small product.
    • 提供了一种发光二极管(LED)封装。 LED封装包括:发光二极管(LED)封装,包括通过金属线与至少一个LED芯片连接的一对引线框架,与引线框架整体固定并具有开口顶部的空腔的封装体,引线 框架向下弯曲到封装体的外部安装表面的下部,覆盖LED芯片并填充空腔的透光的透明树脂,形成在腔的底表面中的凹部,其中LED芯片是 以及包含形成在凹部和空腔中的荧光材料的透明树脂。 因此,减少填充空腔的透光性透明树脂的量,以节省制造成本,并且降低树脂的高度以提高光的亮度。 此外,包装体的高度降低,有助于制造小产品。