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1. 发明申请

WO2013142134A1 A SELF-CONDITIONING POLISHING PAD AND A METHOD OF MAKING THE SAME 审中-公开
标题翻译：自调节抛光垫及其制造方法
公开(公告)号：WO2013142134A1
公开(公告)日：2013-09-26
申请号：PCT/US2013/030353
申请日：2013-03-12
申请人： JH RHODES COMPANY, INC.
发明人： DASKIEWICH, Scott, B.
IPC分类号： B24B37/24
CPC分类号： B24B37/24 , B24B37/26 , C08J9/35 , C08J2203/10 , C08J2203/142
摘要： The present invention is directed to a self-conditioning polishing pad. The self-conditioning polishing pad comprises an insoluble polymeric foam matrix and insoluble polymeric foam particles within the foam matrix. The particles are coated with a water-soluble component over a portion of the surface area of the particle. The particles may have a diameter in the range of 5 to 1000 microns in diameter.
摘要翻译：本发明涉及一种自调节抛光垫。自调理抛光垫包括不溶性聚合物泡沫基质和泡沫基质内的不溶性聚合泡沫颗粒。颗粒在颗粒的表面积的一部分上涂覆有水溶性组分。颗粒的直径可以在5至1000微米的范围内。

2. 发明申请

WO2015138552A1 POLYUREA-BASED MATERIAL, POLISHING AND GRINDING MEDIA INCLUDING THE POLYUREA-BASED MATERIAL, AND METHODS OF FORMING AND USING SAME 审中-公开
标题翻译：基于聚氨酯的材料，抛光和研磨介质，包括基于聚氨酯的材料，以及形成和使用它们的方法
公开(公告)号：WO2015138552A1
公开(公告)日：2015-09-17
申请号：PCT/US2015/019869
申请日：2015-03-11
申请人： JH RHODES COMPANY, INC.
发明人： WASILCZYK, George , DASKIEWICH, Scott
IPC分类号： B24B37/24
CPC分类号： B24D3/28 , B24D3/32 , C08G18/3228 , C08G18/325 , C08G2101/00 , Y10T428/24479
摘要： Polyurea-based materials suitable for grinding media and polishing media, media including the polyurea-based material, and methods of forming and using the polyurea-based material and media are disclosed. The polyurea-based material is formed using one or more secondary polyamines, which allows for slower reaction rates and produces material having desired properties.
摘要翻译：公开了适用于研磨介质和抛光介质的聚脲基材料，包括聚脲基材料的介质，以及形成和使用聚脲基材料和介质的方法。使用一种或多种仲胺形成聚脲基材料，其允许较慢的反应速率并产生具有所需性质的材料。

3. 发明申请

WO2017019906A1 POLYMERIC LAPPING MATERIALS, MEDIA AND SYSTEMS INCLUDING POLYMERIC LAPPING MATERIAL, AND METHODS OF FORMING AND USING SAME 审中-公开
标题翻译：聚合物材料，包括聚合物材料的介质和系统及其形成和使用方法
公开(公告)号：WO2017019906A1
公开(公告)日：2017-02-02
申请号：PCT/US2016/044571
申请日：2016-07-28
申请人： JH RHODES COMPANY, INC.
发明人： WASILCZYK, George , MUNCY, Brent , DASKIEWICH, Scott
IPC分类号： B24B37/14 , B24B37/27 , B24B37/34
CPC分类号： B24B37/24 , C08G18/10 , C08G18/12 , C08G18/3206 , C08G18/4854 , C08G18/6674 , C08G18/7621 , C08G2101/005 , C08J9/0066 , C08J2205/044 , C08J2363/02 , C08J2375/08 , C08G18/3814
摘要： A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.
摘要翻译：公开了适用于研磨工艺的聚合材料，包括聚合材料的介质，包括介质的体系，以及形成和使用聚合物材料的方法。聚合物材料可用于搭接诸如蓝宝石表面的硬表面。研磨过程可以在研磨过程之后和抛光过程之前进行。

4. 发明申请

WO2016007294A1 POLISHING MATERIAL FOR POLISHING HARD SURFACES, MEDIA INCLUDING THE MATERIAL, AND METHODS OF FORMING AND USING SAME 审中-公开
标题翻译：用于抛光硬表面的抛光材料，包括材料的介质及其形成和使用方法
公开(公告)号：WO2016007294A1
公开(公告)日：2016-01-14
申请号：PCT/US2015/037433
申请日：2015-06-24
申请人： JH RHODES COMPANY, INC.
发明人： DASKIEWICH, Scott , MUNCY, Brent , WASILCZYK, George
IPC分类号： C09K3/14
CPC分类号： B24B37/24 , B24D3/32 , B24D3/34 , B24D11/001 , B24D11/003 , C08G18/72
摘要： Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments: soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.
摘要翻译：公开了适用于抛光硬表面的抛光材料，包括抛光材料的介质，以及形成和使用抛光材料和介质的方法。示例性的抛光材料具有相对较高的硬链段：软链段比率并且表现出较高的去除速率和/或相对高的工艺产率。

5. 发明申请

WO2014018170A1 NON-PLANAR GLASS POLISHING PAD AND METHOD OF MANUFACTURE 审中-公开
标题翻译：非平面玻璃抛光垫及其制造方法
公开(公告)号：WO2014018170A1
公开(公告)日：2014-01-30
申请号：PCT/US2013/044949
申请日：2013-06-10
申请人： JH RHODES COMPANY, INC.
发明人： MUNCY, Brent , ANDERSON, James , DASKIEWICH, Scott, B. , WASILCZYK, George, James
IPC分类号： B24B37/26
CPC分类号： B24B13/02 , B24B7/24 , B24B37/26 , B24D13/14
摘要： A polishing pad, for polishing of a work piece having portions that are non-planar, the polishing pad comprising a first side and a second side of the polishing pad. The first side is substantially flat, and the second side is configured to polish the non-planar work piece. The polishing pad further comprises a concentric annular channel in the polishing pad, wherein the concentric annular channel comprises a channel surface, wherein the second side of the polishing pad comprises an inner surface, the channel surface, and an outer surface, and wherein the channel surface is recessed relative to the inner surface and outer surface. The polishing pad further comprises a plurality of islands located within the concentric annular channel, wherein the islands comprise an island surface that is raised relative to the channel surface.
摘要翻译：一种用于抛光具有非平面部分的工件的抛光垫，所述抛光垫包括所述抛光垫的第一侧和第二侧。第一侧基本平坦，第二侧被配置成抛光非平面工件。所述抛光垫还包括所述抛光垫中的同心环形通道，其中所述同心环形通道包括通道表面，其中所述抛光垫的第二侧包括内表面，所述通道表面和外表面，并且其中所述通道表面相对于内表面和外表面凹陷。抛光垫还包括位于同心环形通道内的多个岛，其中岛包括相对于通道表面升高的岛表面。

6. 发明申请

WO2006093670A3 POLISHING PAD FOR USE IN POLISHING WORK PIECES 审中-公开
标题翻译：抛光垫用于抛光工作
公开(公告)号：WO2006093670A3
公开(公告)日：2007-01-18
申请号：PCT/US2006005332
申请日：2006-02-15
申请人： JH RHODES COMPANY INC , THOMSON CLIFFORD O , DASKIEWICH SCOTT BENJAMIN , HALBERG E DWAINE
发明人： THOMSON CLIFFORD O , DASKIEWICH SCOTT BENJAMIN , HALBERG E DWAINE
IPC分类号： B24B37/04 , B24D13/14
CPC分类号： B24B37/26
摘要： A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.
摘要翻译：提出了一种用于CMP和其他抛光和研磨操作的抛光/研磨垫，其包括多个通道，其设计成便于将浆料操纵在正在平坦化的晶片上的特定位置。

7. 发明申请

WO2007025226A1 POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PADS 审中-公开
标题翻译：抛光垫和制造抛光垫的方法
公开(公告)号：WO2007025226A1
公开(公告)日：2007-03-01
申请号：PCT/US2006/033392
申请日：2006-08-25
申请人： JH RHODES COMPANY, INC. , THOMSON, Clifford, O. , DASKIEWICH, Scott, B. , DOYLE, Jeffrey, C.
发明人： THOMSON, Clifford, O. , DASKIEWICH, Scott, B. , DOYLE, Jeffrey, C.
IPC分类号： B24B37/04 , B24B7/22 , B24D18/00 , B24D13/14 , B24D3/34
CPC分类号： B24B37/245 , B24D3/34 , B24D18/0009
摘要： A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and abrasive particles together; wherein the abrasive particles have an average diameter of between 1 nanometer and 100 nanometers in diameter, and wherein the abrasive particles comprise more than about 3% by weight of the polishing pad; mixing a curative with the mixed pre-polymer and particles; and pouring the mixture of pre-polymer, particles and curative into a mold. In one exemplary embodiment the particles are silica and the pre-polymer is a polyurethane pre-polymer.
摘要翻译：一种抛光垫，其包括平均直径在1纳米到100纳米之间的颗粒，其中颗粒的总重量大于垫的总重量的约3％。另外，制造抛光垫的方法包括以下步骤：将预聚物和磨料颗粒混合在一起; 其中所述磨料颗粒具有直径在1纳米到100纳米之间的平均直径，并且其中所述磨料颗粒占所述抛光垫的大于约3重量％将固化剂与混合的预聚物和颗粒混合; 并将预聚物，颗粒和固化剂的混合物倒入模具中。在一个示例性实施方案中，颗粒是二氧化硅，预聚物是聚氨酯预聚物。

8. 发明申请

WO2006093670A2 POLISHING PAD FOR USE IN POLISHING WORK PIECES 审中-公开
标题翻译：抛光垫用于抛光工作
公开(公告)号：WO2006093670A2
公开(公告)日：2006-09-08
申请号：PCT/US2006/005332
申请日：2006-02-15
申请人： JH RHODES COMPANY, INC. , THOMSON, Clifford, O. , DASKIEWICH, Scott, Benjamin , HALBERG, E., Dwaine
发明人： THOMSON, Clifford, O. , DASKIEWICH, Scott, Benjamin , HALBERG, E., Dwaine
IPC分类号： B24B37/04 , B24D13/14
CPC分类号： B24B37/26
摘要： A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.
摘要翻译：提出了一种用于CMP和其他抛光和研磨操作的抛光/研磨垫，其包括多个通道，其设计成便于将浆料操纵在正在平坦化的晶片上的特定位置。

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