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    • 5. 发明申请
    • LOW REFRACTIVE INDEX POLYMERS AS UNDERLAYERS FOR SILICON-CONTAINING PHOTORESISTS
    • 低折射率聚合物作为含硅光电子器件的底层
    • WO2006096221A1
    • 2006-09-14
    • PCT/US2005/043210
    • 2005-11-30
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONHUANG, Wu-songBURNS, SeanKHOJASTEH, Mahmoud
    • HUANG, Wu-songBURNS, SeanKHOJASTEH, Mahmoud
    • G03C1/76
    • G03F7/094G03F7/091
    • A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: formula (I), (II), (III), (IV), where each R 1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moietry; R 2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is / or less. The organic moiety mentioned above may be a substituted or unsubtituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof. The compositions are suitable for use as planarizing underlayer in a multilayer lithographic process, including a trilayer lothographic process.
    • 公开了具有高耐蚀刻性和改善的光学性能的新型底层组合物。 底层组合物包含乙烯基或丙烯酸酯聚合物,例如甲基丙烯酸酯聚合物,该聚合物包含至少一个取代或未取代的萘或萘酚部分,包括其混合物。 本发明的聚合物的实例包括:式(I),(II),(III),(IV),其中每个R 1独立地选自有机部分或卤素; 每个A独立地是单键或有机溶剂; R 2是氢或甲基; 并且每个X,Y和Z为0至7的整数,Y + Z为/或更小。 上述有机部分可以是选自直链或支链烷基,卤代直链或支链烷基,芳基,卤代芳基,环状烷基和卤代环状烷基的取代或未取代的烃及其任何组合。 该组合物适用于在多层平版印刷工艺中的平面化底层,包括三层薄膜工艺。
    • 6. 发明申请
    • DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS
    • 可开发的底部抗反射涂层组合物
    • WO2013023124A3
    • 2013-07-11
    • PCT/US2012050267
    • 2012-08-10
    • IBMCHEN KUANG-JUNGHOLMES STEVEN JHUANG WU-SONGLIU SEN
    • CHEN KUANG-JUNGHOLMES STEVEN JHUANG WU-SONGLIU SEN
    • G03F7/004C09D133/04G03F7/039G03F7/09
    • G03F7/0382C09J133/14G03F7/091G03F7/094G03F7/095
    • A negative developable bottom antireflective coating (NDBARC) material includes a polymer containing an aliphatic alcohol moiety, an aromatic moiety, and a carboxylic acid moiety. The NDBARC composition is insoluble in a typical resist solvent such as propylene glycol methyl ether acetate (PGMEA) after coating and baking. The NDBARC material also includes a photoacid generator, and optionally a crosslinking compound. In the NDBARC material, the carboxylic acid provides the developer solubility, while the alcohol alone, the carboxylic acid alone, or their combination provides the PGMEA resistance. The NDBARC material has resistance to the resist solvent, and thus, intermixing does not occur between NDBARC and resist during resist coating over NDBARC. After exposure and bake, the lithographically exposed portions of both the negative photoresist (30E) and the NDBARC layer (20E) become insoluble in developer due to the chemically amplified crosslinking of the polymers in negative resist and NDBARC layer in the lithographically exposed portions.
    • 负显影底部抗反射涂层(NDBARC)材料包括含有脂族醇部分,芳族部分和羧酸部分的聚合物。 NDBARC组合物在涂布和烘烤后不溶于典型的抗蚀剂溶剂如丙二醇甲基醚乙酸酯(PGMEA)。 NDBARC材料还包括光致酸发生剂和任选的交联化合物。 在NDBARC材料中,羧酸提供了显影剂的溶解度,而单独的醇,单独的羧酸或它们的组合提供了PGMEA的抗性。 NDBARC材料对抗蚀剂溶剂具有抗性,因此在NDBARC的抗蚀涂层期间,NDBARC和抗蚀剂之间不会发生混合。 在曝光和烘烤之后,由于在光刻曝光部分中的负光刻胶和NDBARC层中的聚合物的化学扩展交联,负光致抗蚀剂(30E)和NDBARC层(20E)的光刻曝光部分变得不溶于显影剂。
    • 8. 发明申请
    • SI-CONTAINING POLYMERS FOR NANO-PATTERN DEVICE FABRICATION
    • 用于纳米图案装置制造的含SI聚合物
    • WO2008055137A3
    • 2008-08-14
    • PCT/US2007082967
    • 2007-10-30
    • IBMCHEN KUANG-JUNGHUANG WU-SONGLI WAI-KINLIN YI-HSIUNG S
    • CHEN KUANG-JUNGHUANG WU-SONGLI WAI-KINLIN YI-HSIUNG S
    • C08G18/66
    • G03F7/0758G03F7/0045
    • A resist polymer (22) that has nano-scale patterns of sub-lithographic openings (26) located therein that are oriented substantially perpendicular to its major surfaces is provided. Such a resist polymer having the nano-scale patterns is used as an etch mask transferring nano-scale patterns to an underlying substrate such as, for example, dielectric material (12). After the transferring of the nano-scale patterns into the substrate, nano-scale openings having a width of less than 50 nm are created in the substrate. The presence of the nano-scale voids in a dielectric material lowers the dielectric constant, k, of the original dielectric material. In accordance with an aspect of the present invention, the inventive resist polymer comprises a copolymer that includes a first monomer unit (A) that contains a Si-containing component, and a second monomer unit (B) that contains an organic component, wherein said two monomer units (A and B) have different etch rates.
    • 提供了一种抗蚀剂聚合物(22),其具有位于其中的基本上垂直于其主表面取向的纳米级图案的亚光刻开口(26)。 具有纳米级图案的这种抗蚀剂聚合物被用作将纳米级图案转移到下面的基底例如介电材料(12)的蚀刻掩模。 在将纳米级图案转移到衬底中之后,在衬底中产生宽度小于50nm的纳米级开口。 介电材料中纳米级空隙的存在降低了原始介电材料的介电常数k。 根据本发明的一个方面,本发明的抗蚀剂聚合物包含共聚物,该共聚物包含含有含Si组分的第一单体单元(A)和含有有机组分的第二单体单元(B),其中所述 两个单体单元(A和B)具有不同的蚀刻速率。