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    • 4. 发明申请
    • ELECTRONICS PATCH HAVING ULTRA THIN ADHESIVE LAYER
    • 具有超薄粘合层的电子配件
    • WO2011040921A1
    • 2011-04-07
    • PCT/US2009/059120
    • 2009-09-30
    • SOCIETE DE TECHNOLOGIE MICHELINMICHELIN RECHERCHE ET TECHNIQUE S.A.HOTALING, Elizabeth, L.SINNETT, Jay, C.
    • HOTALING, Elizabeth, L.SINNETT, Jay, C.
    • B60C23/04
    • B60C23/0493B29D2030/0072
    • An electronic patch comprising a patch body composed of a cured rubber composition and having an electronics component mounted thereto, the patch body comprising a bottom surface for bonding the electronics patch to an article. Also included is an adhesive layer of an uncured rubber composition applied to the patch bottom surface, wherein the adhesive layer is no more than 0.3 mm thick and is curable between 18 °C and 26 °C over 20 hours and 48 hours. A removable protective film may be applied to a bonding surface of the adhesive layer, wherein the protective film is removed prior to applying the patch to the article. A method is provided, including applying a vulcanizing agent to an interior surface of the tire and applying the electronics patch over the vulcanizing agent, wherein the protective film on the patch is removed prior to applying the electronics patch to the tire.
    • 一种电子贴片,其包括由固化的橡胶组合物组成并具有安装在其上的电子部件的贴片主体,所述贴片主体包括用于将电子贴片接合到制品的底表面。 还包括涂敷在贴片底面上的未固化的橡胶组合物的粘合剂层,其中粘合剂层不超过0.3mm厚,并且可在20℃和48小时内在18℃和26℃之间固化。 可以将可移除的保护膜施加到粘合剂层的粘合表面上,其中在将贴剂施加到制品之前去除保护膜。 提供了一种方法,包括将硫化剂施加到轮胎的内表面并将电子贴片涂覆在硫化剂上,其中在将电子贴片施加到轮胎之前,去除贴片上的保护膜。