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    • 1. 发明申请
    • TEXTURE-ETCHANT COMPOSITION FOR A CRYSTALLINE SILICON WAFER, AND TEXTURE-ETCHING METHOD
    • 用于晶体硅水晶的纹理蚀刻组合物和纹理蚀刻方法
    • WO2012144733A3
    • 2012-12-20
    • PCT/KR2012001685
    • 2012-03-08
    • DONGWOO FINE CHEM CO LTDHONG HYUNG PYOLEE JAE YUNPARK MYUN KYU
    • HONG HYUNG PYOLEE JAE YUNPARK MYUN KYU
    • C09K13/02H01L21/306
    • C09K13/02
    • The present invention relates to a texture-etchant composition for a crystalline silicon wafer, and to a texture-etching method. More particularly, the present invention relates to a texture-etchant composition for a crystalline silicon wafer and to a texture-etchant method, the composition comprising: an alkali compound; a cyclic compound to which a functional group including a C2-C6 alkene group is attached and which contains a nitrogen atom; and the remainder being water. The composition can enable the formation of a micro-pyramid, the shape of which is different from the conventional shape, by adjusting an etching rate with respect to a silicon crystalline direction, and can further increase light efficiency by maximizing the amount of sunlight absorbed and significantly reducing the reflectance of light by improving texture uniformity.
    • 本发明涉及结晶硅晶片的纹理蚀刻剂组合物和纹理蚀刻方法。 更具体地说,本发明涉及一种用于晶体硅晶片的纹理蚀刻剂组合物和一种纹理蚀刻剂方法,该组合物包含:碱性化合物; 包含C2-C6烯烃基的官能团并含有氮原子的环状化合物; 剩下的是水。 通过调整相对于硅晶体方向的蚀刻速度,可以形成其形状与常规形状不同的微金字塔,并且可以通过最大化吸收的阳光的量来进一步提高光效率, 通过改善纹理均匀性来显着降低光的反射率。