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1. 发明申请

WO1992008592A1 CONTROLLED GAS FLOW FOR SELECTIVE LASER SINTERING 审中-公开
标题翻译：用于选择性激光烧结的控制气体流
公开(公告)号：WO1992008592A1
公开(公告)日：1992-05-29
申请号：PCT/US1991008351
申请日：1991-11-08
申请人： DTM CORPORATION , GRUBE, Kris, W. , FORDERHASE, Paul, F. , CARR, Brian, J. , DECKARD, Carl, R. , ROGGE, William, E.
发明人： DTM CORPORATION
IPC分类号： B29C35/08
CPC分类号： B29C67/04 , B22F3/1055 , B22F2003/1056 , B29C35/16 , B29C64/153 , B29C2035/0838 , B29K2105/251 , B33Y10/00 , B33Y30/00 , Y02P10/295
摘要： An apparatus for fabricating parts by selective laser sintering is disclosed, which includes a baffle (40) for directing gas at the target surface (4). The gas is preferably controlled in temperature to cool, by convection, a layer of heat-fusible powder after it has been selectively laser sintered, to the temperature of the part formed in prior layers. The cooling preferably occurs prior to the application of the next layer of powder. The baffle (40) directs gas flow towards the center of the target surface (4), and exhaust ports are provided on multiple sides of the target surface (4) so that the gas flow is substantially symmetric at the target surface (4). A ring exhaust hood (54) may be suspended over the target surface, so that uniform gas flow may result and so that powder may be disposed over the target surface by way of a counter-rotating roller (18). The baffle (40) may direct the gas directly at the target surface, or may be constructed so that the gas spirals toward the target surface (4) in cyclonic fashion; further alternative baffles can be used to direct the gas at the target surface in a non-uniform, fashion, including turbulent or arbitrary flow patterns.
摘要翻译：公开了一种用于通过选择性激光烧结制造零件的装置，其包括用于在目标表面（4）处引导气体的挡板（40）。优选将气体控制在温度下，通过对流将一层热熔粉末选择性地激光烧结后冷却到现有层中形成的部件的温度。冷却优选在施加下一层粉末之前进行。挡板（40）引导气流朝向目标表面（4）的中心，并且排气口设置在目标表面（4）的多个侧面上，使得气流在目标表面（4）处基本对称。环形排气罩（54）可以悬挂在目标表面上，使得可能导致均匀的气体流动，使得粉末可以通过反向旋转辊（18）设置在目标表面上。挡板（40）可以将气体直接引导到目标表面，或者可以被构造成使得气体以气旋方式朝向目标表面（4）螺旋; 可以使用另外的替代挡板来以不均匀的方式引导目标表面处的气体，包括湍流或任意的流动模式。

2. 发明申请

WO2008005541A2 CLEAN IGNITION SYSTEM FOR WAFER SUBSTRATE PROCESSING 审中-公开
标题翻译：清洗基层加工清洁点火系统
公开(公告)号：WO2008005541A2
公开(公告)日：2008-01-10
申请号：PCT/US2007/015589
申请日：2007-07-06
申请人： ACCRETECH USA, INC. , BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
发明人： BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67126 , H01L21/68735
摘要： An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate. A clean ignition system is used to ignite the combustion flame.
摘要翻译：公开了一种基板处理装置的边缘区域。正在处理的边缘区域与基板的其余部分分离，通过使惰性气体流通过待处理区域附近的增压室，从而形成屏障，同时将反应物流的流动相对于顶部表面成一定角度基板朝向基板边缘区域，从而处理基板边缘区域。含氧气体流入处理室以及负排气压力可能有助于反应物质和其他气体偏离衬底的非处理区域的偏置。使用干净的点火系统点燃燃烧火焰。

3. 发明申请

WO2008005539A3 APPARATUS FOR CLEANING A WAFER SUBSTRATE 审中-公开
公开(公告)号：WO2008005539A3
公开(公告)日：2008-01-10
申请号：PCT/US2007/015586
申请日：2007-07-06
申请人： ACCRETECH USA, INC. , BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
发明人： BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
IPC分类号： H01L21/304
摘要： A method and apparatus for dry chemical processing a wafer at atmospheric pressure is disclosed. The edge area of a substrate is placed in isolation from the remainder of the substrate. According to the present teachings, a method for centering a wafer on a rotatable chuck is provided. The method includes the steps of positioning a wafer adjacent to a micrometer. The wafer is then rotated and a plurality of wafer edge locations and rotational increments are measured. A center offset value for the value of the wafer center with respect to a chuck is calculated. The wafer is then moved with respect to a center position of the chuck.

4. 发明申请

WO2009021207A2 APPARATUS AND METHOD FOR WAFER EDGE EXCLUSION MEASUREMENT 审中-公开
标题翻译：用于波形边缘排除测量的装置和方法
公开(公告)号：WO2009021207A2
公开(公告)日：2009-02-12
申请号：PCT/US2008072683
申请日：2008-08-08
申请人： ACCRETECH USA INC , JIN JU , SADAM SATISH , VERMA VISHAL , HUANG ZHIYAN , LIN SIMING , ROBBINS MICHAEL D , FORDERHASE PAUL F
发明人： JIN JU , SADAM SATISH , VERMA VISHAL , HUANG ZHIYAN , LIN SIMING , ROBBINS MICHAEL D , FORDERHASE PAUL F
IPC分类号： H01L21/66
CPC分类号： G01N21/4738 , G01N21/9503
摘要： A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. An automatic defect characterization processor is provided.
摘要翻译：衬底照明和检查系统提供用于照明和检查衬底，特别是衬底边缘。该系统使用具有设置在其外部或内部的多个光的光漫射器，用于提供衬底的均匀漫射照明。光扩散器的光学和成像系统外部用于检查包括镜面的基板的多个表面。提供自动缺陷表征处理器。

5. 发明申请

WO2007133330A3 SUBSTRATE ILLUMINATION AND INSPECTION SYSTEM 审中-公开
标题翻译：基板照明和检查系统
公开(公告)号：WO2007133330A3
公开(公告)日：2008-05-02
申请号：PCT/US2007006558
申请日：2007-03-15
申请人： ACCRETECH USA INC , ROBBINS MICHAEL D , FORDERHASE PAUL F , BAILEY JOEL B , NGUYEN KEVIN
发明人： ROBBINS MICHAEL D , FORDERHASE PAUL F , BAILEY JOEL B , NGUYEN KEVIN
IPC分类号： G01N31/00
CPC分类号： G01N21/9503 , G01N21/4738
摘要： A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. The optic is held at an angle from a surface normal to avoid reflective artifacts from the specular surface of the substrate. The optic can be rotated radially relative to a center point of the substrate edge to allow for focused inspection of all surfaces of the substrate edge. The plurality of lights can modulate color and intensity of light to enhance inspection of the substrate for defects.
摘要翻译：衬底照明和检查系统提供用于照明和检查衬底，特别是衬底边缘。该系统使用具有设置在其外部或内部的多个光的光漫射器，用于提供衬底的均匀漫射照明。光扩散器的光学和成像系统外部用于检查包括镜面的基板的多个表面。光学元件保持与表面法线成一定角度，以避免来自基板的镜面的反射伪影。光学元件可以相对于基板边缘的中心点径向旋转，以允许对基板边缘的所有表面进行聚焦检查。多个光可以调制光的颜色和强度，以增强基板对缺陷的检查。

6. 发明申请

WO2008005517A1 PROCESSING CHAMBER HAVING LABYRINTH SEAL 审中-公开
标题翻译：具有乳胶密封的加工室
公开(公告)号：WO2008005517A1
公开(公告)日：2008-01-10
申请号：PCT/US2007/015551
申请日：2007-07-06
申请人： ACCRETECH USA, INC. , BAILEY, Joel, Brad , HURET, Jean-Michel, Claude , FORDERHASE, Paul, F. , SADAM, Satish , STRATTON, Scott, Allen , ROBBINS, Michael, D.
发明人： BAILEY, Joel, Brad , HURET, Jean-Michel, Claude , FORDERHASE, Paul, F. , SADAM, Satish , STRATTON, Scott, Allen , ROBBINS, Michael, D.
IPC分类号： H01L21/304 , H01L21/02
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67126 , H01L21/68735
摘要： An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate. A seal arrangement is provided for the processing chamber.
摘要翻译：公开了一种基板处理装置的边缘区域。正在处理的边缘区域与基板的其余部分分离，通过使惰性气体流通过待处理区域附近的增压室，从而形成屏障，同时将反应物流的流动相对于顶部表面成一定角度基板朝向基板边缘区域，从而处理基板边缘区域。含氧气体流入处理室以及负排气压力可能有助于反应物质和其他气体偏离衬底的非处理区域的偏置。为处理室提供密封装置。

7. 发明申请

WO2009021202A3 APPARATUS AND METHOD FOR WAFER EDGE DEFECTS DETECTION 审中-公开
标题翻译：检测边缘缺陷的装置和方法
公开(公告)号：WO2009021202A3
公开(公告)日：2009-04-09
申请号：PCT/US2008072673
申请日：2008-08-08
申请人： ACCRETECH USA INC , JIN JU , SADAM SATISH , VERMA VISHAL , HUANG ZHIYAN , LIN SIMING , ROBBINS MICHAEL D , FORDERHASE PAUL F
发明人： JIN JU , SADAM SATISH , VERMA VISHAL , HUANG ZHIYAN , LIN SIMING , ROBBINS MICHAEL D , FORDERHASE PAUL F
IPC分类号： H01L21/66
CPC分类号： G01N21/9503 , G01N2021/8861
摘要： A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system a image processor to automatically detect and characterize defects on the wafer's edge.
摘要翻译：衬底照明和检查系统提供用于照明和检查衬底，特别是衬底边缘。该系统用于自动检测和表征晶圆边缘缺陷的图像处理器。

8. 发明申请

WO2008005540A3 METHOD AND APPARATUS FOR CLEANING A WAFER SUBSTRATE 审中-公开
标题翻译：清洗基片的方法和装置
公开(公告)号：WO2008005540A3
公开(公告)日：2008-02-21
申请号：PCT/US2007015588
申请日：2007-07-06
申请人： ACCRETECH USA INC , BAILEY JOEL BRAD , HURET JEAN-MICHEL CLAUDE , FORDERHASE PAUL F , SADAM SATISH , STRATTON SCOTT ALLEN , ROBBINS MICHAEL D
发明人： BAILEY JOEL BRAD , HURET JEAN-MICHEL CLAUDE , FORDERHASE PAUL F , SADAM SATISH , STRATTON SCOTT ALLEN , ROBBINS MICHAEL D
IPC分类号： H01L21/304
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67126 , H01L21/68735
摘要： An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate.
摘要翻译：公开了一种基板处理装置的边缘区域。正在处理的边缘区域与基板的其余部分分离，通过使惰性气体流通过待处理区域附近的增压室，从而形成屏障，同时将反应物流的流动相对于顶部表面成一定角度基板朝向基板边缘区域，从而处理基板边缘区域。含氧气体流入处理室以及负排气压力可能有助于反应物质和其他气体偏离衬底的非处理区域的偏置。

9. 发明申请

WO2008005540A2 METHOD AND APPARATUS FOR CLEANING A WAFER SUBSTRATE 审中-公开
标题翻译：清洗晶片衬底的方法和设备
公开(公告)号：WO2008005540A2
公开(公告)日：2008-01-10
申请号：PCT/US2007/015588
申请日：2007-07-06
申请人： ACCRETECH USA, INC. , BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
发明人： BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott Allen , ROBBINS, Michael D.
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67126 , H01L21/68735
摘要： An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate.
摘要翻译：公开了基板处理装置的边缘区域。通过引导惰性气体流通过靠近待处理区域的充气室，从而形成阻挡层，同时引导活性物质流相对于顶部表面成角度，从而将正在处理的边缘区域与衬底的其余部分隔离朝向基板边缘区域的基板因此处理基板边缘区域。含氧气体与负排气压力一起流入处理室可有助于偏离基板的非处理区域的反应性物质和其他气体。

10. 发明申请

WO2008005521A1 WAFER PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译： WAFER加工设备和方法
公开(公告)号：WO2008005521A1
公开(公告)日：2008-01-10
申请号：PCT/US2007/015556
申请日：2007-07-06
申请人： ACCRETECH USA, INC. , BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott, Allen , ROBBINS, Michael D.
发明人： BAILEY, Joel Brad , HURET, Jean-Michel Claude , FORDERHASE, Paul F. , SADAM, Satish , STRATTON, Scott, Allen , ROBBINS, Michael D.
IPC分类号： H01L21/205
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67126 , H01L21/68735
摘要： An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate.
摘要翻译：公开了一种基板处理装置的边缘区域。正在处理的边缘区域与基板的其余部分分离，通过使惰性气体流通过待处理区域附近的增压室，从而形成屏障，同时将反应物流的流动相对于顶部表面成一定角度基板朝向基板边缘区域，从而处理基板边缘区域。含氧气体流入处理室以及负排气压力可能有助于反应物质和其他气体偏离衬底的非处理区域的偏置。

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