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    • 10. 发明申请
    • PLASMA ASHING APPARATUS AND ENDPOINT DETECTION PROCESS
    • 等离子体吸附装置和端点检测过程
    • WO2004107413A3
    • 2006-02-16
    • PCT/US2004016075
    • 2004-05-21
    • AXCELIS TECH INCSRIVASTAVA ASEEMSAKTHIVEL PALANIKUMARANBUCKLEY THOMAS
    • SRIVASTAVA ASEEMSAKTHIVEL PALANIKUMARANBUCKLEY THOMAS
    • G03F7/42H01J37/32H01L21/00
    • H01L21/67253G03F7/427H01J37/32357H01J37/32834H01J37/32935H01J2237/3342H01L21/67069
    • A plasma ashing apparatus (10) for removing organic matter from a substrate including a low k dielectric, comprising a first gas source (12); a plasma generating component (14) in fluid communication with the first gas source; a process chamber (16) in fluid communication with the plasma generating component; an exhaust conduit (170) in fluid communication with the process chamber; wherein the exhaust conduit comprises an inlet (180) for a second gas source and an afterburner assembly (178) coupled to the exhaust conduit, wherein the inlet is disposed intermediate to the process chamber and an afterburner assembly, and wherein the afterburner assembly comprises means (183, 186, 188) for generating a plasma within the exhaust conduit with or without introduction of a gas from the second gas source; and an optical emission spectroscopy device (192, 194) coupled to the exhaust conduit comprising collection optics (192) focused within a plasma discharge region of the afterburner assembly. An endpoint detection process for an oxygen free and nitrogen free plasma process comprises monitoring an optical emission signal of an afterburner excited species in an exhaust conduit of the plasma asher apparatus. The process and apparatus can be used with carbon and/or hydrogen containing low k dielectric materials.
    • 一种用于从包括第一气体源(12)的包括低k电介质的衬底去除有机物质的等离子体灰化设备(10)。 与所述第一气体源流体连通的等离子体产生部件(14); 与所述等离子体产生部件流体连通的处理室(16); 与处理室流体连通的排气导管(170); 其中所述排气管道包括用于第二气体源的入口(180)和联接到所述排气管道的后燃烧器组件(178),其中所述入口设置在所述处理室和加力燃烧器组件的中间,并且其中所述后燃烧器组件包括装置 (183,186,188),用于在排气管道内产生等离子体,同时或不引入来自第二气体源的气体; 以及耦合到所述排气导管的光发射光谱装置(192,194),其包括聚焦在所述后燃器组件的等离子体放电区域内的收集光学器件(192)。 用于无氧和无氮等离子体工艺的端点检测方法包括监测等离子体灰化装置的排气管道中的后燃器激发物质的光发射信号。 该方法和装置可以与含有低k电介质材料的碳和/或氢一起使用。