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    • 7. 发明申请
    • LIGHT-EMITTING-DIODE CHIP PACKAGE AND A COLLIMATOR
    • 发光二极管芯片包装和收缩机
    • WO2005109529A1
    • 2005-11-17
    • PCT/IB2005/051444
    • 2005-05-03
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.BECKERS, Lucas, J., A., M.
    • BECKERS, Lucas, J., A., M.
    • H01L33/00
    • H01L33/60H01L33/486H01L33/64H01L2924/0002H01L2924/00
    • A high-temperature light-emitting-diode chip package has a base (1), at least one light-emitting-diode chip (2) disposed on the base, and a collimator (5) for collimating the light emitted by the light-emitting-diode chip. The collimator and the base are made from a ceramic material capable of withstanding temperatures above 250°C. Preferably, the ceramic material is aluminum oxide, aluminum nitride, or aluminum silicate. Preferably, the collimator is made from or is coated with mullite, 3Al 2 O 3 .2SiO 2 , with a diffuse reflectivity above 99%. Preferably, the light-emitting-diode chip package comprises a light-coupling medium (8) for transferring light from the light-emitting-diode chip to the collimator, the light-coupling medium (8) being made of glass.
    • 高温发光二极管芯片封装具有底座(1),设置在基座上的至少一个发光二极管芯片(2)和用于准直由发光二极管芯片发射的光的准直器(5) 发光二极管芯片。 准直器和基座由能承受高于250℃的温度的陶瓷材料制成。 优选地,陶瓷材料是氧化铝,氮化铝或硅酸铝。 优选地,准直器由扩散反射率高于99%的莫来石,3Al2O3.2SiO2制成或涂覆。 优选地,发光二极管芯片封装包括用于将光从发光二极管芯片传输到准直器的光耦合介质(8),光耦合介质(8)由玻璃制成。