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1. 发明申请

WO2020056754A1 AN APPARATUS AND METHOD FOR REMOVING PERTURBATION SIGNAL FROM A SERIAL DATA STREAM, AND TO MEASURMENT AND/OR PROTECTION APPARATUS INCLUDING SUCH A SIGNAL REMOVING APPARATUS 审中-公开
公开(公告)号：WO2020056754A1
公开(公告)日：2020-03-26
申请号：PCT/CN2018/107082
申请日：2018-09-21
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY , WANG, Long
发明人： WANG, Long , HOLLAND, William , DANESH, Seyed Amir Ali
IPC分类号： H04B1/10
摘要： An apparatus is provided which substantially removes a perturbation signal from a pulse density modulated signal representing a combination of a signal to be measured and a perturbation applied to the signal to be measured. The removal of the perturbation is done by subtracting a correcting signal from the pulse density modulated signal. This approach introduces very little delay as it can be implemented by simple logic gates. It also provided enhanced immunity from the effects of bit errors.

2. 发明申请

WO2019162285A1 CORRELATED DOUBLE SAMPLING ANALOG-TO-DIGITAL CONVERTER 审中-公开
公开(公告)号：WO2019162285A1
公开(公告)日：2019-08-29
申请号：PCT/EP2019/054130
申请日：2019-02-19
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： RAJASEKHAR, Sanjay , MAURINO, Roberto Sergio Matteo
IPC分类号： H03M1/08 , H03M1/16 , H03M1/80
摘要： Techniques are described tocancel kT/C sampling noise and residue amplifier sampling noise while also reducing power consumption in a pipelined analog-to-digital converter circuit.

3. 发明申请

WO2019091917A1 CURRENT STEERING DIGITAL TO ANALOG CONVERTER 审中-公开
公开(公告)号：WO2019091917A1
公开(公告)日：2019-05-16
申请号：PCT/EP2018/080172
申请日：2018-11-05
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： DOWNEY, Fergus
IPC分类号： H03M1/06 , H03M1/74 , H03M1/78
摘要： Digital to analog converter architectures are disclosed that enable the binary scaling of transistor sized to be replaced by transistors of substantially the same size. This significantly reduced the size of the Digital to Analog converter on a wafer. As the currents from the lesser bits of the converter may be very small indeed, some of the transistors are operated in a regime where the gate-source voltage applied to the transistor is below the threshold voltage for the device, the threshold voltage generally being regarded as marking the onset of significant conduction through a filed effect transistor.

4. 发明申请

WO2019048537A1 METHOD AND APPARATUS FOR CURRENT MEASUREMENT IN POLYPHASE ELECTRICITY SUPPLY 审中-公开
公开(公告)号：WO2019048537A1
公开(公告)日：2019-03-14
申请号：PCT/EP2018/073984
申请日：2018-09-06
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： HURWITZ, Jonathan , HOLLAND, William , DANESH, Seyed
IPC分类号： G01R35/04 , G01R21/133 , G01R35/02 , G01R19/25 , G01R15/20 , G01R19/00 , G01R21/14 , G01R19/32
CPC分类号： G01R15/202 , G01R1/203 , G01R15/146 , G01R15/207 , G01R19/0092 , G01R19/2509 , G01R19/32 , G01R21/08 , G01R21/133 , G01R21/14 , G01R33/3607 , G01R35/02 , G01R35/04
摘要： A measurement circuit is arranged to make several measurements, either at different times or in respect of different frequency components of currents measured by current sensors in respective phases of a multiphase supply system. The measurments are then used to correct for discrepencies in the transfer function of the sensors.

5. 发明申请

WO2018229028A1 DIFFUSION TEMPERATURE SHOCK MONITOR 审中-公开
公开(公告)号：WO2018229028A1
公开(公告)日：2018-12-20
申请号：PCT/EP2018/065444
申请日：2018-06-12
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： COYNE, Edward John
IPC分类号： G01K3/00 , G01K3/04 , G01K7/01
摘要： A temperature shock monitor includes a solvent material and a diffusion material. An energy barrier between the solvent material and the diffusion material is selected to be lower than is would conventionally be used in semiconductor devices such that the diffusion material diffuses into the solvent material when exposed to a temperature above a designated temperature threshold. At a later time, electrical parameters of the temperature shock monitor that change based on the amount of diffusion of the diffusion material into the solvent material allows one to determine whether the temperature shock monitor was exposed to a temperature above the temperature threshold.

6. 发明申请

WO2018127793A1 DEVICES AND METHODS FOR SMART SENSOR APPLICATION 审中-公开
公开(公告)号：WO2018127793A1
公开(公告)日：2018-07-12
申请号：PCT/IB2018/000278
申请日：2018-01-08
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： QU, GuangYang , LIU, Yincai, Tony , HAO, Baotian , WANG, Hanqing , MEI, Hengfang , LUO, Rengui , ZHAO, Yimiao , DING, Junbiao
IPC分类号： G01R31/28 , G01R27/16 , G01R35/00 , G01R27/02 , G01N27/406 , G01N27/417
摘要： An apparatus comprises a load resistance connectable in series with the electronic sensor to form a series resistance of the load resistance and the internal impedance of the electronic sensor; an excitation circuit configured to apply a predetermined voltage to a circuit element; and a measurement circuit configured to: initiate applying the predetermined voltage to the series resistance and determining the series resistance; initiate applying the predetermined voltage to the load resistance and determining the load resistance; and calculate the internal impedance of the sensor using the determined series resistance and the load resistance, and provide the calculated internal impedance to a user or process.

7. 发明申请

WO2018037284A1 METHODS OF MANUFACTURE OF AN INDUCTIVE COMPONENT AND AN INDUCTIVE COMPONENT 审中-公开
标题翻译：制造诱导组分和诱导组分的方法
公开(公告)号：WO2018037284A1
公开(公告)日：2018-03-01
申请号：PCT/IB2017/001177
申请日：2017-08-24
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： KUBIK, Jan , STENSON, Bernard, Patrick , GEARY, Shane, Patrick , MORRISSEY, Michael, Noel
IPC分类号： H01F27/28 , H01F41/04
CPC分类号： H01F41/041 , H01F1/0315 , H01F27/2804 , H01F41/0206 , H01F41/046 , H01F2027/2809 , H01F2027/2819
摘要： The disclosure relates to the manufacture of inductive components, in particular transformers, using a combination of microfabrication techniques and discrete component placement. By using a prefabricated core, the core may be made much thicker than one that is deposited using microfabrication techniques. As such, saturation occurs later and the efficiency of the transformer is improved. This is done at a much lower cost than the cost of producing a thicker core by depositing multiple layers using microfabrication techniques.
摘要翻译：本公开涉及使用微制造技术和分立元件布置的组合来制造电感元件，特别是变压器。通过使用预制芯，芯可以比使用微细加工技术沉积的芯厚得多。如此，饱和发生在后面，并且变压器的效率提高。这是通过使用微细加工技术沉积多个层来以比生产较厚芯的成本低得多的成本完成的。

8. 发明申请

WO2019185559A2 SPARK GAP STRUCTURES FOR DETECTION AND PROTECTION AGAINST ELECTRICAL OVERSTRESS EVENTS 审中-公开
公开(公告)号：WO2019185559A2
公开(公告)日：2019-10-03
申请号：PCT/EP2019/057472
申请日：2019-03-25
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： CLARKE, David J. , HEFFERNAN, Stephen Denis , WEI, Nijun , O'DONNELL, Alan J. , MCGUINNESS, Patrick Martin , BRADLEY, Shaun , COYNE, Edward John , AHERNE, David , BOLAND, David M.
IPC分类号： G01R31/00 , H01L23/60 , H01L23/62 , H02H9/00
摘要： The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, an electrical overstress monitor and/or protection device includes a two different conductive structures configured to electrically arc in response to an EOS event and a sensing circuit configured to detect a change in a physical property of the two conductive structures caused by the EOS event.The two conductive structures have facing surfaces that have different shapes;

9. 发明申请

WO2019179957A1 CONTACTLESS CURRENT MEASUREMENT USING MAGNETIC SENSORS 审中-公开
公开(公告)号：WO2019179957A1
公开(公告)日：2019-09-26
申请号：PCT/EP2019/056734
申请日：2019-03-18
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： LERNER, Boris , DEMIRTAS, Sefa , WEINBERG, Harvey , HURWITZ, Jonathan Ephraim David , SHARMA, Yogesh Jayaraman , SCHMITT, Jochen , BLANCHARD, Paul , KALB, Arthur J.
IPC分类号： G01R15/20
摘要： Embodiments of the present disclosure provide mechanisms for measuring currents flowing in one or more conductor wires. The mechanisms are based on using magnetic sensor pairs arranged within a housing with an opening for the wires, where each magnetic sensor pair can generate a pair of signals indicative of magnetic fields in two different directions. The outputs of the sensor pairs can be used to derive a measure of current(s) flowing through the one or more wires. The use of magnetic sensor pairs that can measure magnetic field in two different directions may enable simultaneous current measurement in multiple wires placed within the opening, improve accuracy of current measurements while relaxing requirements for precise control of the placement of the wire(s), reduce the impact of stray magnetic interference, and enable both AC and DC measurements.

10. 发明申请

WO2019179785A1 SEMICONDUCTOR PACKAGES 审中-公开
公开(公告)号：WO2019179785A1
公开(公告)日：2019-09-26
申请号：PCT/EP2019/055705
申请日：2019-03-07
申请人： ANALOG DEVICES GLOBAL UNLIMITED COMPANY
发明人： BAYRAKCI, Bilge , CELIK, Abdullah , ROUND, Winslow , KUDTARKAR, Santosh , ATESAL, Yusuf , KOLCUOGLU, Turusan
IPC分类号： H01L23/66 , H01L23/498 , H01L25/065 , H05K1/18 , H05K3/32
摘要： A package (23) includes a carrier (42) that comprises a first conductive layer (51) on a first side and a second conductive layer (52) on a second side opposite the first side. The first conductive layer (51) comprises wire bonding pads (55). The package (23) also includes a semiconductor die (21) that is flip chip mounted on the first side of the carrier (42). The carrier (42) may comprise vias (54) from the first side to the second side, wherein the vias (54) receive electrical ground from the second conductive layer (52). The first conductive layer (51) may comprise traces electrically connecting the semiconductor die (21) and the wire bonding pads (55). The semiconductor die (21) may be a high frequency radio frequency (RF) die and the first conductive layer (51) may carry RF signals. The semiconductor die (21) may be a silicon-on-insulator (SOI) die. Copper pillars (24) may be placed between the semiconductor die (21) and the carrier (42). Molding material (27) may be disposed around the semiconductor die (21). The carrier (42) may comprise a laminated substrate, a ceramic substrate, or a semiconductor substrate, the semiconductor substrate comprising electronic components and semiconductor device elements or not including any such components or devices fabricated thereon. The package (23) may be attached to a board, such as a printed circuit board (PCB) (62) comprising a first conductive layer (71) and a second conductive layer (72) separated by dielectric (73), wherein the first conductive layer (71) is on a first side of the PCB (62). The PCB (62) may include a recess (65) on the first side and extending through the first conductive layer (71) and the dielectric (73) to the second conductive layer (72), wherein the carrier (42) is positioned in the recess (65) of the PCB (62), and wherein the second conductive layer (52) of the carrier (42) is electrically connected to the second conductive layer (72) of the PCB (62) in the recess (65) by an epoxy (63) that is both thermally and electrically conductive. The semiconductor die (21) may receive electrical ground from the second conductive layer (72) of the PCB (62) by way of the carrier (42). Pads (71a) on the first conductive layer (71) of the PCB (62) may be connected to corresponding pads (55) on the first conductive layer (51) of the carrier (42) by wires or ribbons (67, 68).

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