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1. 发明申请

WO2007030347A3 GROOVED PLATEN WITH CHANNELS OR PATHWAY TO AMBIENT AIR 审中-公开
公开(公告)号：WO2007030347A3
公开(公告)日：2007-03-15
申请号：PCT/US2006/033473
申请日：2006-08-29
申请人： FREESCALE SEMICONDUCTOR , BOTTEMA, Brian E. , ABRAHAM, Stephen F. , PAMATAT, Alex P.
发明人： BOTTEMA, Brian E. , ABRAHAM, Stephen F. , PAMATAT, Alex P.
IPC分类号： B24B7/00
摘要： A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the platen (130) includes one or more passageways (132) that provide a pathway to ambient or sub-ambient environment. The combination of the sealing region (131) and the passageway(s) (132) prevent liquids, vapors or other undesirable contaminants from infiltrating between the pad and platen, and also vent trapped air pockets between the pad and platen.

2. 发明申请

WO2007120982A3 POLISHING PAD, A POLISHING APPARATUS, AND A PROCESS FOR USING THE POLISHING PAD 审中-公开
标题翻译：抛光垫，抛光装置和使用抛光垫的工艺
公开(公告)号：WO2007120982A3
公开(公告)日：2008-10-02
申请号：PCT/US2007062400
申请日：2007-02-20
申请人： FREESCALE SEMICONDUCTOR INC , BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
发明人： BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
IPC分类号： B24B1/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12 , B24B49/14
摘要： A polishing pad (40) can include a first layer (22) and a second layer (24). The first layer can have a first polishing surface (212) and a first opening (410). The second layer can have an attaching surface (214) and a second opening substantially contiguous with the first opening (410). The polishing pad (40) can further include a pad window (46) lying within the first opening. The pad window (46) can include a second polishing surface (416) and a gas-permeable material. In one aspect, an apparatus can include an attaching surface (214) of a platen (62) lying adjacent to the attaching surface of the polishing pad. In another aspect, a process for polishing can include changing a temperature of a gas within a spaced-apart region (610) formed between a pad (20) and a platen (62). The process can also include forming a gas flux across the polishing pad after polishing has started.
摘要翻译：抛光垫（40）可以包括第一层（22）和第二层（24）。第一层可以具有第一抛光表面（212）和第一开口（410）。第二层可以具有附接表面（214）和基本上与第一开口（410）邻接的第二开口。抛光垫（40）还可以包括位于第一开口内的垫窗（46）。垫窗（46）可以包括第二抛光表面（416）和透气材料。在一个方面，设备可以包括邻近抛光垫的附接表面的压板（62）的附接表面（214）。另一方面，用于抛光的方法可以包括改变在衬垫（20）和压板（62）之间形成的间隔开的区域（610）内的气体的温度。该方法还可以包括在抛光开始之后在抛光垫上形成气体通量。

3. 发明申请

WO2007120982A2 POLISHING PAD, A POLISHING APPARATUS, AND A PROCESS FOR USING THE POLISHING PAD 审中-公开
标题翻译：抛光垫，抛光装置和使用抛光垫的工艺
公开(公告)号：WO2007120982A2
公开(公告)日：2007-10-25
申请号：PCT/US2007/062400
申请日：2007-02-20
申请人： FREESCALE SEMICONDUCTOR, INC. , BOTTEMA, Brian, E. , ABRAHAM, Stephen, F. , PAMATAT, Alex, P.
发明人： BOTTEMA, Brian, E. , ABRAHAM, Stephen, F. , PAMATAT, Alex, P.
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12 , B24B49/14
摘要： A polishing pad (40) can include a first layer (22) and a second layer (24). The first layer can have a first polishing surface (212) and a first opening (410). The second layer can have an attaching surface (214) and a second opening substantially contiguous with the first opening (410). The polishing pad (40) can further include a pad window (46) lying within the first opening. The pad window (46) can include a second polishing surface (416) and a gas-permeable material. In one aspect, an apparatus can include an attaching surface (214) of a platen (62) lying adjacent to the attaching surface of the polishing pad. In another aspect, a process for polishing can include changing a temperature of a gas within a spaced-apart region (610) formed between a pad (20) and a platen (62). The process can also include forming a gas flux across the polishing pad after polishing has started.
摘要翻译：抛光垫（40）可以包括第一层（22）和第二层（24）。第一层可以具有第一抛光表面（212）和第一开口（410）。第二层可以具有附接表面（214）和基本上与第一开口（410）邻接的第二开口。抛光垫（40）还可以包括位于第一开口内的垫窗（46）。垫窗（46）可以包括第二抛光表面（416）和透气材料。在一个方面，设备可以包括邻近抛光垫的附接表面的压板（62）的附接表面（214）。另一方面，用于抛光的方法可以包括改变在衬垫（20）和压板（62）之间形成的间隔开的区域（610）内的气体的温度。该方法还可以包括在抛光开始之后在抛光垫上形成气体通量。

4. 发明申请

WO2007030348A2 PLATEN ENDPOINT WINDOW WITH PRESSURE RELIEF 审中-公开
标题翻译：压力释放的平板终端窗口
公开(公告)号：WO2007030348A2
公开(公告)日：2007-03-15
申请号：PCT/US2006033475
申请日：2006-08-29
申请人： FREESCALE SEMICONDUCTOR INC , BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
发明人： BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
IPC分类号： B24B7/30 , B24B29/00
CPC分类号： B24B37/013 , B24B37/205
摘要： A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air pressure buildup in the air gap (46) by discharging or venting air through one or more vent pathways (52) formed in the platen to provide a pathway to ambient or sub-ambient environment. The air permeable construction of the vented endpoint window (72) provides pressure relief for the air gap (46) between the pad endpoint window (44) and the vented endpoint window (72), but may also include passages (75, 76) that are filled with an air permeable hydrophobic material which protects the underlying endpoint detection system (30, 32) from contamination during cleaning of the platen endpoint window (72).
摘要翻译：用于半导体器件的化学机械抛光的抛光垫（40,42）和台板（50）组件包括具有带有一个或多个排气通道（例如，通气孔）的排气端点窗口（62,72,82）的台板（50）通过将空气排放或通过形成在压板中形成的一个或多个通气路径（52）来防止空气压力在气隙（46）中累积，从而提供通路（66,66,66,66,66）和/或开槽或通道的压板表面到环境或次周围环境。通气终点窗口（72）的透气构造为垫终点窗口（44）和通气终点窗口（72）之间的气隙（46）提供压力释放，但也可包括通道（75,76）填充有可透气的疏水性材料，其在平台终点窗口（72）的清洁期间保护下面的终点检测系统（30,32）免受污染。

5. 发明申请

WO2007030347A2 GROOVED PLATEN WITH CHANNELS OR PATHWAY TO AMBIENT AIR 审中-公开
标题翻译：带通道或通往安全空气的铺设板
公开(公告)号：WO2007030347A2
公开(公告)日：2007-03-15
申请号：PCT/US2006033473
申请日：2006-08-29
申请人： FREESCALE SEMICONDUCTOR INC , BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
发明人： BOTTEMA BRIAN E , ABRAHAM STEPHEN F , PAMATAT ALEX P
IPC分类号： B24B7/30 , B24B29/00
CPC分类号： B24B37/16
摘要： A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the platen (130) includes one or more passageways (132) that provide a pathway to ambient or sub-ambient environment. The combination of the sealing region (131) and the passageway(s) (132) prevent liquids, vapors or other undesirable contaminants from infiltrating between the pad and platen, and also vent trapped air pockets between the pad and platen.
摘要翻译：用于半导体器件的化学机械抛光的抛光垫（120）和压板（130）组件包括具有槽或通道表面（136）的压板（130），其通过未槽口部分（131）与处理环境密封，在压板（130）的周边处。此外，压板（130）包括一个或多个通道（132），其提供到环境或亚环境环境的路径。密封区域（131）和通道（132）的组合防止液体，蒸气或其它不期望的污染物渗透到垫和压板之间，并且还释放垫和压板之间的被困气囊。

6. 发明申请

WO2007030348A3 PLATEN ENDPOINT WINDOW WITH PRESSURE RELIEF 审中-公开
公开(公告)号：WO2007030348A3
公开(公告)日：2007-03-15
申请号：PCT/US2006/033475
申请日：2006-08-29
申请人： FREESCALE SEMICONDUCTOR , BOTTEMA, Brian E. , ABRAHAM, Stephen F. , PAMATAT, Alex P.
发明人： BOTTEMA, Brian E. , ABRAHAM, Stephen F. , PAMATAT, Alex P.
IPC分类号： B24B29/00
摘要： A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air pressure buildup in the air gap (46) by discharging or venting air through one or more vent pathways (52) formed in the platen to provide a pathway to ambient or sub-ambient environment. The air permeable construction of the vented endpoint window (72) provides pressure relief for the air gap (46) between the pad endpoint window (44) and the vented endpoint window (72), but may also include passages (75, 76) that are filled with an air permeable hydrophobic material which protects the underlying endpoint detection system (30, 32) from contamination during cleaning of the platen endpoint window (72).

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