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1. 发明申请

WO2012135243A1 PRE-GROOVING FOR WAFER APPLIED UNDERFILL FILM 审中-公开
标题翻译：用于适用于未完成的膜的预浸料
公开(公告)号：WO2012135243A1
公开(公告)日：2012-10-04
申请号：PCT/US2012/030783
申请日：2012-03-28
申请人： HENKEL CORPORATION , KIM, YounSang , HOANG, Gina , GUINO, Rose
发明人： KIM, YounSang , HOANG, Gina , GUINO, Rose
IPC分类号： H01L21/78 , H01L21/301
CPC分类号： H01L21/78
摘要： A method for preparing a silicon wafer into individual semiconductor dies, in which the silicon wafer has preapplied underfill disposed over its active circuitry, comprises (a) providing a silicon wafer with active circuitry on one face; (b) making grooves between the active circuitry in those locations on the wafer face surface where later dicing into individual semiconductor dies will occur; (c) applying an underfill encapsulant over the active circuitry and grooves on the silicon wafer face; and (d) cutting into and through the underfill encapsulant, the grooves in the active circuitry, and the silicon wafer, to separate the wafer into individual semiconductor dies.
摘要翻译：一种用于将硅晶片制备成单个半导体管芯的方法，其中硅晶片预先施加在其有源电路上设置的底部填充物包括（a）在一个面上提供具有有源电路的硅晶片; （b）在晶片表面上的那些位置中的有源电路之间形成凹槽，随后将切割成单独的半导体管芯; （c）将底部填充密封剂施加在硅晶片表面上的有源电路和沟槽上; 和（d）切入并穿过底部填充密封剂，有源电路中的凹槽和硅晶片，以将晶片分离成单独的半导体管芯。

2. 发明申请

WO2012115704A1 SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS 审中-公开
标题翻译：用于电子产品的可烧结银胶粘合剂
公开(公告)号：WO2012115704A1
公开(公告)日：2012-08-30
申请号：PCT/US2011/065336
申请日：2011-12-16
申请人： HENKEL AG & CO. KGAA , HENKEL CORPORATION , KUDER, Harry, Richard , SANCHEZ, Juliet, Grace , CAO, Xinpei , GROSSMANN, Matthias
发明人： KUDER, Harry, Richard , SANCHEZ, Juliet, Grace , CAO, Xinpei , GROSSMANN, Matthias
IPC分类号： H01B1/22 , C09J9/02 , C09J11/04
CPC分类号： C09J9/02 , C08K3/08 , C08K5/14 , C08K7/06 , C09J11/02 , H01B1/22 , H01L2224/29339 , H01L2924/01322 , H01L2924/13055 , H01L2924/00
摘要： A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
摘要翻译：导电组合物包含（i）具有4.6g / cc或更高的振实密度的微米或亚微米尺寸的银薄片和（ii）溶解存在于银表面上的任何脂肪酸润滑剂或表面活性剂的溶剂。在一个实施方案中，（iii）存在少量的过氧化物。组合物中不存在有机树脂。

3. 发明申请

WO2012106191A2 PRE- CUT WAFER APPLIED UNDERFILL FILM 审中-公开
标题翻译：预浸膜应用于底片
公开(公告)号：WO2012106191A2
公开(公告)日：2012-08-09
申请号：PCT/US2012/022853
申请日：2012-01-27
申请人： HENKEL CORPORATION , KIM, Younsang , HOANG, Gina , GUINO, Rose
发明人： KIM, Younsang , HOANG, Gina , GUINO, Rose
IPC分类号： H01L21/50
CPC分类号： H01L21/02227 , H01L21/563 , H01L21/6836 , H01L23/481 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/73104 , H01L2224/83191
摘要： A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through- silica- vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.
摘要翻译：制备具有预先施加的底部填充物的半导体的方法包括在其顶侧提供具有多个金属凸块的半导体晶片，以及任选地穿过硅晶片的二氧化硅通孔; 将背磨带层压到覆盖金属凸块并通过硅通孔的晶片顶部; 使晶片的背面变薄; 将切割胶带安装到薄化晶片的背面，并将硅晶片和切割胶带安装到切割架上; 取下背磨带; 提供底部填充材料预切成晶片的形状; 将底部填充物与晶片对准并将底部填充物层压到晶片。

4. 发明申请

WO2012024070A2 RADIATION CURABLE TEMPORARY LAMINATING ADHESIVE FOR USE IN HIGH TEMPERATURE APPLICATIONS 审中-公开
标题翻译：用于高温应用的辐射固化临时层压粘合剂
公开(公告)号：WO2012024070A2
公开(公告)日：2012-02-23
申请号：PCT/US2011/045712
申请日：2011-07-28
申请人： HENKEL CORPORATION , HERR, Donald , KONG, Shengqian , CHAPLINSKY, Sharon, Ann , XIAO, Allison, Yue
发明人： HERR, Donald , KONG, Shengqian , CHAPLINSKY, Sharon, Ann , XIAO, Allison, Yue
IPC分类号： C09J133/04 , C09J7/02 , C09J5/00
CPC分类号： C09J147/00 , C08L9/00 , C08L33/04 , C08L2312/06 , C09J4/06 , C09J115/00 , C09J133/04
摘要： A radiation curable temporary laminating adhesive composition for use in temperature applications at 150°C or greater, and typically at 200°C or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.
摘要翻译：用于温度应用的可辐射固化的临时层压粘合剂组合物在150℃或更高，并且通常在200℃或更高温度下包含（A）氢化聚丁二烯二丙烯酸酯; （B）自由基光引发剂; 和（C）稀释剂。

5. 发明申请

WO2011156228A2 COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED WAFERS 审中-公开
标题翻译：磨砂前和胶合后的涂层粘合剂
公开(公告)号：WO2011156228A2
公开(公告)日：2011-12-15
申请号：PCT/US2011/039070
申请日：2011-06-03
申请人： HENKEL CORPORATION , YUN, Hwang, Kyu , LEON, Jeffrey , PEDDI, Raj , KIM, YounSang
发明人： YUN, Hwang, Kyu , LEON, Jeffrey , PEDDI, Raj , KIM, YounSang
IPC分类号： H01L21/78 , H01L21/301
CPC分类号： H01L21/78 , H01L21/67132 , H01L21/6836 , H01L21/784 , H01L21/822
摘要： A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
摘要翻译：将半导体晶片制备成单个半导体管芯的方法使用在研磨步骤和/或通孔微加工步骤之间的切割和粘合剂涂布步骤。

6. 发明申请

WO2010124187A2 SILICONE ACRYLIC HYBRID POLYMER-BASED ADHESIVES 审中-公开
标题翻译：硅胶丙烯酸混合聚合物粘合剂
公开(公告)号：WO2010124187A2
公开(公告)日：2010-10-28
申请号：PCT/US2010/032206
申请日：2010-04-23
申请人： HENKEL CORPORATION , LIU, Yuxia , OUYANG, Jiangbo , PAUL, Charles, W. , FOREMAN, Paul , SRIDHAR, Laxmisha, M. , SHAH, Smita
发明人： LIU, Yuxia , OUYANG, Jiangbo , PAUL, Charles, W. , FOREMAN, Paul , SRIDHAR, Laxmisha, M. , SHAH, Smita
IPC分类号： C09J133/08 , C09J183/10 , C09J183/07
CPC分类号： C09J143/04 , C08F220/14 , C08F220/18 , C08F230/08 , C08G77/04 , C08G77/16 , C08G77/70 , C08L33/08 , C08L83/00 , C09J133/00 , C09J133/08 , C09J183/04
摘要： Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.
摘要翻译：通过硅氧烷聚合物，硅氧烷树脂和含甲硅烷基的丙烯酸聚合物反应制备的硅氧烷丙烯酸杂化组合物可用于皮肤接触应用中使用的粘合剂组合物。

7. 发明申请

WO2010096445A2 THERMALLY SWITCHABLE RUTHENIUM INITIATORS 审中-公开
标题翻译：热可切换的RUMENIUM INITIATORS
公开(公告)号：WO2010096445A2
公开(公告)日：2010-08-26
申请号：PCT/US2010/024423
申请日：2010-02-17
申请人： HENKEL CORPORATION , KHOSRAVI, Ezat , MUSA, Osama, M.
发明人： KHOSRAVI, Ezat , MUSA, Osama, M.
IPC分类号： C07F19/00 , C07F17/02 , C08F4/60 , C08F10/00
CPC分类号： C07F15/0046 , C08G61/08 , C08G2261/3324 , C08G2261/418
摘要： This invention relates to ruthenium initiators for the ring-opening metathesis polymerization (ROMP) of cyclic olefins that are inactive at room temperature but activatable at elevated temperature (referred to as ("thermally switchable"). In general, these are compounds of ruthenium metal to which are bonded four or five ligands, in which one ligand is a pyridine ring in which the nitrogen is chelated to the ruthenium, or a five or six membered ring incorporating nitrogen and the ruthenium in which the nitrogen is chelated to the ruthenium.
摘要翻译：本发明涉及用于环状烯烃的开环易位聚合（ROMP）的钌引发剂，其在室温下是无活性的，但在高温下是可激活的（称为“可热切换的”），通常这些是钌金属化合物其中一个配体是其中氮被螯合到钌上的吡啶环，或五个或六元环结合氮和其中氮与钌螯合的钌键合到四个或五个配体上。

8. 发明申请

WO2008111980A1 COMPOSITION CONTAINING PORPHYRIN TO IMPROVE ADHESION 审中-公开
标题翻译：含有PORPHYRIN以提高粘合剂的组合物
公开(公告)号：WO2008111980A1
公开(公告)日：2008-09-18
申请号：PCT/US2007/063970
申请日：2007-03-14
申请人： NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION , TAKANO, Tadashi , MUSA, Osama, M.
发明人： TAKANO, Tadashi , MUSA, Osama, M.
IPC分类号： C09J11/06 , C09J11/00 , C09J133/00 , G02F1/1335
CPC分类号： C09J133/068 , C08G59/4238 , C08L9/00 , C08L2312/00 , C08L2666/08 , C09J163/00 , H01L23/49513 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/157 , H01L2924/15747 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： An adhesive composition includes a curable resin and a porphyrin derivative, in which the porphyrin derivative has at least one carboxylic acid group that is typically pendant from the porphyrin ring. In another embodiment, this invention is a method for improving adhesion of an adhesive composition to a metal substrate in which a porphyrin derivative is added to a resin, wherein the porphyrin derivative has at least one carboxylic acid group pendant from the porphyrin ring. In a third embodiment, this invention is an assembly in which a semiconductor die is mounted on a metal substrate using an adhesive composition that contains a porphyrin derivative that has at least one carboxyfic acid group. In one embodiment the porphyrin derivative is Protoporphyrin IX, having the structure (I).
摘要翻译：粘合剂组合物包括可固化树脂和卟啉衍生物，其中卟啉衍生物具有通常从卟啉环悬挂的至少一个羧酸基团。在另一个实施方案中，本发明是一种提高粘合剂组合物与其中将卟啉衍生物加入到树脂中的金属基质的粘附性的方法，其中卟啉衍生物具有至少一个从卟啉环悬挂的羧酸基团。在第三实施例中，本发明是使用含有至少一个羧基基团的卟啉衍生物的粘合剂组合物将半导体管芯安装在金属基板上的组件。在一个实施方案中，卟啉衍生物是具有结构（I）的原卟啉IX。

9. 发明申请

WO2008045647A1 LUBRICANT FOR HOT FORGING APPLICATIONS 审中-公开
标题翻译：润滑剂用于热锻应用
公开(公告)号：WO2008045647A1
公开(公告)日：2008-04-17
申请号：PCT/US2007/078113
申请日：2007-09-11
申请人： NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION , HUGUES, Laurent , GANKEMA, Harold , HEIDEMAN, Geert , KOK, Douwe, Marten , ODINK, Gerko
发明人： HUGUES, Laurent , GANKEMA, Harold , HEIDEMAN, Geert , KOK, Douwe, Marten , ODINK, Gerko
IPC分类号： C10M169/04 , C10M103/02
CPC分类号： C10M141/10 , C10M169/04 , C10M2201/041 , C10M2203/04 , C10M2203/1006 , C10M2207/125 , C10M2207/126 , C10M2207/401 , C10M2223/04 , C10N2210/02 , C10N2210/03 , C10N2210/04 , C10N2210/05 , C10N2240/404
摘要： A substantially lead-free lubricant for use in hot forging of metals, especially forging of aluminum and aluminum alloy components. The lubricant comprises one or more oils, graphite, and one or more phosphorus- based additives. Additional additives, such as metallic lubricants and dispersants may also be included. The lubricant does not burn when subjected to temperatures in excess of 300°C.
摘要翻译：一种用于金属热锻，特别是铝和铝合金部件锻造的基本无铅润滑剂。润滑剂包括一种或多种油，石墨和一种或多种磷基添加剂。还可以包括另外的添加剂，例如金属润滑剂和分散剂。润滑剂在超过300℃的温度下不会燃烧。

10. 发明申请

WO2007111606A1 RADIATION-OR THERMALLY-CURABLE BARRIER SEALANTS 审中-公开
标题翻译：辐射或热稳定性障碍物密封剂
公开(公告)号：WO2007111606A1
公开(公告)日：2007-10-04
申请号：PCT/US2006/011441
申请日：2006-03-29
申请人： NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION , KONG, Shengqian , GRIESHABER, Sarah, E.
发明人： KONG, Shengqian , GRIESHABER, Sarah, E.
IPC分类号： C08G59/24 , C09D163/00 , H01L23/29
CPC分类号： C08G59/30 , C08L63/00 , G03F7/038 , H01L51/5246
摘要： This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta -substituted reactive groups and a cationic or radical initiator.
摘要翻译：本发明涉及在固化后提供低透湿性和良好粘合强度的可固化密封剂。该组合物包含具有间位取代的反应性基团的芳族化合物和阳离子或自由基引发剂。

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