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51. 发明申请

WO2012033596A2 NASAL INTERMITTENT MANDATORY VENTILATION (NIMV) CONTROL SYSTEM IN A VENTILATOR 审中-公开
标题翻译：通风机中间隔性强制通风（NIMV）控制系统
公开(公告)号：WO2012033596A2
公开(公告)日：2012-03-15
申请号：PCT/US2011/047301
申请日：2011-08-10
申请人： CAREFUSION 207, INC. , LIU, Yong
发明人： LIU, Yong
IPC分类号： A61M16/00 , A61M16/20 , G06Q50/00 , G06F19/00
CPC分类号： A61M16/205 , A61M16/0051 , A61M16/026 , A61M16/0666 , A61M16/0672 , A61M16/204 , A61M2016/0039 , A61M2016/0042 , A61M2205/3334 , A61M2205/50 , A61M2205/52 , A61M2230/40
摘要： A ventilator including an inspiration flow control unit and an expiration flow control unit coupled to the inspiration flow control unit. The ventilator also includes a nasal intermittent mandatory ventilation (NIMV) control system coupled to the inspiration flow control unit and the expiration flow control unit. The NIMV control system is configured to automatically and simultaneously adjust an inspiration flow and an expiration flow. A pressure of the inspiration flow is increased from a baseline pressure to a control pressure. A pressure of the expiration flow is returned to the baseline pressure.
摘要翻译：呼吸机包括吸气流量控制单元和连接到吸气流量控制单元的呼气流量控制单元。呼吸机还包括耦合到吸气流量控制单元和呼气流量控制单元的鼻间歇性强制通气（NIMV）控制系统。 NIMV控制系统配置为自动并同时调节吸气流量和呼气流量。吸气流量的压力从基准压力增加到控制压力。呼气流量的压力返回到基线压力。

52. 发明申请

WO2011137639A1 CAPACITIVE TOUCH PANEL, MANUFACTURING METHOD AND SCANNING METHOD 审中-公开
标题翻译：电容触摸屏，制造方法和扫描方法
公开(公告)号：WO2011137639A1
公开(公告)日：2011-11-10
申请号：PCT/CN2010/078593
申请日：2010-11-10
申请人： TPK TOUCH SOLUTIONS (XIAMEN) INC. , HO, Kwan-sin , LIU, Yong , HUANG, Pingping
发明人： HO, Kwan-sin , LIU, Yong , HUANG, Pingping
IPC分类号： G06F3/044
CPC分类号： G06F3/044 , G06F2203/04103 , Y10T29/43
摘要： The present invention discloses a capacitive touch panel, comprises a substrate; a touch sensing pattern form on the surface of said substrate, which could generate a actuated sensing signals in response to a touch; a controller electronics configured to receive and process the sensing signals; and a signal line group to conduct the sensing signals to the controller; the signal line group comprises a plurality of first signal lines and a second signal line; the touch sensing pattern comprises a plurality of first conductive assemblies evenly-arranged in a first direction, a first end of each first conductive assembly respectively connect to the controller through the corresponding first signal line; the second signal line connecting the second end of all of the first conductive assemblies to said controller.
摘要翻译：本发明公开了一种电容触摸面板，包括基板; 在所述衬底的表面上的触摸感测图案形式，其可以响应于触摸而产生致动的感测信号; 被配置为接收和处理所述感测信号的控制器电子设备; 以及信号线组，用于将感测信号传导到控制器; 信号线组包括多个第一信号线和第二信号线; 触摸感测图案包括沿第一方向均匀布置的多个第一导电组件，每个第一导电组件的第一端分别通过对应的第一信号线连接到控制器; 所述第二信号线将所有第一导电组件的第二端连接到所述控制器。

53. 发明申请

WO2011123937A1 KINASE INHIBITORS AND METHOD OF TREATING CANCER WITH SAME 审中-公开
标题翻译：激酶抑制剂和治疗癌症的方法
公开(公告)号：WO2011123937A1
公开(公告)日：2011-10-13
申请号：PCT/CA2011/000366
申请日：2011-04-06
申请人： UNIVERSITY HEALTH NETWORK , LAUFER, Radoslaw , PAULS, Heinz W. , FEHER, Miklos , NG, Grace , LIU, Yong , EDWARDS, Louise G. , PATEL, Narendra Kumar B. , PAN, Guohua , MAK, Tak W.
发明人： LAUFER, Radoslaw , PAULS, Heinz W. , FEHER, Miklos , NG, Grace , LIU, Yong , EDWARDS, Louise G. , PATEL, Narendra Kumar B. , PAN, Guohua , MAK, Tak W.
IPC分类号： C07D231/56 , A61K31/416 , A61P35/00 , C07D401/12 , C07D403/12 , C07D405/12 , C07D405/14 , C07D409/12 , C07D413/12 , C07D413/14 , C07D417/12
CPC分类号： C07D231/56 , A61K31/00 , A61K31/517 , A61K31/522 , C07D401/12 , C07D403/12 , C07D405/12 , C07D405/14 , C07D409/12 , C07D413/12 , C07D413/14 , C07D417/12
摘要： The present teachings provide a compound represented by Strutural Formula (I): or a pharmaceutically acceptable salt thereof. Also described are a pharmaceutical composition and method of use thereof.
摘要翻译：本发明提供由式（I）表示的化合物或其药学上可接受的盐。还描述了药物组合物及其使用方法。

54. 发明申请

WO2010044063A2 DEVICE AND METHOD FOR IDENTIFYING ELECTRONIC/ELECTRIC PRODUCTS 审中-公开
标题翻译：用于识别电子/电气产品的装置和方法
公开(公告)号：WO2010044063A2
公开(公告)日：2010-04-22
申请号：PCT/IB2009/054514
申请日：2009-10-14
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , QIAN, Xuecheng , LIU, Yong , JIA, Yugang
发明人： QIAN, Xuecheng , LIU, Yong , JIA, Yugang
CPC分类号： G01R31/245 , G01R31/24
摘要： The present invention provides a novel detection device and method for determining whether an electronic/electric product is genuine or a counterfeit, wherein the detection device and method identify an electronic/electric product by using its inherent characteristics. The present invention further provides a novel electronic control system and method of realizing this system, wherein the system and method distinguish allowable triggers and unallowed triggers by also using the inherent impedance of impedance elements so as to highly improve precision of identification of the electronic controller for the electronic trigger and accordingly raise the difficulty of counterfeiting electronic controllers, such as electronic keys, bank cards, etc.
摘要翻译：本发明提供了一种用于确定电子/电气产品是真实的还是假的的新颖的检测装置和方法，其中检测装置和方法通过使用其固有特性来识别电子/电气产品。本发明还提供了一种实现该系统的新颖的电子控制系统和方法，其中系统和方法通过还使用阻抗元件的固有阻抗来区分允许的触发和不允许的触发，从而高度提高电子控制器的识别精度电子触发器，因此提高了电子控制器，如电子钥匙，银行卡等的假冒伪劣的难度。

55. 发明申请

WO2009154969A3 FOUR MOSFET FULL BRIDGE MODULE 审中-公开
公开(公告)号：WO2009154969A3
公开(公告)日：2009-12-23
申请号：PCT/US2009/045255
申请日：2009-05-27
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , QIAN, Qiuxiao , ZHANG, Jiang Yuan , SPEED, Mike , LEE, JungTae , CHUNG, Luke, H.
发明人： LIU, Yong , QIAN, Qiuxiao , ZHANG, Jiang Yuan , SPEED, Mike , LEE, JungTae , CHUNG, Luke, H.
IPC分类号： H01L25/07 , H01L25/11 , H01L23/34 , H01L23/36
摘要： A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N- channel and two P-channel devices or four mosfets of the same type, but four N-channel are preferred. In module 100 there are two leadframes 30, 40 for assembling the mosfets. In particular, the two N-channel and two P-channel devices are disposed between two leadframes and encapsulated in an electrically insulating molding compound 84. The resulting package has four upper heat sinks 44.1-44.4 that are exposed in the molding compound 84 for transferring heat from the mosfets to the ambient environment. No wire bonds are required. This can significantly reduce the on resistance, RDSON- The top or source-drain lead frame 30 may be soldered to the sources and gates of the bridge mosfets.

56. 发明申请

WO2009114392A2 SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP 审中-公开
标题翻译：半导体封装，包括嵌入式芯片
公开(公告)号：WO2009114392A2
公开(公告)日：2009-09-17
申请号：PCT/US2009/036226
申请日：2009-03-05
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , JU, Jeff , YUAN, Zhongfa , LUO, Roger
发明人： LIU, Yong , JU, Jeff , YUAN, Zhongfa , LUO, Roger
IPC分类号： H01L23/48 , H01L23/49 , H01L23/62
CPC分类号： H01L24/49 , H01L21/563 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L24/16 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48671 , H01L2224/48839 , H01L2224/48844 , H01L2224/48855 , H01L2224/48871 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/81801 , H01L2224/83801 , H01L2224/83851 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85471 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/07802 , H01L2924/0781 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.
摘要翻译：半导体管芯封装。半导体管芯封装包括引线框结构，第一半导体管芯，其包括附接到引线框架结构的第一侧的第一表面和附接到引线框架结构的第二侧的第二半导体管芯。第二半导体管芯包括集成电路管芯。壳体材料形成在引线框架结构，第一半导体管芯和第二半导体管芯的至少一部分上。模制材料的外表面与半导体管芯的第一表面基本共面。

57. 发明申请

WO2008115221A2 HIERARCHICALLY CLUSTERED P2P STREAMING SYSTEM 审中-公开
标题翻译：分层聚类P2P流媒体系统
公开(公告)号：WO2008115221A2
公开(公告)日：2008-09-25
申请号：PCT/US2007/025656
申请日：2007-12-14
申请人： THOMSON LICENSING , LIANG, Chao , GUO, Yang , LIU, Yong
发明人： LIANG, Chao , GUO, Yang , LIU, Yong
IPC分类号： H04L29/08 , H04L29/06
CPC分类号： H04L67/104 , H04L67/1046 , H04L67/1048 , H04L67/1051 , H04L67/1059 , H04L67/1089
摘要： A HCPS (hierarchically clustered P2P streaming system) comprising peers grouped into clusters and hierarchies. The HCPS actively balances the uploading capabilities among clusters and executes an optimal scheduling algorithm within each cluster to ensure that system resources are optimally utilized. The HCPS comprises an architecture which can be used in practical applications, yet can achieve the streaming rate close to the theoretical upper bound.
摘要翻译：包括分组成群集和分层结构的对等体的HCPS（分层聚类P2P流式传输系统）。 HCPS主动平衡集群间的上载能力，并在每个集群内执行最佳调度算法，以确保系统资源得到最佳利用。 HCPS包含可用于实际应用的架构，但可实现接近理论上限的流速。

58. 发明申请

WO2008054936A3 SYSTEM FOR MANAGING THE MULTIPLE AIR-TO-GROUND COMMUNICATION LINKS IN AN AIR-TO-GROUND CELLULAR COMMUNICATION NETWORK 审中-公开
公开(公告)号：WO2008054936A3
公开(公告)日：2008-05-08
申请号：PCT/US2007/078654
申请日：2007-09-17
申请人： AIRCELL LLC , CHARI, Anand, K. , SAROKA, Harold, Grant , JOYCE, Tim , WALSH, Patrick, J. , LIU, Yong , MCKENNA, Daniel, Bernard
发明人： CHARI, Anand, K. , SAROKA, Harold, Grant , JOYCE, Tim , WALSH, Patrick, J. , LIU, Yong , MCKENNA, Daniel, Bernard
IPC分类号： H04Q7/20
摘要： The Multi-Link Aircraft Cellular System makes use of multiple physically separated antennas mounted on the aircraft, as well as the use of additional optional signal isolation and optimization techniques to improve the call handling capacity of the Air-To-Ground cellular communications network. These additional techniques can include polarization domain and ground antenna pattern shaping (in azimuth, in elevation, or in both planes). Further, if code domain separation is added, dramatic increases in capacity are realized. Thus, the Air-To-Ground cellular communications network can increase its capacity on a per aircraft basis by sharing its traffic load among more than one cell or sector and by making use of multiple physically separated antennas mounted on the aircraft, as well as the use of additional optional signal isolation and optimization techniques.

59. 发明申请

WO2007143326A2 MINI-PROBER FOR TFT-LCD TESTING 审中-公开
标题翻译：用于TFT-LCD测试的微型探测器
公开(公告)号：WO2007143326A2
公开(公告)日：2007-12-13
申请号：PCT/US2007/068642
申请日：2007-05-10
申请人： APPLIED MATERIALS, INC. , JOHNSTON, Benjamin M. , KRISHNASWAMI, Sriram , NGUYEN, Hung T. , BRUNNER, Matthias , LIU, Yong
发明人： JOHNSTON, Benjamin M. , KRISHNASWAMI, Sriram , NGUYEN, Hung T. , BRUNNER, Matthias , LIU, Yong
IPC分类号： G01R31/02
CPC分类号： G09G3/006
摘要： An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.
摘要翻译：描述了用于测试大面积基板的装置和方法。大面积基板包括电连接到显示器的显示器和接触点的图案。该装置包括可相对于大面积基板移动的探测器组件，并且可以被配置为测试各种显示和接触点的图案。探测器组件还被配置成测试大面积衬底的分数段。该装置还包括被配置为在内部容积内存储至少两个探测器组件的测试室。

60. 发明申请

WO2006121282A1 OPTIMAL PATH ROUTING METHOD IN WIRELESS NETWORK 审中-公开
标题翻译：无线网络中的最佳路径路由方法
公开(公告)号：WO2006121282A1
公开(公告)日：2006-11-16
申请号：PCT/KR2006/001735
申请日：2006-05-09
申请人： SAMSUNG ELECTRONICS CO., LTD. , THE RESEARCH FOUNDATION OF THE CITY UNIVERSITY OF NEW YORK , LIU, Yong , LEE, Myung-jong
发明人： LIU, Yong , LEE, Myung-jong
IPC分类号： H04L12/28
CPC分类号： H04L45/12 , H04L45/04 , H04L45/28 , H04L45/34 , H04L45/42 , H04L45/48 , H04W40/248 , H04W40/34
摘要： An optimal path routing method is provided for transmitting data from a source node to a destination node. The optimal path setting method includes transmitting a shortcut request (SCRQ) message from the source node to a topology server; determining shortcut information at the topology server based on the SCRQ message; and transmitting a shortcut notification (SCNF) message containing the shortcut information from the topology server to the destination node.
摘要翻译：提供了一种最佳路径路由方法，用于将数据从源节点传输到目标节点。所述最优路径设定方法包括从所述源节点向拓扑服务器发送快捷请求（SCRQ）消息; 基于所述SCRQ消息确定所述拓扑服务器处的快捷信息; 以及从所述拓扑服务器向所述目的地节点发送包含所述快捷信息的快捷通知（SCNF）消息。

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