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31. 发明申请

WO0047365A2 MACHINING WORKPIECES 审中-公开
标题翻译：加工工作
公开(公告)号：WO0047365A2
公开(公告)日：2000-08-17
申请号：PCT/FI0000088
申请日：2000-02-08
申请人： ROBOTIC TECHNOLOGY SYSTEMS FIN , RAAMI JUHA
发明人： RAAMI JUHA
IPC分类号： B23Q1/03 , B23Q1/66 , B23Q3/06 , B23Q3/15 , B25J9/00 , B23Q3/00
CPC分类号： B23Q1/66 , B23Q1/03 , B23Q3/06 , B23Q3/15 , B25J9/00
摘要： The present invention relates to a machining arrangement and a method of maching. A robot (1) capable of performing movements in a three dimensional space is provided with a drive unit (2), wherein the drive unit is arranged to rotate a rotating tool (14) used for machining of the workpieces. A control unit (4) is arranged to control the operation of said robot and drive unit. A workbench (10) is used for holding the workpiece to be machined, said workbench comprising a frame (10') and a turntable (8) attached pivotally to said frame. The arrangement is such that the different surfaces of the turntable can be turned to face the working area of the robot (1). Clamping means are also provided for attaching the workpiece (3) on the surface of said turntable.
摘要翻译：本发明涉及加工装置和加工方法。能够在三维空间中进行运动的机器人（1）设置有驱动单元（2），其中驱动单元布置成旋转用于加工工件的旋转工具（14）。控制单元（4）被布置成控制所述机器人和驱动单元的操作。工作台（10）用于保持要加工的工件，所述工作台包括框架（10'）和枢转地附接到所述框架的转盘（8）。这种布置使得转台的不同表面可以转动以面对机器人（1）的工作区域。还提供夹紧装置用于将工件（3）附接在所述转台的表面上。

32. 发明申请

WO98057371A1 METHOD AND APPARATUS FOR IMPROVED RETENTION OF A SEMICONDUCTOR WAFER WITHIN A SEMICONDUCTOR WAFER PROCESSING SYSTEM 审中-公开
标题翻译：用于改善在半导体波长处理系统中的半导体波形的保持的方法和装置
公开(公告)号：WO98057371A1
公开(公告)日：1998-12-17
申请号：PCT/US1998/011877
申请日：1998-06-08
IPC分类号： B23Q3/15 , B65G49/07 , H01L21/683 , H01L21/68
CPC分类号： H01L21/6833 , Y10T279/23
摘要： Method and apparatus for retaining a semiconductor wafer upon a pedestal within semiconductor wafer processing equipment. An electrostatic chuck contains a wafer support having a surface. Embedded beneath the surface is a number of electrodes defining a number of chucking zones. The electrodes are energized by a number of non-zero voltages thereby creating a variable, non-zero chucking force in each of the chucking zones. The method of retaining a substrate to a substrate support consists of biasing at least one of the electrodes with a first voltage of a first magnitude and biasing each previously unbiased electrode with a voltage of unequal magnitude of the initially biased electrode and every other previously unbiased electrode such that a non-zero chucking force exists in every zone. Wafer chucking zones of differing force improve uniformity of heat transfer gas layer distribution.
摘要翻译：将半导体晶片保持在半导体晶片处理设备内的基座上的方法和装置。静电卡盘包含具有表面的晶片支架。嵌入在表面下方的是定义多个夹持区域的多个电极。电极由多个非零电压激励，从而在每个夹持区域中产生可变的非零夹紧力。将衬底保持到衬底支撑件的方法包括：利用第一大小的第一电压偏压至少一个电极，并且利用初始偏置电极和每个其它先前无偏置电极的不等大小的电压来偏置每个先前无偏置的电极使得每个区域中都存在非零夹紧力。不同力的晶片夹紧区域提高传热气体层分布的均匀性。

33. 发明申请

WO98056040A2 ELECTROSTATIC CHUCKS 审中-公开
标题翻译：静电卡盘
公开(公告)号：WO98056040A2
公开(公告)日：1998-12-10
申请号：PCT/GB1998/001452
申请日：1998-06-02
IPC分类号： B23Q3/15 , H01L21/302 , H01L21/683 , H01L21/68
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck (12) for a plasma reactor apparatus (10) comprises a base metallic section (23), a pair of electrodes (24) set in bonding material (27) and electrically insulated from the base by a plate (29) and a thick dielectric layer (20) (e.g. 0.5 to 1.5 mm), which covers the electrodes (24) and bonding material (27) and forms the support surfaces for wafers (31).
摘要翻译：一种用于等离子体反应器装置（10）的静电吸盘（12）包括基体金属部分（23），设置在接合材料（27）中的一对电极（24）并通过板（29）与基体电绝缘，覆盖电极（24）和接合材料（27）的厚电介质层（20）（例如0.5至1.5mm）并形成晶片（31）的支撑表面。

34. 发明申请

WO2023277623A1 멀티존 열전달 구조물을 이용한 기판 처리 장치 및 온도 제어 방법 审中-公开
公开(公告)号：WO2023277623A1
公开(公告)日：2023-01-05
申请号：PCT/KR2022/009453
申请日：2022-06-30
申请人： 광운대학교 산학협력단
发明人： 권기청 , 권희태 , 김지환 , 방인영
IPC分类号： H01L21/683 , H02N13/00 , B23Q3/15 , H01L21/67 , C23C16/458 , H01J37/32 , H05B3/14
摘要： 본 실시예들은 냉매가 공급되는 베이스 구조물 및 기판 사이에 멀티존 열전달 조절 구조물을 설치하여 열전달 가스의 압력 변화를 이용하여 기판 및 정전척과 베이스 구조물 사이 또는 특정 구조물들 사이에서 발생 가능한 열을 차단 또는 전달하여 공정 중 또는 공정 후 기판의 온도 조절을 용이하게 하는 기판 처리 장치 및 멀티존 온도 제어 방법을 제공한다.

35. 发明申请

WO2022104028A1 RETICLE EXCHANGE DEVICE WITH RETICLE LEVITATION 审中-公开
公开(公告)号：WO2022104028A1
公开(公告)日：2022-05-19
申请号：PCT/US2021/059099
申请日：2021-11-12
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY
发明人： TRUMPER, David, L. , BHUSHAN, Brij, Mohan
IPC分类号： B23Q3/15 , B65G49/07 , H01L21/683 , H01L21/687
摘要： An electrostatic chuck includes electrodes to clamp a workpiece, electrodes to electrostatically levitate and position the workpiece, and sensors to detect position and orientation of the workpiece. Lateral motion of the workpiece relative to the electrostatic chuck can be damped prior to clamping.

36. 发明申请

WO2021183409A1 FLUID TRANSFER INTERFACE 审中-公开
公开(公告)号：WO2021183409A1
公开(公告)日：2021-09-16
申请号：PCT/US2021/021290
申请日：2021-03-08
申请人： ALTIUS SPACE MACHINES INC.
发明人： LICCIARDELLO, Geoffrey , GOFF, Jonathan , MURPHY, Calvin
IPC分类号： B23Q3/15 , B64G1/64 , H01F7/04 , H01R13/62
摘要： A fluid transfer interface is provided. The fluid transfer interface includes one or more of first and second interface portions. The first interface portion includes a first portion of a fluid connector and one or more ferromagnetic surfaces. The second interface portion includes an extendable second portion of the fluid connector and one or more electropermanent magnets, laterally disposed around the second portion of the fluid connector, configured to be magnetized or demagnetized in unison. The one or more electropermanent magnets are further configured to provide attraction force to the one or more ferromagnetic surfaces when magnetized and couple the first interface portion to the second interface portion and provide no attraction force to the one or more ferromagnetic surfaces when demagnetized and allow the first interface portion to be decoupled from the second interface portion.

37. 发明申请

WO2020186120A1 LAMELLAR CERAMIC STRUCTURE 审中-公开
公开(公告)号：WO2020186120A1
公开(公告)日：2020-09-17
申请号：PCT/US2020/022495
申请日：2020-03-12
申请人： LAM RESEARCH CORPORATION
发明人： HOLLINGSWORTH, Joel Philip , LEESER, Karl Frederick , LINGAMPALLI, Ramkishan Rao
IPC分类号： H01L21/687 , H01L21/67 , H01L21/683 , H02N13/00 , B23Q3/15 , C23C16/458 , H01J37/32
摘要： In some examples, a substrate support assembly comprises a monolithic ceramic body, a heater element disposed within the monolithic ceramic body, and an RF antenna disposed within the monolithic ceramic body. One or more power lines supplies the heater element and the RF antenna. A lamellar structure is formed or included within the monolithic ceramic body, the lamellar structure including at least one layer having a thermal conductivity different than a thermal conductivity of the monolithic ceramic body.

38. 发明申请

WO2020185395A1 ELECTROSTATIC CHUCK FOR HIGH BIAS RADIO FREQUENCY (RF) POWER APPLICATION IN A PLASMA PROCESSING CHAMBER 审中-公开
公开(公告)号：WO2020185395A1
公开(公告)日：2020-09-17
申请号：PCT/US2020/019713
申请日：2020-02-25
申请人： APPLIED MATERIALS, INC.
发明人： CHO, Jaeyong , RAUF, Shahid , TIAN, Peng
IPC分类号： H01L21/683 , H02N13/00 , H01J37/32 , B23Q3/15 , H01L21/67
摘要： Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second electrode embedded in the plate proximate the second side, a plurality of conductive elements coupling the first electrode to the second electrode, a first gas channel disposed within the plate and between the first electrode and the second electrode, a gas inlet extending from the second side of the plate to the first gas channel; and a plurality of gas outlets extending from the first side of the plate to the first gas channel.

39. 发明申请

WO2020072195A3 APPARATUS AND METHOD TO ELECTROSTATICALLY REMOVE FOREIGN MATTER FROM SUBSTRATE SURFACES 审中-公开
公开(公告)号：WO2020072195A3
公开(公告)日：2020-04-09
申请号：PCT/US2019/051548
申请日：2019-09-17
申请人： TOKYO ELECTRON LIMITED , TOKYO ELECTRON U.S. HOLDINGS, INC.
发明人： ROTONDARO, Antonio , BASSETT, Derek , HURD, Trace , SIMMS, Ihsan
IPC分类号： H01L21/683 , H01L21/67 , H02N13/00 , B23Q3/15 , H01L21/02
摘要： In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.

40. 发明申请

WO2019231609A1 WET CLEANING OF ELECTROSTATIC CHUCK 审中-公开
公开(公告)号：WO2019231609A1
公开(公告)日：2019-12-05
申请号：PCT/US2019/030477
申请日：2019-05-02
申请人： APPLIED MATERIALS, INC.
发明人： HUANG, Tuochuan , PENG, Gang , GROECHEL, David W. , PARKHE, Vijay D. , KAWAGUCHI, Shinnosuke , BENJAMINSON, David
IPC分类号： H01L21/67 , H01L21/683 , H02N13/00 , B23Q3/15
摘要： Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.

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