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11. 发明申请

WO2007137140A3 LASER-BASED TERMINATION OF MINIATURE PASSIVE ELECTRONIC COMPONENTS 审中-公开
标题翻译：微型无源电子元件的基于激光器的终止
公开(公告)号：WO2007137140A3
公开(公告)日：2008-01-17
申请号：PCT/US2007069184
申请日：2007-05-17
申请人： ELECTRO SCIENT IND INC , SWENSON EDWARD J , GARCIA DOUGLAS J , GOLDWATER BRUCE STUART
发明人： SWENSON EDWARD J , GARCIA DOUGLAS J , GOLDWATER BRUCE STUART
IPC分类号： H01C17/00 , G11C5/06 , H01C17/28 , H01G13/00
CPC分类号： H01C17/006 , H01C17/281 , H01G13/00
摘要： Terminating the ends of passive electronic components entails applying a laser-removable coating (70) to one or both of the opposed major surfaces (14, 16; 36, 38) of a substrate (10, 34). A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-removable coating from multiple selected regions of at least one of the major surfaces to which the laser-removable coating was applied is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-removable coating to expose the multiple selected regions. The substrate is then broken into multiple rowbars (48, 50, 98) or individual components (100), each of which includes side margins. An electrically conductive material is applied to the side margins to form electrically conductive interconnects (56, 58, 96) between portions of the side margins spatially aligned with the multiple selected regions.
摘要翻译：终止无源电子部件的端部需要将激光可移除涂层（70）施加到衬底（10,34）的相对主表面（14,16; 36,38）中的一个或两个上。具有足够的光斑尺寸和能量分布的UV激光束被引导到基底上以入射到激光可去除的涂层的至少一个主表面的多个选定区域中。 UV激光束和衬底之间的相对运动可以消除足够数量的激光可去除涂层以暴露多个选定区域。然后将基板分解成多个行棒（48,50,98）或各个部件（100），每个部件包括侧边缘。将导电材料施加到侧边缘，以在与多个选定区域空间对准的侧边缘的部分之间形成导电互连（56,58,96）。

12. 发明申请

WO2005039813A3 MICROPOROUS FILTER 审中-公开
标题翻译：微孔过滤器
公开(公告)号：WO2005039813A3
公开(公告)日：2005-07-14
申请号：PCT/US2004028405
申请日：2004-08-31
申请人： ELECTRO SCIENT IND INC , SWENSON EDWARD J
发明人： SWENSON EDWARD J
IPC分类号： B01D39/00 , B01D39/14 , B01D63/00 , B01D63/08 , B01D67/00 , B01D69/02 , B23K20060101
CPC分类号： B01D69/02 , B01D63/087 , B01D67/0032 , B01D71/36 , B01D71/50 , B01D71/64 , B01D2323/34 , B01D2325/021 , B01D2325/08
摘要： A laser-based drilling technique provides a microporous filter (10) having very small holes (30, 30') with known diameters and locations. One embodiment of the technique entails using a laser beam (62) with one or more uniform spot sizes to form each hole. The laser beam ablates material depthwise for corresponding known distances into a substrate (12) to form a desired number of hole steps (32, 38, 44) in each hole. Another embodiment of the technique entails using an imprint patterning toolfoil (80) to stamp in the substrate depressions (32, 38) of specified diameters and distances that correspond to the hole steps. In both embodiments, a laser beam of Gaussian shape removes the last portion of material to form a very small diameter final hole step (44).
摘要翻译：基于激光的钻孔技术提供具有已知直径和位置的非常小孔（30,30'）的微孔过滤器（10）。该技术的一个实施例需要使用具有一个或多个均匀斑点尺寸的激光束（62）来形成每个孔。激光束在材料的深度方向上烧蚀相应的已知距离进入衬底（12），以在每个孔中形成所需数量的孔阶（32,38,44）。该技术的另一实施例需要使用压印图案化工具薄片（80）来压印具有与孔阶梯相对应的特定直径和距离的基板凹陷（32,38）。在两个实施例中，高斯形状的激光束去除材料的最后部分以形成非常小直径的最终孔步骤（44）。

13. 发明申请

WO2005045521A3 LASER-BASED TERMINATION OF PASSIVE ELECTRONIC COMPONENTS 审中-公开
公开(公告)号：WO2005045521A3
公开(公告)日：2005-05-19
申请号：PCT/US2004/036962
申请日：2004-11-04
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SWENSON, Edward, J. , GARCIA, Douglas, J. , GOLDWATER, Bruce, Stuart
发明人： SWENSON, Edward, J. , GARCIA, Douglas, J. , GOLDWATER, Bruce, Stuart
IPC分类号： H01C17/06
摘要： Terminating the ends of passive electronic components entails applying a laser-ablative coating (70) to each of the opposed major surfaces (14 and 16; 36 and 38) of a substrate (10 and 34). A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-ablative coating from multiple selected regions of the major surfaces is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-ablative coating to expose the multiple selected regions of the opposed major surfaces. The substrate is then broken into multiple rowbars (48 and 50), each of which includes side margins (60 and 62) along which are positioned different spatially aligned pairs of the selected regions of the opposed major surfaces. An electrically conductive material is applied to the side margins to form electrically conductive interconnects (56 and 58) between each spatially aligned pair of the selected regions.

14. 发明申请

WO2005008849A2 METHOD OF FORMING A SCRIBE LINE ON A PASSIVE ELECTRONIC COMPONENT SUBSTRATE 审中-公开
标题翻译：在被动电子元件基板上形成一个可选线的方法
公开(公告)号：WO2005008849A2
公开(公告)日：2005-01-27
申请号：PCT/US2004/022227
申请日：2004-07-09
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC , SWENSON, Edward, J. , SUN, Yunlong , SAMMI, Manoj, Kumar , JOHNSON, Jay, Christopher , GARCIA, Doug , ANKLEKAR, Rupendra, M.
发明人： SWENSON, Edward, J. , SUN, Yunlong , SAMMI, Manoj, Kumar , JOHNSON, Jay, Christopher , GARCIA, Doug , ANKLEKAR, Rupendra, M.
IPC分类号： H01S
CPC分类号： B23K26/0622 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/52 , B28D5/0011 , H01L2224/16 , H01L2924/0102 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , Y10S438/94
摘要： A method of forming a scribe line (36) having a sharp snap line (44) entails directing a UV laser beam (14) along a ceramic or ceramic-like substrate (10) such that a portion of the thickness (24) of the substrate (10) is removed. The UV laser beam forms a scribe line in the substrate in the absence of appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.
摘要翻译：形成具有尖锐捕捉线（44）的划痕线（36）的方法需要沿着陶瓷或陶瓷状衬底（10）引导UV激光束（14），使得一部分厚度（24）的去除衬底（10）。 UV激光束在没有明显的衬底熔化的情况下在衬底中形成划线，使得清晰限定的咬合线形成延伸到衬底厚度的高应力集中区域。因此，响应于施加到划线的任一侧的断裂力，多个深度裂纹在高应力集中区域中传播到基板的厚度中，以使基板清洁断裂成单独的电路部件。该区域的形成促进了基板的高精度断裂，同时在施加破损力的同时保持了每个部件的内部结构的完整性。

15. 发明申请

WO2005039813B1 MICROPOROUS FILTER 审中-公开
公开(公告)号：WO2005039813B1
公开(公告)日：2005-09-09
申请号：PCT/US2004028405
申请日：2004-08-31
申请人： ELECTRO SCIENT IND INC , SWENSON EDWARD J
发明人： SWENSON EDWARD J
IPC分类号： B01D39/00 , B01D39/14 , B01D63/00 , B01D63/08 , B01D67/00 , B01D69/02 , B23K20060101
CPC分类号： B01D69/02 , B01D63/087 , B01D67/0032 , B01D71/36 , B01D71/50 , B01D71/64 , B01D2323/34 , B01D2325/021 , B01D2325/08
摘要： A laser-based drilling technique provides a microporous filter (10) having very small holes (30, 30') with known diameters and locations. One embodiment of the technique entails using a laser beam (62) with one or more uniform spot sizes to form each hole. The laser beam ablates material depthwise for corresponding known distances into a substrate (12) to form a desired number of hole steps (32, 38, 44) in each hole. Another embodiment of the technique entails using an imprint patterning toolfoil (80) to stamp in the substrate depressions (32, 38) of specified diameters and distances that correspond to the hole steps. In both embodiments, a laser beam of Gaussian shape removes the last portion of material to form a very small diameter final hole step (44).

16. 发明申请

WO2003052890A1 PROCESSING A MEMORY LINK WITH A SET OF AT LEAST TWO LASER PULSES 审中-公开
标题翻译：用一组至少两个激光脉冲处理存储器链接
公开(公告)号：WO2003052890A1
公开(公告)日：2003-06-26
申请号：PCT/US2002/040410
申请日：2002-12-17
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , SWENSON, Edward, J. , HARRIS, Richard, S.
发明人： SUN, Yunlong , SWENSON, Edward, J. , HARRIS, Richard, S.
IPC分类号： H01S3/10
CPC分类号： H01S3/0057 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , G11C17/14 , G11C17/143 , H01L23/5258 , H01L2924/0002 , H01S5/4012 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
摘要翻译：激光脉冲（52）的组（50）被用于切断存储器或其他IC芯片中的导电链路（22）。该组（50）的持续时间优选短于500ns; 并且该组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。该组（50）可以被视为单个“脉冲” 通过传统的激光定位系统（62）在每个激光系统（60）在每个链路（22）处激发一组（50个）激光脉冲（52）时执行即时链路移除而不停止。传统的红外波长或它们的谐波可以被采用。

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