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11. 发明申请

WO2012177585A3 OPTIMIZED ANNULAR COPPER TSV 审中-公开
标题翻译：优化的环形铜片TSV
公开(公告)号：WO2012177585A3
公开(公告)日：2013-04-25
申请号：PCT/US2012043052
申请日：2012-06-19
申请人： IBM , ANDRY PAUL S , FAROOQ MUKTA G , HANNON ROBERT , IYER SUBRAMANIAN S , KINSER EMILY R , TSANG CORNELIA K , VOLANT RICHARD P
发明人： ANDRY PAUL S , FAROOQ MUKTA G , HANNON ROBERT , IYER SUBRAMANIAN S , KINSER EMILY R , TSANG CORNELIA K , VOLANT RICHARD P
IPC分类号： H01L21/28 , H01L21/768
CPC分类号： H01L21/76846 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure provides a thermo-mechanically reliable copper TSV and a technique to form such TSV during BEOL processing. The TSV constitutes an annular trench which extends through the semiconductor substrate. The substrate defines the inner and outer sidewalls of the trench, which sidewalls are separated by a distance within the range of 5 to 10 microns. A conductive path comprising copper or a copper alloy extends within said trench from an upper surface of said first dielectric layer through said substrate. The substrate thickness can be 60 microns or less. A dielectric layer having interconnect metallization conductively connected to the conductive path is formed directly over said annular trench.
摘要翻译：本公开提供了热机械可靠的铜TSV和在BEOL处理期间形成这种TSV的技术。 TSV构成延伸穿过半导体衬底的环形沟槽。衬底限定沟槽的内侧壁和外侧壁，该侧壁分隔5至10微米的距离。包括铜或铜合金的导电路径从所述第一介电层的上表面通过所述衬底在所述沟槽内延伸。基板厚度可以为60微米或更小。具有导电连接到导电路径的互连金属化的电介质层直接形成在所述环形沟槽上。

12. 发明申请

WO2010123691A1 THREE DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION USING DIELECTRIC BONDING FIRST AND THROUGH VIA FORMATION LAST 审中-公开
标题翻译：三维集成电路集成首先通过电介质连接，最后通过形成
公开(公告)号：WO2010123691A1
公开(公告)日：2010-10-28
申请号：PCT/US2010/030357
申请日：2010-04-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , FAROOQ, Mukta, G. , HANNON, Robert , IYER, Subramanian, S. , KINSER, Emily, R
发明人： FAROOQ, Mukta, G. , HANNON, Robert , IYER, Subramanian, S. , KINSER, Emily, R
IPC分类号： H01L23/04
CPC分类号： H01L21/76898 , H01L24/06 , H01L24/80 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/06181 , H01L2224/08146 , H01L2224/16145 , H01L2224/32145 , H01L2224/80896 , H01L2224/8385 , H01L2224/9202 , H01L2224/94 , H01L2225/06541 , H01L2924/14 , H01L2924/00014 , H01L2224/83 , H01L2224/80 , H01L2924/00
摘要： A method of implementing three-dimensional (3D) integration of multiple integrated circuit (IC) devices includes forming a first insulating layer (120) over a first IC device; forming a second insulating layer (220) over a second IC device; forming a 3D, bonded IC device by aligning and bonding the first insulating layer to the second insulating layer so as to define a bonding interface (302) therebetween, defining a first set of vias (306) within the 3D bonded IC device, the first set of vias landing on conductive pads (110) located within the first IC device, and defining a second set of vias (306) within the 3D bonded IC device, the second set of vias landing on conductive pads (210) located within the second device, such that the second set of vias passes through the bonding interface (302); and filling the first and second sets of vias with a conductive material (310).
摘要翻译：实现多个集成电路（IC）器件的三维（3D）集成的方法包括在第一IC器件上形成第一绝缘层（120）; 在第二IC器件上形成第二绝缘层（220）; 通过将第一绝缘层对准和结合到第二绝缘层来形成3D粘合IC器件，以便在它们之间限定接合界面（302），在3D结合IC器件内限定第一组通孔（306），第一组位于第一IC器件内的导电焊盘（110）上的通孔组，以及限定3D结合IC器件内的第二组通孔（306），第二组通孔位于位于第二IC器件内的导电焊盘（210）使得所述第二组通孔穿过所述接合界面（302）; 以及用导电材料（310）填充第一组和第二组通孔。

13. 发明申请

WO2009002700A1 A NETWORK FOR A CELLULAR COMMUNICATION SYSTEM AND A METHOD OF OPERATION THEREFOR 审中-公开
标题翻译：一种蜂窝通信系统的网络及其操作方法
公开(公告)号：WO2009002700A1
公开(公告)日：2008-12-31
申请号：PCT/US2008/066422
申请日：2008-06-10
申请人： MOTOROLA, INC. , FOSTER, Gerard T., , IYER, Subramanian S., , MOORE, Brian J.,
发明人： FOSTER, Gerard T., , IYER, Subramanian S., , MOORE, Brian J.,
IPC分类号： H04Q7/36
CPC分类号： H04W36/0033 , H04W8/26 , H04W16/32 , H04W80/04 , H04W88/182
摘要： A network for a cellular communication system comprises access points (105-109) supporting cells within a region (113). Each access point (105-109) has an individual proxy address of a proxy address space which is a local address space of an address proxy (101) and a common network address of a network address space which is a network wide address space. A gateway access point (103) covers an entry point to the region (113) and detects a remote station entering the region. It then determines an access point (105) in the region to which the remote station is handed over and transmits a binding message to the address proxy (101) with an indication of the access point (105). In response to receiving the binding message, the address proxy (101) establishes a binding between the common network address and the proxy address of the access point (105). Data for the remote station is then forwarded to the access point (105) using the binding.
摘要翻译：用于蜂窝通信系统的网络包括支持区域（113）内的小区的接入点（105-109）。每个接入点（105-109）具有作为地址代理（101）的本地地址空间的代理地址空间的单独代理地址和作为网络广域地址空间的网络地址空间的公共网络地址。网关接入点（103）覆盖到该区域（113）的入口点并检测进入该区域的远程站。然后，确定远程站切换到的区域中的接入点（105），并用接入点（105）的指示向地址代理（101）发送绑定消息。响应于接收到绑定消息，地址代理（101）建立公共网络地址与接入点（105）的代理地址之间的绑定。然后使用绑定将远程站的数据转发到接入点（105）。

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