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11. 发明申请

WO2006090949A1 OXYGEN BLOCKING DEVICE, AND LASER PROCESSING APPARATUS AND METHOD USING THE SAME 审中-公开
标题翻译：氧气阻塞装置和激光加工装置及其使用方法
公开(公告)号：WO2006090949A1
公开(公告)日：2006-08-31
申请号：PCT/KR2005/001550
申请日：2005-05-26
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie , LEE, Dong Jun , SUH, Jong Hyun , JUNG, Won Chul , LEE, Hak Yong , HONG, Eun Jeong
发明人： HAN, You-Hie , LEE, Dong Jun , SUH, Jong Hyun , JUNG, Won Chul , LEE, Hak Yong , HONG, Eun Jeong
IPC分类号： H01L21/02
CPC分类号： B23K26/1476 , B23K2201/40
摘要： An oxygen blocking device comprises a laser beam incidence section for allowing a laser beam to be introduced therein; a first gas inlet section extending from the laser beam incidence section, for jetting gas onto a surface of a workpiece while processing the workpiece using the laser beam, to prevent a melt of the workpiece from bonding with oxygen; a second gas inlet section formed around the first gas inlet section to define a space independent of the first gas inlet section, for jetting gas onto the surface of the workpiece while processing the workpiece, to prevent the melt of the workpiece from bonding with oxygen; a gas and laser beam radiation section for radiating the laser beam and gas; and a fastening section formed between the laser beam incidence section and the first gas inlet section and coupled to an external member.
摘要翻译：氧阻断装置包括用于允许激光束被引入其中的激光束入射部分; 从所述激光束入射部延伸的第一气体入口部，用于在使用所述激光束处理所述工件的同时将气体喷射到工件的表面上，以防止所述工件的熔融物与氧接合; 第二气体入口部分，围绕第一气体入口部分形成以限定独立于第一气体入口部分的空间，用于在处理工件时将气体喷射到工件的表面上，以防止工件的熔体与氧气接合; 用于辐射激光束和气体的气体和激光束辐射部分; 以及形成在所述激光束入射部分和所述第一气体入口部分之间并连接到外部部件的紧固部分。

12. 发明申请

WO2009014307A1 LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT 审中-公开
标题翻译：激光加工设备和使用光束分离的方法
公开(公告)号：WO2009014307A1
公开(公告)日：2009-01-29
申请号：PCT/KR2008/002531
申请日：2008-05-06
申请人： EO TECHNICS CO., LTD. , LEE, Dong Jun , PARK, Jung Rae , LEE, Hak Yong , KWON, Young Hoon
发明人： LEE, Dong Jun , PARK, Jung Rae , LEE, Hak Yong , KWON, Young Hoon
IPC分类号： B23K26/06 , B23K26/00
CPC分类号： B23K26/067 , B23K26/0608 , B23K26/0652 , B23K26/0676 , B23K26/0736 , B23K26/082 , B23K26/0821 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/172 , B23K2203/30 , B23K2203/50 , H01L21/268
摘要： Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.
摘要翻译：公开了一种能够有效地去除在晶片上形成的低k材料的激光加工装置和方法。本发明的激光加工装置是对形成有低k材料的被摄体进行处理的激光加工装置。激光加工装置包括发射激光束的激光发生单元; 以及将从激光发生单元发射的激光束分成两部分并将分离的激光束照射到被摄体上的光学系统。在这种情况下，光学系统包括一对聚光透镜，其中以预定距离切割的切割表面从中心轴平行于中心轴彼此接触，并且两个分离激光束之间的间隔与去除对象区域中的低k材料的两个边缘之间的间隔相同。根据本发明，在将激光束分成两束激光束并且主要使用激光束去除去除对象区域中的低k材料的边缘之后，边缘之间剩余的低k材料被去除。结果，可以提高加工质量。

13. 发明申请

WO2009002011A1 METHOD OF DIVIDING MARKING OBJECTS IN MULTI-LASER MARKING SYSTEM 审中-公开
标题翻译：多激光标记系统中标记对象的分割方法
公开(公告)号：WO2009002011A1
公开(公告)日：2008-12-31
申请号：PCT/KR2008/002397
申请日：2008-04-28
申请人： EO TECHNICS CO., LTD. , SUNG, Kyu-Dong , CHOI, Mi-Jin , WOO, Byung-Duk
发明人： SUNG, Kyu-Dong , CHOI, Mi-Jin , WOO, Byung-Duk
IPC分类号： B23K26/18
CPC分类号： B23K26/067 , B23K26/0673
摘要： Provided is a method of dividing marking objects in which the marking objects are divided so that some of the marking objects including a characteristic or figure to be marked are marked using a first laser beam and other remaining marking objects are marked using a second laser beam. The method includes: dividing a predetermined marking region into a first sub-marking region on which the first laser beam is used and a second sub-marking region on which the second laser beam is used; calculating respective estimated marking times taken to mark the marking objects; adding estimated marking times taken to mark marking objects included in the first sub-marking region and adding estimated marking times to mark marking objects included in the second sub-marking region; calculating a half value of a difference between a total value of the estimated marking times of the first sub-marking region and a total value of the estimated marking times of the second sub-marking region; selecting a marking object having an estimated marking time that is the same as or similar to the half value from among marking objects included in a sub-marking region corresponding to one of the first and second sub-marking regions, depending on which has the greater total estimated marking time value; and marking the selected marking object by using a laser beam different to that used for the sub-marking region including the selected marking object.
摘要翻译：提供了一种分割标记对象的方法，其中标记对象被划分，使得包括要标记的特征或图形的一些标记对象使用第一激光束来标记，并且使用第二激光束来标记其他剩余的标记对象。该方法包括：将预定的标记区域划分为使用第一激光束的第一子标记区域和使用第二激光束的第二子标记区域; 计算用于标记标记物体所需的估计标记时间; 添加用于标记包括在第一子标记区域中的标记对象的估计标记时间，并且添加估计标记时间以标记包括在第二子标记区域中的标记对象; 计算第一子标记区域的估计标记时间的总值与第二子标记区域的估计标记时间的总值之间的差的一半值; 从包括在与第一和第二子标记区域中的一个相对应的子标记区域中的标记对象中选择具有与该半值相同或类似的估计标记时间的标记对象，具体取决于哪个更大总估计标记时间值; 以及通过使用与用于包括所选择的标记对象的子标记区域不同的激光束来标记所选择的标记对象。

14. 发明申请

WO2005101487A1 LASER PROCESSING APPARATUS 审中-公开
标题翻译：激光加工设备
公开(公告)号：WO2005101487A1
公开(公告)日：2005-10-27
申请号：PCT/KR2004/001315
申请日：2004-06-02
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie
发明人： HAN, You-Hie
IPC分类号： H01L21/78
CPC分类号： B23K26/083 , B23K26/066 , B23K26/0736 , B23K26/082 , H01L21/78
摘要： Disclosed is a laser processing apparatus for minimizing generation of sludge and enhancing the processing efficiency while processing an object. The laser processing apparatus includes a beam irradiator for emitting a laser beam from a laser light source, a beam scanner for operating the laser beam emitted from the beam scanner, to be irradiated on a predetermined interval of a processing position of the object repeatedly on the straight, and a condensing lens for regulating a focus of the laser beam emitted from the beam irradiator. The object is movable at least once along a processing direction during processing the object. According to the present invention, it is able to improve the processing efficiency and to work an object with a uniform morphology by using a mask filtering a laser beam irradiated at a rotation turning point of a beam scanning mirror, capable of continuously irradiating a laser beam by deforming the laser beam into an elliptical pattern.
摘要翻译：公开了一种用于在处理物体的同时最小化污泥的产生和提高处理效率的激光加工装置。激光加工装置包括用于从激光光源发射激光束的光束照射器，用于操作从光束扫描器发射的激光束的光束扫描器，以在物体的反复处理位置的预定间隔上照射以及用于调节从光束照射器发射的激光束的焦点的聚光透镜。该物体在处理物体期间沿着处理方向可移动至少一次。根据本发明，通过使用照射在光束扫描镜的旋转转折点处的激光束进行掩模过滤，能够提高处理效率并且对具有均匀形态的物体进行加工，能够连续照射激光束通过使激光束变形为椭圆形图案。

15. 发明申请

WO2003092069A1 METHOD OF CALIBRATING MARKING IN LASER MARKING SYSTEM 审中-公开
标题翻译：在激光标记系统中校准标记的方法
公开(公告)号：WO2003092069A1
公开(公告)日：2003-11-06
申请号：PCT/KR2003/000841
申请日：2003-04-25
申请人： EO TECHNICS CO., LTD. , KIM, Byoung-Hwan , LEE, Jeong-Ku , BYUN, Young-Sik , KWON, Goo-Cheol , KIM, Tae-Jung
发明人： KIM, Byoung-Hwan , LEE, Jeong-Ku , BYUN, Young-Sik , KWON, Goo-Cheol , KIM, Tae-Jung
IPC分类号： H01L23/544
CPC分类号： H01L21/67282 , H01L21/681 , H01L23/544 , H01L2221/68313 , H01L2223/54473 , H01L2924/0002 , H01L2924/00
摘要： In a method for calibrating marking in a laser marking system, (a) each chip is assigned to be observed to a corresponding vision camera, (b) a coordinate of the vision camera and a coordinate of the laser marker are matched, (c) a predetermined first symbol is marked on a chip or at a position corresponding to the chip, a selected first symbol is observed using the corresponding vision camera, and one point of the first symbol is taught as a reference point, (d) the first symbol and the reference point of the chip are observed using the corresponding vision camera and a second symbol is marked on the chip with respect to the reference point, (e) the second symbol on a selected chip is observed and one point of the second symbol is taught as a comparison point, and (f) a position of the comparison point is detected from the reference point on the chip and the marking error in each cell is calculated.
摘要翻译：在用于校准激光打标系统中的标记的方法中，（a）将每个芯片分配为对相应的视觉摄像机进行观察，（b）视觉摄像机的坐标和激光标记的坐标相匹配，（c）将预定的第一符号标记在芯片上或对应于芯片的位置，使用相应的视觉相机观察所选择的第一符号，并且教导第一符号的一个点作为参考点，（d）第一符号并且使用相应的视觉相机观察芯片的参考点，并且相对于参考点在芯片上标记第二符号，（e）观察所选芯片上的第二符号，并且第二符号的一个点是作为比较点教导，（f）从芯片上的参考点检测比较点的位置，并计算每个单元格中的标记误差。

16. 发明申请

WO2010062100A3 DIGITAL 3D LITHOGRAPHY METHOD 审中-公开
标题翻译：数字三维光刻方法
公开(公告)号：WO2010062100A3
公开(公告)日：2010-08-12
申请号：PCT/KR2009006956
申请日：2009-11-25
申请人： EO TECHNICS CO LTD , SEO MAN SEUNG , KIM HAE RYUNG
发明人： SEO MAN SEUNG , KIM HAE RYUNG
IPC分类号： H01L21/027
CPC分类号： G03F7/70416
摘要： The present invention relates to lithography performed to form a 3D microstructure and a digital 3D lithography method wherein a 3D exposure quantity profile is formed on a substrate with formed photoresist, that has been determined by the characteristics of the photoresist film and the shape of a 3D microstructure, and specifically to a method wherein virtual layering forms a 3D exposure quantity profile by digital 2D lithography.
摘要翻译：本发明涉及执行以形成3D微结构和数字3D光刻方法的光刻，其中在已形成的光致抗蚀剂的衬底上形成3D曝光量分布，其已经由光刻胶膜的特性和3D的形状并且具体涉及其中虚拟分层通过数字2D光刻形成3D曝光量分布的方法。

17. 发明申请

WO2009128577A1 LASER MARKING CONTROLLER AND LASER MARKING SYSTEM INCLUDING THE SAME 审中-公开
标题翻译：激光标记控制器和包括其的激光标记系统
公开(公告)号：WO2009128577A1
公开(公告)日：2009-10-22
申请号：PCT/KR2008/002191
申请日：2008-04-18
申请人： EO TECHNICS CO., LTD. , KIM, Hyung-Gu , KWON, Young-Gil
发明人： KIM, Hyung-Gu , KWON, Young-Gil
IPC分类号： H01S3/00 , B23K26/00
CPC分类号： B23K26/0673 , B23K26/082
摘要： Provided are a laser marking controller and a laser marking system including the laser marking controller. The laser marking controller outputs a scanner controlling signal that includes a scanner driving signal driving a galvanometer scanner for reflecting an incident laser beam at a desired angle and a transmission signal for synchronizing the scanner driving signal, and a laser controlling signal transmitted to a laser controller for adjusting an intensity and a frequency of the laser beam, and is used in a laser marking system that marks desired characters or diagrams on a substrate by irradiating the laser beam onto the substrate. The laser marking controller includes: an input unit receiving the transmission signal, a scanner standby signal indicating whether the scanner driving signal is generated, and a laser standby signal determining whether the laser controlling signal will be output; a first output unit outputting the transmission signal, the scanner standby signal, and the laser standby signal; a second output unit outputting the scanner controlling signal and the laser controlling signal respectively to the galvanometer scanner and the laser controller; a scanner standby signal generator generating the scanner standby signal; and a calculator calculating the scanner standby signal output from the scanner standby signal generator and the scanner standby signal input through the input unit and outputting a calculation result.
摘要翻译：提供了激光打标控制器和包括激光打标控制器的激光打标系统。激光打标控制器输出扫描器控制信号，该扫描器控制信号包括驱动检流计扫描器的扫描仪驱动信号，用于以期望的角度反射入射的激光束，以及用于使扫描仪驱动信号同步的传输信号，以及传输到激光控制器的激光控制信号用于调节激光束的强度和频率，并且用于通过将激光束照射到衬底上来标记衬底上的所需字符或图形的激光标记系统。激光打标控制器包括：接收发送信号的输入单元，指示是否产生扫描仪驱动信号的扫描器待机信号，以及确定是否输出激光控制信号的激光待机信号; 输出发送信号的第一输出单元，扫描器待机信号和激光备用信号; 第二输出单元，将扫描仪控制信号和激光控制信号分别输出到电流计扫描器和激光控制器; 产生扫描器待机信号的扫描器待机信号发生器; 以及计算器，计算从扫描器待机信号发生器输出的扫描器待机信号和通过输入单元输入的扫描器待机信号，并输出计算结果。

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