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1. 发明申请

WO2017096092A1 MULTI-OPERATION TOOL FOR PHOTOVOLTAIC CELL PROCESSING 审中-公开
标题翻译：用于光伏电池加工的多操作工具
公开(公告)号：WO2017096092A1
公开(公告)日：2017-06-08
申请号：PCT/US2016/064497
申请日：2016-12-01
申请人： SUNPOWER CORPORATION
发明人： BECKETT, Nathan Phillips , ALMOGY, Gilad
IPC分类号： H01L31/18 , H01L31/042
CPC分类号： H01L31/1876 , B41F15/0881 , B41F15/14 , H01L21/67092 , H01L21/67109 , H01L21/67207 , H01L21/67282 , H01L21/6776 , H01L31/042 , H01L31/0504 , H01L31/18 , H01L31/188 , Y02E10/50
摘要： Multi-operation tools for photovoltaic cell processing are described. In an example, a multi-operation tool includes a conveyor system to move a photovoltaic (PV) cell continuously along a conveyor path through a laser scribing station and an adhesive printing station. Furthermore, the PV cell may be aligned to a laser head of the laser scribing station and a printer head of the adhesive printing station in a single alignment operation prior to being laser scribed and printed with an adhesive in a continuous process.
摘要翻译：描述了用于光伏电池处理的多操作工具。在一个示例中，多操作工具包括传送系统，用于沿着传送路径连续地移动光伏（PV）电池通过激光划片站和粘合剂印刷站。此外，PV电池可以在激光刻划并以连续工艺用粘合剂印刷之前以单一对准操作与激光划线站的激光头和粘合印刷站的印刷头对准。

2. 发明申请

WO2013096382A1 METHOD AND APPARATUS FOR LASER MARKING AN OBJECT 审中-公开
标题翻译：用于激光标记物体的方法和装置
公开(公告)号：WO2013096382A1
公开(公告)日：2013-06-27
申请号：PCT/US2012/070491
申请日：2012-12-19
申请人： FIRST SOLAR, INC. , CONLEY, Joshua , HINKLE, James, Ernest
发明人： CONLEY, Joshua , HINKLE, James, Ernest
IPC分类号： H01L21/67
CPC分类号： B41J3/4073 , B41J2/435 , B41J2/442 , H01L21/67282
摘要： Disclosed embodiments provide laser object marking methods and devices multiple slidable mechanisms are used for holding respective laser heads.
摘要翻译：公开的实施例提供激光对象标记方法和装置，多个可滑动机构用于保持相应的激光头。

3. 发明申请

WO2013063603A2 DEBONDING TEMPORARILY BONDED SEMICONDUCTOR WAFERS 审中-公开
标题翻译：绝缘粘结半导体晶体管
公开(公告)号：WO2013063603A2
公开(公告)日：2013-05-02
申请号：PCT/US2012/062480
申请日：2012-10-29
申请人： SUSS MICROTEC INC.
发明人： GEORGE, Gregory , ROSENTHAL, Christopher
IPC分类号： H01L21/02
CPC分类号： H01L21/6835 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/00 , H01L21/67092 , H01L21/67132 , H01L21/67282 , H01L21/6838 , H01L21/68707 , H01L21/68728 , H01L2221/683 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , Y10T156/11 , Y10T156/1142 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/19 , Y10T156/1911 , Y10T156/1961 , Y10T156/1967 , Y10T156/1978
摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
摘要翻译：所描述的方法和装置为装置晶片和载体晶片之间的粘合剂接合提供受控的扰动。受控的扰动可以是机械的，化学的，热的或辐射的，有助于两个晶片的分离，而不损坏器件晶片。控制的扰动在粘合剂层（例如在剥离层和粘合剂之间）的界面处，或在晶片/粘合剂界面处，在连接两个晶片的粘合剂内，引发裂纹。然后可以使用用于引发裂纹的任何前述方法或其组合来传播裂纹。

4. 发明申请

WO2011011141A1 VACUUM COUPLED TOOL APPARATUS FOR DRY TRANSFER PRINTING SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：干式转印半导体元件真空接头工具
公开(公告)号：WO2011011141A1
公开(公告)日：2011-01-27
申请号：PCT/US2010/039414
申请日：2010-06-22
申请人： SEMPRIUS, INC. , MENARD, Etienne
发明人： MENARD, Etienne
IPC分类号： H01L21/28
CPC分类号： H01L21/67092 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/187 , H01L21/67282 , H01L24/74 , H01L2224/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01067 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12041 , H01L2924/14 , H01L2924/00
摘要： Provided are an optimized tool apparatus and methods for dry transfer printing of semiconductor elements with high yield and good placement accuracy. The tool apparatus comprises a vacuum coupled fast peel apparatus that provides high pickup yield of the semiconductor elements. In an aspect, this vacuum coupled apparatus provides high pickup rates during pickup of the semiconductor elements from a donor/source wafer. Provided is a tool apparatus for dry transfer printing with a reinforced composite stamp having a thin glass-backing. The tool apparatus also comprises a pressure regulated micro-chamber which provides precise control of a composite stamp lamination and de-lamination. In an aspect, the micro-chamber has an internal cavity volume that is variably controlled, thereby providing precise control of the force on the stamp, and corresponding separation velocity, and improved semiconductor element pick-up and/or placement.
摘要翻译：提供了一种优化的用于半导体元件的干移印刷的工具装置和方法，其具有高产率和良好的放置精度。该工具装置包括提供半导体元件的高拾取量的真空耦合快速剥离装置。在一方面，这种真空耦合装置在从供体/源晶片拾取半导体元件期间提供高的拾取速率。本发明提供一种用于具有薄玻璃背衬的增强复合印模的干移印刷的工具装置。工具装置还包括压力调节微室，其提供复合印模层压和去层压的精确控制。在一个方面，微室具有可变控制的内部空腔体积，从而提供对印模上的力的精确控制，以及相应的分离速度，以及改进的半导体元件拾取和/或放置。

5. 发明申请

WO2006078000A2 ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT MOUNTING DEVICE, AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装系统，电子元件安装装置和电子元件安装方法
公开(公告)号：WO2006078000A2
公开(公告)日：2006-07-27
申请号：PCT/JP2006/300915
申请日：2006-01-17
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , KIHARA, Masahiro , INOUE, Masafumi
发明人： KIHARA, Masahiro , INOUE, Masafumi
IPC分类号： B23K3/00
CPC分类号： H05K3/3484 , B23K1/0016 , H01L21/67282 , H01L22/12 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/75 , H05K1/0269 , H05K3/0097 , H05K13/08 , H05K2203/163
摘要： To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. In the electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates is determined by the test of the print state of the solder and a determination result is output to an electronic component placing device as solder test data in every unit substrate. In a component placing steps, a component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good. Accordingly, it is possible to prevent waste due to the place of an electronic component onto a unit substrate having a print failure.
摘要翻译：提供一种电子部件安装系统，电子部件放置装置和电子部件安装方法，其可以防止由于将电子部件放置在具有打印故障的单元基板上而引起的浪费。在将电子部件安装在同一基板上形成多个单位基板的多基板上的电子部件安装方法中，印刷在形成于多个单位基板上的电极上的焊料的印刷状态的质量为通过焊料的打印状态的测试来确定，并且将确定结果输出到电子部件放置装置作为每个单位基板中的焊接测试数据。在部件放置步骤中，基于焊料测试数据来控制部件放置机构，使得仅在确定焊料的打印状态良好的单元基板上执行部件放置操作。因此，可以防止由于电子部件的位置而导致在具有打印故障的单元基板上的浪费。

6. 发明申请

WO2016154539A1 SUBSTRATE ALIGNMENT THROUGH DETECTION OF ROTATING TMING PATTERN 审中-公开
标题翻译：通过检测旋转模式的基板对准
公开(公告)号：WO2016154539A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/024224
申请日：2016-03-25
申请人： DOUG CARSON & ASSOCIATES, INC.
发明人： CARSON, Douglas, M. , CHATTERTON, Mike
IPC分类号： G11B7/08 , G11B7/09 , G11B7/26
CPC分类号： H01J37/3005 , B01L3/5027 , B01L3/502707 , B01L2300/024 , B01L2300/0806 , B01L2300/0887 , B01L2400/0409 , G11B7/24094 , G11B7/261 , H01J37/20 , H01J37/3045 , H01J37/3174 , H01J2237/2007 , H01J2237/3175 , H01L21/67259 , H01L21/67282 , H01L21/681 , H01L23/544 , H01L2223/54426 , H01L2223/54453
摘要： Apparatus (100) and method (500 for aligning a rotatable substrate (100, 700, 900, 1000, 1 100). In some embodiments, a circumferentially extending timing pattern (400) is formed on a substrate (step 506). The timing pattern nominally extends about a center point (206) of the substrate at a selected radius. The substrate is mounted to a support mechanism (102) which rotates the substrate about a central axis (104). Due to mechanical tolerances, the central axis will be offset from the center point of the substrate as a result of an alignment error during the mounting of the substrate. The offset between the support mechanism central axis and the center point of the substrate is determined using a detector (118) that detects two opposing cross-over transitions (208, 210) of the timing pattern during each revolution of the substrate (step 514). A feature (602, 604, 902, 904, 910) may be written to the substrate by positioning a write element with respect to the substrate responsive to the detected offset (step 516).
摘要翻译：在一些实施例中，在衬底上形成周向延伸的定时图案（400）（步骤506），所述定时（100）和方法（500）用于对准可旋转衬底（100,700,900,1100,1100）图案名义上以选定的半径围绕衬底的中心点（206）延伸，衬底安装到支撑机构（102），该支撑机构使衬底围绕中心轴线（104）旋转，由于机械公差，中心轴将由于在基板的安装过程中的对准误差，基板的中心点偏离基板的中心点，支撑机构中心轴线与基板的中心点之间的偏移量使用检测器（118）来确定，该检测器检测两个相对的可以通过将写入元件定位在与基板相对的位置上，将特征（602,604,902,904,910）写入基板，从而在基板的每个转动期间的定时图案的交叉转变（208,210）到底物 e检测到偏移（步骤516）。

7. 发明申请

WO2015199269A1 웨이퍼 다이의 마킹방법 审中-公开
标题翻译： WAFER DICE的标记方法
公开(公告)号：WO2015199269A1
公开(公告)日：2015-12-30
申请号：PCT/KR2014/005871
申请日：2014-07-01
申请人： 주식회사 이오테크닉스
发明人： 김선중 , 최재만 , 정성범 , 서중진 , 정혜지
IPC分类号： H01L23/544
CPC分类号： H01L21/67282 , B23K26/0006 , B23K26/0087 , B23K26/032 , B23K26/0869 , B23K26/359 , B23K2201/40 , B23K2203/56 , H01L21/268 , H01L21/78 , H01L23/544 , H01L2223/54433 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： 웨이퍼의 다이싱 공정에 의해 분할된 다수의 웨이퍼 다이들을 레이저 마커로 마킹하는 방법이 개시된다. 개시된 웨이퍼 다이의 마킹 방법은, 웨이퍼 다이들을 포함하는 상기 웨이퍼 상에 일부가 서로 중첩되는 복수개의 스캔 영역을 설정하는 단계와, 라인 스캔 카메라를 이용하여 상기 웨이퍼의 스캔 영역들에 복수회의 스캔 과정을 수행하는 단계와, 상기 스캔 영역들이 중첩되지 않은 영역들에 위치하는 상기 웨이퍼 다이들 각각의 위치 정보를 수집하는 단계와, 상기 스캔 영역들이 중첩되는 영역들에 위치하는 상기 웨이퍼 다이들 각각의 위치 정보를 이미지 합성을 통해 수집하는 단계와, 상기 레이저 마커로 상기 위치 정보가 수집된 모든 웨이퍼 다이들 각각에 마킹을 수행하는 단계;를 포함한다.
摘要翻译：公开了一种通过使用激光标记来标记由晶圆切片工艺分割的多个晶片骰子的方法。所公开的晶圆片的标记方法包括以下步骤：在包括晶片裸片的晶片上设置具有相互重叠部分的多个扫描区域; 通过使用线扫描照相机多次扫描晶片的扫描区域; 收集位于扫描区域不重叠的区域中的每个晶片骰子的位置信息; 通过图像合成收集位于扫描区域重叠的区域中的每个晶片骰子的位置信息; 并且通过使用激光标记来标记已经收集了位置信息的所有晶片骰子中的每一个。

8. 发明申请

WO2015088658A3 INTEGRATED WIRE BONDER AND 3D MEASUREMENT SYSTEM WITH DEFECT REJECTION 审中-公开
标题翻译：集成线束和三维测量系统与缺陷拒绝
公开(公告)号：WO2015088658A3
公开(公告)日：2015-08-06
申请号：PCT/US2014062172
申请日：2014-10-24
申请人： FAIRCHILD SEMICONDUCTOR
发明人： KELLER DAREN W
IPC分类号： H01L21/67 , H01L21/60
CPC分类号： H01L24/78 , H01L21/67253 , H01L21/67282 , H01L21/67288 , H01L22/12 , H01L22/26 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2223/54413 , H01L2223/54433 , H01L2223/54473 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48137 , H01L2224/48177 , H01L2224/48227 , H01L2224/48247 , H01L2224/78753 , H01L2224/789 , H01L2224/78901 , H01L2224/85801 , H01L2224/8585 , H01L2224/859 , H01L2924/1203 , H01L2924/12033 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/00014 , H01L2924/00
摘要： An apparatus comprises a wire bonder system including a wire bonding device (210), a measuring device (215) and a rejection device (220). The wire bonding device (210) is configured to attach wire bond type electrical interconnect to an electronic assembly. A wire bond is formed between a first semiconductor device and a second electronic device to form at least a portion of the electronic assembly. The measuring device (215) is configured to perform a three dimensional measurement associated with a wire bond, and the rejection device (220) is configured to identify an electronic assembly for rejection according to the three dimensional wire bond measurement.
摘要翻译：一种装置包括一种包括接线装置（210），测量装置（215）和拒收装置（220）的引线接合系统。引线接合装置（210）被配置为将引线接合型电互连件附接到电子组件。在第一半导体器件和第二电子器件之间形成引线接合以形成电子组件的至少一部分。测量装置（215）被配置为执行与引线接合相关联的三维测量，并且拒绝装置（220）被配置为根据三维线接合测量来识别用于拒绝的电子组件。

9. 发明申请

WO2009095474A1 LASER-BESCHRIFTUNGSVORRICHTUNG MIT EINER EINEN NIEDRIGEN REIBUNGSKOEFFIZIENTEN AUFWEISENDEN TRANSPORTBAND UMFASSENDEN ZUFÜHREINRICHTUNG 审中-公开
标题翻译： WITH摩擦HAVING TRANSPORTBAND综合进料的低系数激光标记装置
公开(公告)号：WO2009095474A1
公开(公告)日：2009-08-06
申请号：PCT/EP2009/051071
申请日：2009-01-30
申请人： GORDON VERWALTUNG GMBH , TESCHAUER, Gert , WEISSBECK, Matthias , KRAUSE, Steffen , GRUSSER, Roman , UHLIG, Sebastian
发明人： TESCHAUER, Gert , WEISSBECK, Matthias , KRAUSE, Steffen , GRUSSER, Roman , UHLIG, Sebastian
IPC分类号： B23K26/00 , B23K26/08 , B23K26/36 , B23K26/40 , B44C1/22 , H01L21/00 , H01L21/677 , B65G15/10
CPC分类号： B23K26/40 , B23K26/0838 , B23K26/361 , B23K2201/40 , B23K2203/52 , H01L21/67259 , H01L21/67282 , H01L21/67706
摘要： Die Erfindung betrifft eine Vorrichtung zur Beschriftung insbesondere dünner Werkstücke (1), deren Spröde eine besondere Handhabung erfordert. Ein bevorzugtes Anwendungsgebiet der Erfindung ist die Beschriftung von Wafern. Die Aufgabe der Erfindung besteht darin, das Werkstück (1) der Beschriftungsvorrichtung gegen Beschädigung gesichert so zuzuführen, dass die Beschriftung in normierbaren Bereichen erfolgt. Die Aufgabe wird gelöst durch eine Laser-Beschriftungsvorrichtung mit einem Beschriftungslaser, einer dem Beschriftungslaser (2) nachgeschalteten Kontroll-Leseeinrichtung (3), einem Steuerrechner (4) und einer Zuführeinrichtung (5), die ein wenigstens nahezu schlupf frei angetriebenes, auf der Werkstückseite einen niedrigen Reibungskoeffizienten aufweisendes Transportband (51) umfasst, wobei das Werkstück (1) vor der Beschriftung einer Positioniereinrichtung (6; 61-62) zugeführt wird.
摘要翻译：本发明涉及一种用于特别是薄工件标记的装置（1），所述脆性需要特殊处理。本发明的一个优选的应用是晶片的标记。本发明的目的是防止损坏标记装置固定，以便供应该标记在standardizable区域的工件（1）。该目的是通过激光对工件的侧面标记装置包括激光标记，所述标记的激光（2）下游的控制读出装置（3），控制计算机（4）和一个进给装置（5）至少基本上无滑动驱动，实现包括低摩擦系数显示出传送带（51），其中的定位装置的所述标记之前的工件（1）（6; 61-62）被提供。

10. 发明申请

WO2008043934A3 METHOD FOR INDIVIDUALLY MARKING INTEGRATED CIRCUITS AND INTEGRATED CIRCUIT MARKED ACCORDING TO SAID METHOD 审中-公开
标题翻译：根据所述方法单独标记集成电路和集成电路的方法
公开(公告)号：WO2008043934A3
公开(公告)日：2008-06-26
申请号：PCT/FR2007052049
申请日：2007-10-01
申请人： MICROCOMPOSANTS HAUTE SECURITE , BOCQUENE DOMINIQUE , GADOT GERARD
发明人： BOCQUENE DOMINIQUE , GADOT GERARD
IPC分类号： H01L23/544 , B23K26/06 , H01L23/31
CPC分类号： H01L23/544 , H01L21/67276 , H01L21/67282 , H01L21/67288 , H01L21/67294 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54473 , H01L2223/5448 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a method for individually marking an integrated circuit (3.1-3.M). The method involves marking at least one integrated circuit (3.1-3.M) provided on a plate (2.1) comprising a plurality of integrated circuits, wherein said plate (2.1) belongs to a batch (1) of plates (2.1-2.N). The marking includes primary information (ID1-IDM) relating to the plate (2.1) carrying said integrated circuit and to the integrated circuit (3.1, 3.M) itself (e.g., plate batch number + plate number + circuit position). During another step carried out before or after the marking, the marked integrated circuit (3.1, 3.M) is cut out so as to be separated from the rest of the plate. The marking is carried out using a laser of the femtosecond type in the surface portion of the last layer (23) of the integrated circuit.
摘要翻译：本发明涉及一种用于单独标记集成电路（3.1-3.M）的方法。该方法涉及标记在包括多个集成电路的板（2.1）上提供的至少一个集成电路（3.1-3.M），其中所述板（2.1）属于板（2.1-2.M）的批次（1）。 N）。该标记包括与承载所述集成电路的板（2.1）和集成电路（3.1,3.M）本身（例如，板批号+板号+电路位置）有关的主要信息（ID1-IDM）。在标记之前或之后执行的另一步骤中，标记的集成电路（3.1,3.M）被切除以与板的其余部分分离。该标记是在集成电路的最后层（23）的表面部分中使用飞秒型激光进行的。

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