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1. 发明申请

WO2006020769A1 SEMICONDUCTOR ATTACHMENT METHOD AND ASSEMBLY 审中-公开
标题翻译：半导体附件方法和装配
公开(公告)号：WO2006020769A1
公开(公告)日：2006-02-23
申请号：PCT/US2005/028551
申请日：2005-08-11
申请人： CRYDOM TECHNOLOGIES , POPESCU, Eugen
发明人： POPESCU, Eugen
IPC分类号： H01L21/44
CPC分类号： H05K3/341 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/37147 , H01L2224/37599 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10157 , H01L2924/10158 , H01L2924/13034 , H01L2924/15787 , H01L2924/19105 , H01L2924/351 , H05K3/3463 , H05K3/3484 , H05K2201/10992 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/29116 , H01L2924/00014
摘要： An improved semiconductor attachment method that works with mixed assemblies on printed circuit boards or ceramic substrates maintains reliability and reduces the amount of lead-based solders used. A soft solder layer (102), which may be high in lead content, is deposited on the terminations of a semiconductor die (104). The soft solder layer (102) acts as a cushion, protecting the fragile semiconductor die (104) from thermally induced stress. Conductor pads (204) of the substrate (202) are printed with a low melting point solder paste (306) that is preferably lead-free. The semiconductor die (104), along with other electric components (302), are mounted on the proper conductor pads (204). The low melting point solder paste (306) is reflowed, heating the substrate (202) and the other electric components (302). As a result, the low melting point solder paste (306) forms strong solid metal solder joints (402) between the conductor pads (204) of the substrate (202) and the terminations of the semiconductor die (104) and the other electric components (302).
摘要翻译：与印刷电路板或陶瓷基板上的混合组件一起使用的改进的半导体附着方法保持可靠性并减少使用的铅基焊料的量。可以具有高铅含量的软焊料层（102）沉积在半导体管芯（104）的端子上。软焊料层（102）用作衬垫，保护脆性半导体管芯（104）免受热致应力。衬底（202）的导体焊盘（204）印刷有优选无铅的低熔点焊膏（306）。半导体管芯（104）以及其它电气部件（302）安装在适当的导体焊盘（204）上。将低熔点焊膏（306）回流，加热基板（202）和其它电气部件（302）。结果，低熔点焊膏（306）在衬底（202）的导体焊盘（204）和半导体管芯（104）的端子之间形成强固体金属焊点（402）和其它电气部件（302）。

2. 发明申请

WO2005048316A3 TEARDROP SHAPED LEAD FRAMES 审中-公开
公开(公告)号：WO2005048316A3
公开(公告)日：2005-05-26
申请号：PCT/US2004/038090
申请日：2004-11-05
申请人： CRYDOM TECHNOLOGIES , POPESCU, Eugen , FREDRICKSON, Herbert, Otto
发明人： POPESCU, Eugen , FREDRICKSON, Herbert, Otto
IPC分类号： H01L21/48
摘要： A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large rounded portion. The teardrop shape eliminates sharp corners found in rectangular frames and allows heat to dissipate radially in all directions. More metal in close proximity to the power semiconductor, maintaining a lower aspect ratio of length to width, allows the semiconductor to run cooler at any given load. Several vent holes are located in the small rounded portion, which act as exhaust ports for the fumes generated in the heating stage of the solder re-flow, increasing solder coverage and improving reliability. The life of solder junctions utilizing the teardrop shaped lead frame which are subjected to temperature cycling while under load is increased, thus extending the life of the solid state relay.

3. 发明申请

WO2005048316A2 TEARDROP SHAPED LEAD FRAMES 审中-公开
标题翻译：烙印形状铅框架
公开(公告)号：WO2005048316A2
公开(公告)日：2005-05-26
申请号：PCT/US2004038090
申请日：2004-11-05
申请人： CRYDOM TECHNOLOGIES , POPESCU EUGEN , FREDRICKSON HERBERT OTTO
发明人： POPESCU EUGEN , FREDRICKSON HERBERT OTTO
IPC分类号： H01L20060101 , H01L21/48 , H01L23/495 , H01L23/498 , H01L
CPC分类号： H01L23/49844 , H01L2924/0002 , H01L2924/00
摘要： A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large rounded portion. The teardrop shape eliminates sharp corners found in rectangular frames and allows heat to dissipate radially in all directions. More metal in close proximity to the power semiconductor, maintaining a lower aspect ratio of length to width, allows the semiconductor to run cooler at any given load. Several vent holes are located in the small rounded portion, which act as exhaust ports for the fumes generated in the heating stage of the solder re-flow, increasing solder coverage and improving reliability. The life of solder junctions utilizing the teardrop shaped lead frame which are subjected to temperature cycling while under load is increased, thus extending the life of the solid state relay.
摘要翻译：用于固态继电器的引线框架具有泪珠形框架。框架具有连接到大圆形部分的小圆形部分。功率半导体安装在大的圆形部分。泪滴形状消除了在矩形框架中发现的尖角，并允许热量在所有方向上径向消散。更靠近功率半导体的金属，保持长宽比较低的长宽比，允许半导体在任何给定的负载下运行较冷。几个通气孔位于小圆形部分，其作为用于在焊料再流动的加热阶段中产生的烟气的排气口，增加焊接覆盖和提高可靠性。使用在负载下经受温度循环的泪珠形引线框架的焊点的寿命增加，从而延长了固态继电器的寿命。

4. 发明申请

WO2005041268A2 ALUMINUM HEAT SINK FOR A SOLID STATE RELAY HAVING ULTRASONICALLY WELDED COPPER FOIL 审中-公开
标题翻译：用于具有超声波焊接铜箔的固态继电器的铝合金散热器
公开(公告)号：WO2005041268A2
公开(公告)日：2005-05-06
申请号：PCT/US2004035725
申请日：2004-10-22
申请人： CRYDOM TECHNOLOGIES , POPESCU EUGEN
发明人： POPESCU EUGEN
IPC分类号： B23K20/10 , H01H11/00 , H01L20060101 , H01L23/02 , H05K7/02 , H01L
CPC分类号： H01L23/3735 , H01L21/4882 , H01L21/50 , H01L2924/0002 , Y10T29/49 , Y10T29/49105 , H01L2924/00
摘要： Instead of soldering a circuit board or substrate to a nickel-plated aluminum heat sink for solid state relay applications, the present invention utilizes ultrasonic welding to weld a copper foil to a non-nickel-plated aluminum heat sink. The circuit board or substrate is subsequently soldered to the copper foil. The superior solderability of copper foil brings increased solder coverage between the heat sink and substrate, improving the heat transfer from the output switching element to the heat sink. This method eliminates the need for fixturing since the copper, foil is surrounded by non-nickelplated aluminum that is non-solderable by commonly used solders. This method also eliminates the high costs associated with nickel-plating and hazardous waste disposal, since no chemical wastes are produced. With this method, the same size solid state relay is now able to carry more current due to the better heat transfer and heat dissipation capabilities.
摘要翻译：本发明不是将电路板或基板焊接到用于固态继电器的镀镍铝散热器上，而是利用超声波焊接将铜箔焊接到非镀镍铝散热片上。电路板或基板随后被焊接到铜箔上。铜箔的优异的可焊性使得散热器和衬底之间的焊接覆盖增加，从而提高从输出开关元件到散热器的热传递。这种方法消除了对夹具的需要，因为铜箔被常用焊料不可焊接的非镀镍铝包围。由于不会产生化学废物，所以这种方法也消除了与镀镍和危险废物处理相关的高成本。通过这种方法，由于具有更好的传热和散热能力，相同尺寸的固态继电器现在能够承载更多的电流。

5. 发明申请

WO2005041268A3 ALUMINUM HEAT SINK FOR A SOLID STATE RELAY HAVING ULTRASONICALLY WELDED COPPER FOIL 审中-公开
公开(公告)号：WO2005041268A3
公开(公告)日：2005-05-06
申请号：PCT/US2004/035725
申请日：2004-10-22
申请人： CRYDOM TECHNOLOGIES , POPESCU, Eugen
发明人： POPESCU, Eugen
IPC分类号： B23K20/10
摘要： Instead of soldering a circuit board or substrate to a nickel-plated aluminum heat sink for solid state relay applications, the present invention utilizes ultrasonic welding to weld a copper foil to a non-nickel-plated aluminum heat sink. The circuit board or substrate is subsequently soldered to the copper foil. The superior solderability of copper foil brings increased solder coverage between the heat sink and substrate, improving the heat transfer from the output switching element to the heat sink. This method eliminates the need for fixturing since the copper, foil is surrounded by non-nickelplated aluminum that is non-solderable by commonly used solders. This method also eliminates the high costs associated with nickel-plating and hazardous waste disposal, since no chemical wastes are produced. With this method, the same size solid state relay is now able to carry more current due to the better heat transfer and heat dissipation capabilities.

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