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1. 发明申请

WO2005048316A2 TEARDROP SHAPED LEAD FRAMES 审中-公开
标题翻译：烙印形状铅框架
公开(公告)号：WO2005048316A2
公开(公告)日：2005-05-26
申请号：PCT/US2004038090
申请日：2004-11-05
申请人： CRYDOM TECHNOLOGIES , POPESCU EUGEN , FREDRICKSON HERBERT OTTO
发明人： POPESCU EUGEN , FREDRICKSON HERBERT OTTO
IPC分类号： H01L20060101 , H01L21/48 , H01L23/495 , H01L23/498 , H01L
CPC分类号： H01L23/49844 , H01L2924/0002 , H01L2924/00
摘要： A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large rounded portion. The teardrop shape eliminates sharp corners found in rectangular frames and allows heat to dissipate radially in all directions. More metal in close proximity to the power semiconductor, maintaining a lower aspect ratio of length to width, allows the semiconductor to run cooler at any given load. Several vent holes are located in the small rounded portion, which act as exhaust ports for the fumes generated in the heating stage of the solder re-flow, increasing solder coverage and improving reliability. The life of solder junctions utilizing the teardrop shaped lead frame which are subjected to temperature cycling while under load is increased, thus extending the life of the solid state relay.
摘要翻译：用于固态继电器的引线框架具有泪珠形框架。框架具有连接到大圆形部分的小圆形部分。功率半导体安装在大的圆形部分。泪滴形状消除了在矩形框架中发现的尖角，并允许热量在所有方向上径向消散。更靠近功率半导体的金属，保持长宽比较低的长宽比，允许半导体在任何给定的负载下运行较冷。几个通气孔位于小圆形部分，其作为用于在焊料再流动的加热阶段中产生的烟气的排气口，增加焊接覆盖和提高可靠性。使用在负载下经受温度循环的泪珠形引线框架的焊点的寿命增加，从而延长了固态继电器的寿命。

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