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    • 4. 发明授权
    • Dynamic residue clearing control with in-situ profile control (ISPC)
    • 动态残留清除控制与原位轮廓控制(ISPC)
    • US09242337B2
    • 2016-01-26
    • US14185185
    • 2014-02-20
    • Applied Materials, Inc.
    • Jun QianSivakumar DhandapaniBenjamin CherianThomas H. OsterheldCharles C. Garretson
    • B24B49/12B24B49/10B24B37/005B24B35/00
    • B24B35/005B24B37/005
    • A method for controlling the residue clearing process of a chemical mechanical polishing (“CMP”) process is provided. Dynamic in-situ profile control (“ISPC”) is used to control polishing before residue clearing starts, and then a new polishing recipe is dynamically calculated for the clearing process. Several different methods are disclosed for calculating the clearing recipe. First, in certain implementations when feedback at T0 or T1 methods are used, a post polishing profile and feedback offsets are generated in ISPC software. Based on the polishing profile and feedback generated from ISPC before the start of the clearing process, a flat post profile after clearing is targeted. The estimated time for the clearing step may be based on the previously processed wafers (for example, a moving average of the previous endpoint times). The calculated pressures may be scaled to a lower (or higher) baseline pressure for a more uniform clearing.
    • 提供了一种用于控制化学机械抛光(“CMP”)工艺的残渣清除过程的方法。 动态原位轮廓控制(“ISPC”)用于在清除开始之前控制抛光,然后动态地计算清理过程的新抛光配方。 公开了用于计算清除配方的几种不同的方法。 首先,在使用T0或T1方法的反馈的某些实现中,在ISPC软件中生成后抛光轮廓和反馈偏移。 根据在清算过程开始之前从ISPC产生的抛光轮廓和反馈,目标是清除后的平坦柱状态。 清除步骤的估计时间可以基于先前处理的晶片(例如,先前端点时间的移动平均值)。 计算的压力可以缩放到较低(或更高)的基线压力,以获得更均匀的清除。
    • 7. 发明授权
    • Coping and profile cutting and/or sanding apparatus
    • 应对和轮廓切割和/或砂光装置
    • US6086462A
    • 2000-07-11
    • US1089
    • 1997-12-30
    • Thomas J. Brown
    • Thomas J. Brown
    • B23D49/06B23D61/12B23D61/18B24B9/18B24B35/00B24B47/16B24D99/00B24B7/00
    • B24D99/00B23D49/06B23D61/126B23D61/18B24B35/00B24B47/16B24B9/18
    • A powered coping and profile cutting and/or sanding apparatus is able to impart any shape to the surface of a body of material (17) at any angle, simple or compound, relative to the body of material. The apparatus comprises a reciprocating "frame"(36) encasing thin stacking metal sheets (42) which are adjustable in a forward/backward direction for allowing multiple shape setups. The sheets (42), which are oriented vertically, have saw teeth at their top sections (42a) and no teeth at their bottom sections (42b). Adhesive-backed sandpaper (78) is affixed to the bottom section (42b) after the shape is set. This allows a cutting phase and a sanding phase with the same profile. The entire reciprocating frame (36) pivots multidirectionally within two planes, and may be locked at any angle. The reciprocating frame (36) is movable in a forward/backward direction. The body of material (17) being cut is immovably clamped, and the frame (36) is moved into the body of material (17) for the cutting and/or sanding operation.
    • 动力应对和轮廓切割和/或砂光装置能够相对于材料体以任何角度以简单或复合的方式将材料(17)的表面赋予任何形状。 该装置包括一个包围薄堆叠金属片(42)的往复运动的“框架”(36),它们可以在向前/向后的方向上调节以允许多种形状的设置。 垂直取向的片材(42)在其顶部部分(42a)具有锯齿,并且在其底部部分(42b)处没有齿。 粘贴后砂纸(78)在形状设定后固定在底部(42b)上。 这允许具有相同轮廓的切割阶段和砂磨阶段。 整个往复式框架(36)在两个平面内多方向枢转,并且可以以任何角度被锁定。 往复运动框架(36)可沿前后方向移动。 被切割的材料体(17)不可移动地夹紧,框架(36)移动到材料体(17)中,用于切割和/或打磨操作。
    • 8. 发明授权
    • Ultrasonic vibration composite grinding tool
    • 超声波振动复合研磨工具
    • US5984765A
    • 1999-11-16
    • US910353
    • 1997-08-12
    • Hiroshi Hashimoto
    • Hiroshi Hashimoto
    • B24B7/22B24B1/04B24B7/24B24B35/00
    • B24B1/04B24B35/00Y10S451/91
    • An ultrasonic vibration composite grinding tool is disclosed wherein a plurality of small-sized grinding wheels are arranged for carrying out grinding of a ground material while applying vibration to the ground material, to thereby ensure stable operation of the grinding tool to accomplish efficient grinding of the ground material even when the ground material is large-sized. A grinding structure and a vibration structure are arranged. The grinding structure includes a rotatable base having a rotation axis and a plurality of grinding wheels formed into the same configuration and each including a micro-cutting surface. The grinding wheels are arranged on one surface of the base in a manner to be spaced from each other at predetermined intervals in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the grinding wheels.
    • 公开了一种超声波振动复合研磨工具,其中设置有多个小型砂轮,用于在对磨碎材料施加振动的同时对研磨材料进行磨削,从而确保研磨工具的稳定运行,以实现对 研磨材料即使是大面积的研磨材料也是如此。 设置研磨结构和振动结构。 磨削结构包括具有旋转轴线的可旋转基座和形成为相同构造并且各自包括微切割表面的多个砂轮。 研磨轮以基部的旋转轴线的周向的方式以预定间隔彼此间隔开的方式布置在基部的一个表面上。 振动结构用于振动磨轮。