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1. 发明授权

US06614645B1 Matched capacitor array 有权
标题翻译：匹配电容阵列
公开(公告)号：US06614645B1
公开(公告)日：2003-09-02
申请号：US10293628
申请日：2002-11-12
申请人： Satoshi Sakurai , Jason Chin
发明人： Satoshi Sakurai , Jason Chin
IPC分类号： H01G438
CPC分类号： H01G4/38 , H01L27/0805
摘要： A capacitor array of the present invention has a plurality of core capacitors arranged in a plurality of rows and a plurality of columns. A plurality of guard capacitors are arranged such that there is a guard capacitor at the beginning and end of each of the rows and columns of core capacitors. A plurality of fringe capacitors are arranged between the guard capacitors and the core capacitors. The top plates of the core capacitors and the top plates of the fringe capacitors are coupled to a first node of a circuit. The top and bottom plates of the guard capacitors and the bottom plates of the fringe capacitors are coupled to ground. The each of the bottom plates of the core capacitors are independently coupled to a respective independent node of the circuit. The various capacitors of the array and the means for coupling them are uniformly distributed such that each core capacitor is uniformly influenced by its adjacent structure. Thus, each core capacitor in the capacitor array has substantially matched primary and parasitic capacitances.
摘要翻译：本发明的电容器阵列具有以多列排列的多个芯电容器。多个保护电容器布置成使得在芯电容器的每行和列的开始和结束处存在保护电容器。在保护电容器和核心电容器之间布置多个边缘电容器。核心电容器的顶板和条纹电容器的顶板耦合到电路的第一节点。保护电容器的顶板和底板和条纹电容器的底板耦合到地。核心电容器的每个底板独立地耦合到电路的相应独立节点。阵列的各种电容器和用于耦合它们的装置是均匀分布的，使得每个芯电容器均匀地受其相邻结构的影响。因此，电容器阵列中的每个核心电容器具有基本匹配的初级和寄生电容。

2. 发明授权

US06724612B2 Relative humidity sensor with integrated signal conditioning 有权
标题翻译：具有集成信号调理功能的相对湿度传感器
公开(公告)号：US06724612B2
公开(公告)日：2004-04-20
申请号：US10192451
申请日：2002-07-09
申请人： Richard A. Davis , Steve R. Foote , Ron Foster , Richard A. Kirkpatrick, II
发明人： Richard A. Davis , Steve R. Foote , Ron Foster , Richard A. Kirkpatrick, II
IPC分类号： H01G438
CPC分类号： G01D5/24 , G01N27/225
摘要： Methods of and systems providing high reliability relative humidity sensors having integrated signal conditioning are described, providing a series capacitive circuit including a humidity-sensitive dielectric, a common top plate and first and second bottom plates associated with a first and second capacitor, respectively. Changes in humidity affect the humidity-sensitive dielectric thereby causing changes in the capacitive value of said series capacitive circuit. The system includes a common top plate; a common humidity-sensitive dielectric formed under said common top plate; a first series capacitor Cx1 including a first bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; a second series capacitor Cx2 including a second bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; wherein said first series capacitor Cx1 and said second series capacitor Cx2 commonly share said dielectric and commonly share said common top plate and are arranged in a series capacitor circuit configuration within a semiconductor system. A sampling voltage source can provide a fixed voltage through said series capacitive circuit.
摘要翻译：描述了提供具有集成信号调理的高可靠性相对湿度传感器的方法和系统，其分别提供包括与第一和第二电容器相关联的湿度敏感电介质，公共顶板以及第一和第二底板的串联电容电路。湿度的变化影响湿敏电介质，从而引起所述串联电容电路的电容值的变化。该系统包括一个共同的顶板; 形成在所述公共顶板下方的共同的湿度敏感电介质; 第一串联电容器Cx1，包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第一底板; 第二串联电容器Cx2，包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第二底板; 其中所述第一串联电容器Cx1和所述第二串联电容器Cx2共同共享所述电介质并共同共享所述公共顶板并且被布置在半导体系统内的串联电容器电路配置中。采样电压源可以通过所述串联电容电路提供固定电压。

3. 发明授权

US06631071B2 Capacitor module 失效
公开(公告)号：US06631071B2
公开(公告)日：2003-10-07
申请号：US10341561
申请日：2003-01-14
申请人： Toshiyuki Kitagawa , Tatehiko Inoue , Isao Masumoto , Koji Tsuyuki
发明人： Toshiyuki Kitagawa , Tatehiko Inoue , Isao Masumoto , Koji Tsuyuki
IPC分类号： H01G438
CPC分类号： H05K3/301 , H01G2/06 , H01G9/12
摘要： A reliable capacitor module is provided which can solve the following problem: when a plurality of capacitors is mounted on a wiring board, the wiring board is distorted and deformed by the weight and cracks appear on mounting holes and the main body of the wiring board. The bottoms of metallic cases of the capacitors are fit in recesses formed on a mounting plate. In this state, lead wires drawn from the upper surfaces of the capacitors are electrically connected via the wiring board. With this configuration, a weight load of the plurality of capacitors is not applied at all, thereby preventing distortion and deformation of the wiring board and vibration causing cracks on the main body of the wiring board.

4. 发明授权

US06321429B1 Method of manufacturing an enveloped multilayer capacitor 失效
标题翻译：制造包层多层电容器的方法
公开(公告)号：US06321429B1
公开(公告)日：2001-11-27
申请号：US09498258
申请日：2000-02-03
申请人： Johannus W. Weekamp
发明人： Johannus W. Weekamp
IPC分类号： H01G438
CPC分类号： H01G2/12 , Y10T29/435
摘要： Method of manufacturing an enveloped multilayer capacitor and an enveloped multilayer comprising a method of manufacturing enveloped multilayer capacitors, in which a flat supporting plate of an electrically insulating material is provided with through-holes, dielectric layers and electrode layers are provided in the holes and on both surfaces of the flat supporting plate, after a sufficient number of layers has been provided for the intended purpose, the supporting plate is covered on both sides with a cover plate of an electrically insulating material which is hermetically secured to the supporting plate of an electrically insulating material, the assembly is subdivided into blocks which each comprise a multilayer capacitor enveloped by an electrically insulating material, with partition lines extending through the electrode layers situated on both surfaces of the supporting plate, and, subsequently, end contacts are provided on two opposing ends of the blocks.
摘要翻译：一种包络层叠电容器和包络多层膜的制造方法，其特征在于，包括制造包层多层电容器的方法，其中电绝缘材料的平板支撑板设置有通孔，电介质层和电极层，平面支撑板的表面在为预期目的提供了足够数量的层之后，支撑板被两侧覆盖有电绝缘材料的盖板，该电绝缘材料的盖板气密地固定到电绝缘的支撑板上组件被细分成块，每个块包括由电绝缘材料包围的多层电容器，分隔线延伸穿过位于支撑板的两个表面上的电极层，并且随后端接触件设置在两个相对端的块。

5. 发明授权

US06747522B2 Digitally controlled crystal oscillator with integrated coarse and fine control 有权
标题翻译：数字控制晶体振荡器，集成粗细精细控制
公开(公告)号：US06747522B2
公开(公告)日：2004-06-08
申请号：US10138027
申请日：2002-05-03
申请人： David M. Pietruszynski , Douglas R. Frey
发明人： David M. Pietruszynski , Douglas R. Frey
IPC分类号： H01G438
CPC分类号： H03K3/0307 , H03B5/32 , H03B2201/025 , H03J2200/10 , H03L7/099
摘要： A method of tuning a DCXO includes the step of providing a coarse tuning array and a fine tuning array of capacitors fabricated on the same integrated circuit die. The coarse array is adjusted until the difference between a desired frequency and the output frequency corresponds to a change in capacitance no greater than half the range of the fine tuning array. In one embodiment, the fine tuning array is adjusted to mid-range before adjusting the coarse tuning array. A DCXO apparatus includes at least one integrated circuit segmented switched capacitor network providing a capacitance that is a nonmonotonic function of a composite input code. The segmented switched capacitor network includes parallel coupled binary weighted and thermometer coded switched capacitor networks for coarse and fine tuning, respectively.
摘要翻译：调谐DCXO的方法包括提供在同一集成电路管芯上制造的粗调谐阵列和电容器的微调阵列的步骤。调整粗阵列，直到期望频率和输出频率之间的差值对应于不大于微调阵列范围的一半的电容变化。在一个实施例中，在调整粗调谐阵列之前，将微调阵列调整到中等范围。 DCXO装置包括至少一个集成电路分段的开关电容器网络，其提供作为复合输入代码的非单调功能的电容。分段开关电容网络分别包括用于粗调和微调的并联耦合二进制加权和温度计编码的开关电容器网络。

6. 发明授权

US06563691B2 Mounting structure for capacitors 失效
标题翻译：电容器的安装结构
公开(公告)号：US06563691B2
公开(公告)日：2003-05-13
申请号：US09954213
申请日：2001-09-18
申请人： Kenji Kijima , Kihei Nakajima
发明人： Kenji Kijima , Kihei Nakajima
IPC分类号： H01G438
CPC分类号： H05K1/0231 , H05K1/0254 , H05K1/113 , H05K3/3426 , H05K2201/09309 , H05K2201/10522 , H05K2201/10545 , H05K2201/10818
摘要： The mounting structure has a plurality of unit capacitors (1) comprising ceramic capacitor elements (2) with terminals (3), (4), and a three-tier substrate (10) comprising an insulating layer (11) sandwiched between two electrodes (12), (13). A plurality of apertures (15) is formed in the first electrode, in which are positioned bosses (16) being continuous with the second electrode (13), while the plurality of unit capacitors (1) is arranged on the first electrode (12), one terminal of each unit capacitor (1) being in contact with the first electrode (12) and the other with the second electrode (13) via a boss (16) so as to connect all the unit capacitors (1) electrically in parallel fashion. In this manner a mounting structure for capacitors is provided which permits of high capacity in a compact form.
摘要翻译：安装结构具有包括具有端子（3），（4）的陶瓷电容器元件（2）和夹在两个电极之间的绝缘层（11）的三层基板（10）的多个单位电容器（1） 12），（13）。在第一电极中形成有多个孔（15），其中定位的凸起（16）与第二电极（13）连续，而多个单位电容器（1）布置在第一电极（12）上，每个单位电容器（1）的一个端子经由凸台（16）与第一电极（12）接触，另一端与第二电极（13）接触，以便将所有单元电容器（1）并联电连接以这种方式，提供了用于电容器的安装结构，其允许以紧凑形式的高容量。

7. 发明授权

US06181218B2 High-linearity, low-spread variable capacitance array 失效
标题翻译：高线性，低扩展可变电容阵列
公开(公告)号：US06181218B2
公开(公告)日：2001-01-30
申请号：US09081542
申请日：1998-05-19
申请人： Ricke W. Clark , Jorge A. Grilo , Bo Zhang
发明人： Ricke W. Clark , Jorge A. Grilo , Bo Zhang
IPC分类号： H01G438
CPC分类号： H03B5/32 , H03B2201/0266 , H03J2200/10
摘要： The invention provides a unique apparatus and method which varies the capacitance coupled to a circuit. In one embodiment, the variable capacitance comprises a unique variable capacitance array with multiple capacitance modules which can be selectively enabled. Each capacitance module has a capacitive value and a corresponding parasitic capacitance. The invention provides high linearity, low spread, improves the response to power fluctuations by maintaining a consistent relationship between the capacitive value and the parasitic capacitance in each capacitance module. For example, the invention can be used with devices to provide a linear variation of capacitance. In addition, the invention can be used to calibrate a wide range of devices.
摘要翻译：本发明提供了一种独特的装置和方法，其改变耦合到电路的电容。在一个实施例中，可变电容包括具有多个电容模块的独特的可变电容阵列，其可被选择性地使能。每个电容模块具有电容值和相应的寄生电容。本发明通过保持每个电容模块中的电容值和寄生电容之间的一致关系，提供高线性度，低扩展性，从而改善对功率波动的响应。例如，本发明可以与装置一起使用以提供电容的线性变化。此外，本发明可用于校准各种各样的器件。

8. 发明授权

US06639785B1 Capacitor component 有权
标题翻译：电容元件
公开(公告)号：US06639785B1
公开(公告)日：2003-10-28
申请号：US10070678
申请日：2002-06-18
申请人： Udo Pursche
发明人： Udo Pursche
IPC分类号： H01G438
CPC分类号： H05K3/328 , H01G4/385 , H05K3/3436 , H05K2203/049
摘要： The capacitor component is mounted on a component assembly carrier provided with electronic circuit elements. The capacitor component includes at least two capacitors (C1, C2) formed on a common dielectric substrate plate (1). To avoid production-caused fluctuations in the capacitances in the production of identical kinds of capacitors with the same capacitances, first and third electrode layers for the capacitors (C1, C2) are applied at the same time to the top side of the dielectric substrate plate, and the second and fourth electrode layers are applied at the same time to the underside of the dielectric substrate plate opposite to the first and third dielectric layers respectively. The spatial dimensions of the third electrode layer correspond to the dimensions of the first electrode layer, and the spatial dimensions of the fourth electrode layer correspond to the dimensions of the second electrode layer, so that the respective capacitances of the capacitors (C1, C2) are matched as precisely as possible.
摘要翻译：电容器部件安装在具有电子电路元件的部件组件载体上。电容器部件包括形成在公共电介质基板（1）上的至少两个电容器（C1，C2）。为了避免产生相同电容的相同种类的电容器的电容产生的产生波动，用于电容器（C1，C2）的第一和第三电极层同时被施加到电介质基板的顶侧并且第二和第四电极层同时被施加到与第一和第三电介质层相对的电介质基板的下侧。第三电极层的空间尺寸对应于第一电极层的尺寸，并且第四电极层的空间尺寸对应于第二电极层的尺寸，使得电容器（C1，C2）的各自的电容尽可能精确地匹配。

9. 发明授权

US06285542B1 Ultra-small resistor-capacitor thin film network for inverted mounting to a surface 失效
标题翻译：超小电阻电容器薄膜网络，用于反向安装到表面
公开(公告)号：US06285542B1
公开(公告)日：2001-09-04
申请号：US09293817
申请日：1999-04-16
申请人： Robert M. Kennedy, III , Gheorghe Korony , Donghang Liu , Jeffrey P. Mevissen , Robert H. Heistand, II
发明人： Robert M. Kennedy, III , Gheorghe Korony , Donghang Liu , Jeffrey P. Mevissen , Robert H. Heistand, II
IPC分类号： H01G438
CPC分类号： H01L27/0682 , H01G4/40 , H05K1/023 , H05K3/3436 , Y10T29/435
摘要： A very small electronic device adapted for inverted mounting to a circuit board includes a multiplicity of capacitors and resistors built on a substrate. The capacitors and resistors are interconnected so as to provide multiple RC circuits in various circuit arrangements. The multiple layers of the device are covered by an encapsulate having openings to expose terminal pads of the RC circuits. The openings are filled with solder to produce the individual terminations of the device in a ball grid array (BGA). The device saves cost and/or board space in the manufacture of larger electronic equipment through the elimination of multiple discrete components. In addition, very low inductance is achieved due to the close proximity of the device to a circuit board on which it is mounted.
摘要翻译：适于反向安装到电路板的非常小的电子设备包括多个形成在基板上的电容器和电阻器。电容器和电阻器互连，以便在各种电路布置中提供多个RC电路。器件的多层被具有开口的封装体覆盖以暴露RC电路的端子焊盘。这些开口填充有焊料以在球栅阵列（BGA）中产生装置的各个终端。该设备通过消除多个分立元件，节省了大型电子设备制造中的成本和/或电路板空间。此外，由于器件与其所安装的电路板的紧密接近，实现了非常低的电感。

10. 发明授权

US06256189B1 Heat slug design which facilitates mounting of discrete components on a package without losing lands or pins in the package 失效
标题翻译：散热器设计，便于将分立元件安装在封装上，而不会损失封装中的焊盘或引脚
公开(公告)号：US06256189B1
公开(公告)日：2001-07-03
申请号：US08626174
申请日：1996-03-29
申请人： Robert J. Chroneos, Jr. , Koushik Banerjee
发明人： Robert J. Chroneos, Jr. , Koushik Banerjee
IPC分类号： H01G438
CPC分类号： H01L23/24 , H01L23/36 , H01L23/642 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic package which has a polygonal shaped heat slug. The heat slug extends from a top surface of a package which has a plurality of vias. The package also has a number of capacitors that are mounted to the top surface. Some of the capacitors are located between the heat slug and the vias. The polygonal shape of the heat slug provides additional space on the top surface so that capacitors can be added without eliminating vias from the package.
摘要翻译：具有多边形形状的热塞的电子封装。散热片从具有多个通孔的封装的顶表面延伸。该封装还具有安装到顶表面的多个电容器。一些电容器位于散热片和通孔之间。散热片的多边形形状在顶表面上提供了额外的空间，从而可以添加电容器而不消除封装中的通孔。

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