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1. 发明授权

US10431358B2 Resistor production method, resistor, and electronic device 有权
公开(公告)号：US10431358B2
公开(公告)日：2019-10-01
申请号：US15568540
申请日：2016-03-23
申请人： STANLEY ELECTRIC CO., LTD.
发明人： Akihiko Hanya
IPC分类号： H01P11/00 , C09D11/00 , C09D11/30 , H01B1/02 , H01C17/065 , H01C17/24 , H01B1/22 , H01C7/00 , H01C17/22 , H05K1/16 , H05K1/09 , H05K3/12
摘要： A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 μm and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

2. 发明申请

US20180090247A1 Chip Resistor 审中-公开
公开(公告)号：US20180090247A1
公开(公告)日：2018-03-29
申请号：US15562046
申请日：2016-03-08
申请人： KOA Corporation
发明人： Kentaro MATSUMOTO , Kotaro KASHIWAGI
IPC分类号： H01C1/148 , H01C1/012 , H01C7/00 , H01C17/22 , H01C17/28 , H01C17/00 , H01C17/065
CPC分类号： H01C1/148 , H01C1/012 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/22 , H01C17/281
摘要： In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1. The chip resistor is configured such that the front electrodes 2 sandwiched between the insulating substrate 1 and the protection layer 4 are exposed from widthwise end surfaces and the lengthwise end surfaces of the insulating substrate 1, and the terminal electrodes 5 wrap around the widthwise opposite end surfaces of the insulating substrate 1 to be thereby connected to the exposed portions of the front electrodes 2.

3. 发明申请

US20170301437A1 THERMISTOR ELEMENT AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：US20170301437A1
公开(公告)日：2017-10-19
申请号：US15485355
申请日：2017-04-12
申请人： NGK SPARK PLUG CO., LTD.
发明人： Tomoki YAMAGUCHI , Shinji BAN , Hiroshi WATANABE , Yasuyuki OKIMURA , Hiroaki NAKANISHI , Seiji OYA , Seiya MATSUDA
IPC分类号： H01C7/00 , H01C17/22 , H01C1/14
CPC分类号： H01C7/008 , G01K7/22 , H01C1/14 , H01C17/22 , H01C17/24
摘要： In a manufacturing method for a thermistor element (3) including: a thermistor portion (49) which is a sintered body formed from a thermistor material; and a pair of electrode wires (25) which are embedded in the thermistor portion (49) and at least one end portion of each of the electrode wires projects at an outer side of the thermistor portion (49), the resistance value of the thermistor element (3) is adjusted by performing a removal processing of removing a part of the thermistor portion (49).

4. 发明申请

US20160163433A1 Chip-Resistor Manufacturing Method 审中-公开
标题翻译：芯片电阻制造方法
公开(公告)号：US20160163433A1
公开(公告)日：2016-06-09
申请号：US14905459
申请日：2014-07-09
申请人： KOA CORPORATION
发明人： Yuya TAKEUE , Todaro UEGANE , Kentaro MATSUMOTO
IPC分类号： H01C17/28 , H01C17/22 , H01C17/06
CPC分类号： H01C17/28 , H01C17/006 , H01C17/06 , H01C17/22 , H01C17/242
摘要： The invention is to provide a chip-resistor manufacturing method in which chipping can be restrained from occurring in an intersection portion between each primary segmentation groove and each secondary segmentation groove. Primary segmentation grooves 21 each having an uneven depth are formed in one surface of a large substrate 20. Pairs of surface electrodes 3 extending across the primary segmentation grooves 21, resistive elements 5 each striding between the surface electrodes 3 paired with each other, etc. are formed in the one surface of the large substrate 20. Then, primary segmentation is performed on the large substrate 20 along the primary segmentation grooves 21 so as to open the surface side where the surface electrodes 3, the resistive elements 5, etc. are formed. Thus, a plurality of strip-like substrates 30 are obtained from the large substrate 20. During the primary segmentation, each primary segmentation groove 21 begins to break from electrode formation regions which are small in groove depth but strong, and then breaks in intersection portions which are large in groove depth but brittle. Accordingly, it is possible to perform primary segmentation on the primary segmentation groove 21 without applying a large load to the intersection portions which are low in strength. Thus, it is possible to prevent chipping from occurring in the intersection portions.
摘要翻译：本发明是提供一种芯片电阻器制造方法，其中可以抑制在每个主分割槽和每个二次分割槽之间的交叉部分发生碎裂。每个具有不均匀深度的主分割槽21形成在大基板20的一个表面中。一对表面电极3延伸穿过主分割凹槽21，电阻元件5各自跨越彼此配对的表面电极3等。形成在大基板20的一个表面上。然后，沿着主分割槽21对大基板20进行主分割，以便打开表面电极3，电阻元件5等的表面侧形成。因此，从大基板20获得多个条状基板30.在主分割期间，每个主分割凹槽21开始从凹槽深度小但较强的电极形成区域断裂，然后在交叉部分中断其深度大，但脆。因此，可以对主分割槽21进行主分割，而不对强度低的交点进行大的负载。因此，可以防止在交叉部分发生切屑。

5. 发明授权

US08847117B2 Method of stabilizing thermal resistors 有权
标题翻译：稳定热敏电阻的方法
公开(公告)号：US08847117B2
公开(公告)日：2014-09-30
申请号：US12920801
申请日：2009-03-16
申请人： Oleg Grudin , Yougui Liao , Leslie M. Landsberger , Gennadiy Frolov , Lyudmila Grudina , Gerald Arzoumanian , Saed Salman , Tommy Tsang , Bowei Zhang
发明人： Oleg Grudin , Yougui Liao , Leslie M. Landsberger , Gennadiy Frolov , Lyudmila Grudina , Gerald Arzoumanian , Saed Salman , Tommy Tsang , Bowei Zhang
IPC分类号： F23Q7/00 , B23H5/00 , B23K15/02 , H05B1/02 , H05B3/02 , H01C10/00 , H01C17/00 , H05B3/00 , H01C7/04 , B60L1/02 , A22C7/00 , A47J39/00 , H01L49/02 , H01C17/22 , H01C17/26
CPC分类号： H01L28/20 , H01C17/22 , H01C17/265 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085
摘要： There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component.
摘要翻译：描述了一种用于稳定由热可变材料制成的热隔离电气部件的后修整电阻的方法，所述方法包括：产生至少一个加热脉冲，所述至少一个加热脉冲具有对应于修整的初始幅度温度，对应于给定冷却速率的斜率和对应于给定冷却时间的持续时间; 以及在修整过程之后，将所述至少一个加热脉冲施加到所述热隔离电气部件中的一个和与所述热隔离电气部件传热通信的加热装置，以便使所述电气部件根据给定冷却速率，给定的冷却速率比通过电气部件的热隔离确定的被动冷却速度慢。

6. 发明申请

US20070261232A1 Method for trimming resistors 审中-公开
公开(公告)号：US20070261232A1
公开(公告)日：2007-11-15
申请号：US11812842
申请日：2007-06-22
申请人： Leslie Landsberger , Oleg Grudin , Gennadiy Frolov
发明人： Leslie Landsberger , Oleg Grudin , Gennadiy Frolov
IPC分类号： H01C17/22 , H05K3/30 , G01R31/28
CPC分类号： H01L27/0802 , H01C13/02 , H01C17/232 , H01C17/267 , H01L28/20 , Y10T29/49002 , Y10T29/49004 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/4913
摘要： There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

7. 发明授权

US6023091A Semiconductor heater and method for making 失效
标题翻译：半导体加热器及其制造方法
公开(公告)号：US6023091A
公开(公告)日：2000-02-08
申请号：US565735
申请日：1995-11-30
申请人： Daniel J. Koch , Kenneth G. Goldman , Keith G. Kamekona , Mark D. Summers
发明人： Daniel J. Koch , Kenneth G. Goldman , Keith G. Kamekona , Mark D. Summers
IPC分类号： H01C17/22 , B41J2/335 , H01L21/822 , H01L27/04 , H01L29/00
CPC分类号： B41J2/3357 , B41J2/33585
摘要： A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.
摘要翻译：在加热元件（16）和基座（11）之间形成可密封气隙（14），以改善半导体加热器（10）的热隔离。在加热元件（16）上形成顶层（17），其密封气隙（14），使得可密封气隙（14）可以处于大气压力或真空下。半导体加热器（10）可以用于各种应用，包括作为热源来调节上覆电阻层（18）的电阻率。半导体加热器（10）的实施例还包括化学传感器（20）。使用来自加热元件（26）的热量将化学感测材料（28）的上层保持在最佳温度。本发明的实施例还包括用于加热诸如喷墨应用中的井（55）中的流体（52）的换能器（40）。

8. 发明授权

US4758815A Tap element and methods, for heating, pressure measurement and circuit fabrication 失效
标题翻译：抽头元件和方法，用于加热，压力测量和电路制造
公开(公告)号：US4758815A
公开(公告)日：1988-07-19
申请号：US884220
申请日：1986-07-10
申请人： Walter C. Lovell
发明人： Walter C. Lovell
IPC分类号： G01L1/18 , G01L1/20 , H01C3/00 , H01C7/00 , H01C10/10 , H01C17/02 , H01C17/07 , H01C17/22 , H01C17/24 , H01H3/14 , H01H35/26 , H05B3/20 , H01L3/06
CPC分类号： H01C7/00 , H01C10/106 , H01C17/02 , H01C17/07 , H01C17/22 , H01C17/24 , H01H3/142
摘要： Ordinary inexpensive magnetic recording tape is used to create a novel resistance element which may be made pressure sensitive to perform a number of tasks involving robot finger control intrusion alarm systems, and portable weighing scales. A pressure insensitive resistance element is also used as an efficient, inexpensive heating tape element, or to make precision resistors having little bulk, and resistive networks which may be customized by a user.
摘要翻译：普通便宜的磁记录带用于创建一种新颖的电阻元件，可以对压力敏感以执行涉及机器人手指控制入侵报警系统和便携式称重秤的许多任务。不耐压电阻元件也被用作高效，便宜的加热带元件，或者制造具有很小体积的精密电阻器，以及可由用户定制的电阻网络。

9. 发明授权

US4592921A Method for monitoring and regulating the composition and the layer thickness of metallically conductive alloy layers during their manufacture 失效
标题翻译：在制造期间监测和调节金属导电合金层的组成和层厚度的方法
公开(公告)号：US4592921A
公开(公告)日：1986-06-03
申请号：US688364
申请日：1985-01-02
申请人： Konrad Hieber , Norbert Mayer
发明人： Konrad Hieber , Norbert Mayer
IPC分类号： C23C14/14 , C23C14/22 , C23C14/54 , H01C17/22 , H01L21/66 , B05D3/12
CPC分类号： C23C14/545 , C23C14/548 , H01C17/22
摘要： A method for monitoring and regulating composition and layer thickness of metallically conductive alloy layers during their manufacture by means of electrical resistance measurement. Individual alloy components are cyclically applied in coats in chronological succession. By comparison of measured actual values of the layer resistance R.sub.G after the application of each and every individual coating to rated values determined before the layer manufacture, the coating rates of the corresponding alloy component sources are controlled. The method serves for the reproducible manufacture of thin metal layers in semiconductor technology and allows the control of composition and layer thickness even during manufacture of said layers.
摘要翻译：一种用于通过电阻测量在其制造期间监测和调节金属导电合金层的组成和层厚度的方法。单个合金组分按时间顺序循环地应用于外套。通过比较在将各涂层涂布后的层电阻RG的实测值与层制造前测定的额定值进行比较，可以控制相应合金成分源的涂布速度。该方法用于在半导体技术中可重复地制造薄金属层，并且即使在所述层的制造期间也允许控制组成和层厚度。

10. 发明授权

US4372497A Method of manufacturing wound items from coaxial microwire and device therefor 失效
标题翻译：从同轴微线制造伤口物品的方法及其装置
公开(公告)号：US4372497A
公开(公告)日：1983-02-08
申请号：US205445
申请日：1980-09-08
申请人： Sergei N. Dimitraki , Lolita S. Dimitraki
发明人： Sergei N. Dimitraki , Lolita S. Dimitraki
IPC分类号： H01F41/06 , H01C17/04 , H01C17/22 , H01C17/24 , H01F41/04
CPC分类号： H01C17/04 , H01C17/24 , H01F41/04 , Y10T29/49004 , Y10T29/49071 , Y10T29/49096
摘要： A method of manufacturing wound items from coaxial microwire by the use of a device executing said method, which essentially consists in determining frequency f.sub.1 of a generator at which a phase shift between current vector in a sheath and voltage vector between the sheath and conductor of a microwire of the item being manufactured equals 180.degree. when the item being manufactured has a parameter exceeding a corresponding rating. When the parameter of the item fully complies with the corresponding rating, frequency f.sub.2 of a second generator is set so that a phase shift between the current vector in the sheath and the voltage vector between the sheath and the conductor of the microwire is 180.degree.. A frequency changer is then used to convert voltages at f.sub.1 and f.sub.2 into a voltage at f.sub.X which is fed to the sheath of the item. A drive is utilized to unwind the microwire, while an amplifier and converter unit continuously compares a current vector phase in the sheath of the unwound microwire with a voltage vector phase between the conductor and the sheath of said microwire. The unwinding of the microwire is stopped after said phase difference reaches 180.degree..
摘要翻译： PCT No.PCT / SU80 / 00001 Sec。 371日期1980年9月8日第 102（e）1980年9月3日PCT PCT 1980年1月8日PCT公布。出版物WO80 / 01431 日本1980年7月10日。一种通过使用执行所述方法的装置从同轴微线制造伤口物品的方法，其基本上在于确定发生器的频率f1，其中护套中的电流矢量与电压矢量当制造的物品的参数超过相应的等级时，所制造的物品的微线的护套和导体之间的距离等于180°。当该项目的参数完全符合相应的等级时，第二发电机的频率f2被设定为使得护套中的电流矢量与护套与微线的导体之间的电压矢量之间的相移为180度。然后使用变频器将f1和f2处的电压转换成fX的电压，该电压被馈送到物品的护套。驱动器用于展开微线，而放大器和转换器单元将展开的微线的护套中的电流矢量相位与导线与所述微线的护套之间的电压矢量相位连续地进行比较。在所述相位差达到180度后，停止微丝的退绕。

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