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    • 1. 发明授权
    • System for aligning rectangular wafers
    • 矩形晶圆对齐系统
    • US06195619B1
    • 2001-02-27
    • US09363159
    • 1999-07-28
    • Jie Ren
    • Jie Ren
    • G01R31265
    • G03F9/7011G01R31/01G03F7/7075G03F7/70791H01L21/681Y10S414/136
    • A system is provided for determining an eccentricity vector &egr; which defines the magnitude and direction of an initial placement displaced from a desired location of a centroid O of a right quadrilateral semiconductor wafer which may be clear or opaque. With an initial point of reference desirably established on its peripheral edge for detection by an edge sensor, the wafer is rotated about a point P and a curve defining the profile of the peripheral edge is obtained. The eccentricity vector is computed from the sensed positions of the corners of the wafer and has a magnitude representative of the spatial dislocation of the centroid O relative to the point P and having an orientation &phgr; representative of the angle subtended by a first line connecting the point P and the centroid O relative to a second line connecting opposite corners of the wafer. As processing proceeds, the wafer is inserted into an aligner station, then repositioned from an initial position to a desired position, then advanced seriatim into a plurality of processing stations while maintaining the desired position previously attained. The aligner and the processing stations may be evacuated. The wafer may be post positioned to a new desired position by rotating the wafer until a side thereof is generally parallel to an internal wall of the aligner station, enabling an end effector of a robot arm to readily lift the wafer from its support and advance it into the processing stations while maintaining the desired position previously attained.
    • 提供了一种用于确定偏心矢量epsi的系统,该偏心矢量定义从可能是透明或不透明的右四边形半导体晶片的质心O的期望位置偏移的初始位置的大小和方向。 为了最初的参考点在其外围边缘上建立用于由边缘传感器检测的边缘,晶片绕点P旋转,并且获得限定外围边缘轮廓的曲线。 从感测到的晶片角部位置计算出偏心矢量,并且具有表示质心O相对于点P的空间位错的大小,并且具有代表由连接点 P和质心O相对于连接晶片的相对角的第二线。 随着处理的进行,将晶片插入到对准台中,然后从初始位置重新定位到期望的位置,然后在保持先前达到的期望位置的同时将其前进到多个处理站。 对准器和加工站可以被排空。 晶片可以通过旋转晶片而被定位到新的期望位置,直到其一侧大致平行于对准器台的内壁,使得机器人手臂的末端执行器能够容易地将晶片从其支撑件提升并推进 同时保持先前达到的期望位置。
    • 2. 发明授权
    • Method and apparatus for imaging semiconductor devices
    • 用于半导体器件成像的方法和装置
    • US06316950B1
    • 2001-11-13
    • US08856561
    • 1997-05-15
    • Winfried DenkChunhui Xu
    • Winfried DenkChunhui Xu
    • G01R31265
    • H01L22/12G01R31/311
    • Semiconductor devices are imaged using two-photon absorption. The method is similar to conventional optical beam induced imaging except that the light beams used have frequencies (photon energies) insufficient to excite electrons across the semiconductor bandgap. Rather the instantaneous intensity of the lower frequency light is increased, as by using a pulsed laser source, so that electron transitions occur by two-photon absorption predominately in the localized region where the beam is focused. The result is minimal absorption during passage through the substrate and maximal absorption in the component-rich active layer where the beam is focused. This enhances imaging of fine-detail semiconductor devices. Specifically, the quadratic dependence of free carrier generation on the excitation intensity both enhances the resolution and provides a three-dimensional sectioning capability.
    • 使用双光子吸收成像半导体器件。 该方法类似于常规光束诱导成像,除了所使用的光束具有不足以激发跨越半导体带隙的电子的频率(光子能量)。 相反地​​,通过使用脉冲激光源,较低频率光的瞬时强度增加,使得电子跃迁主要通过聚焦光束的局部区域中的双光子吸收发生。 其结果是在通过衬底的过程中的最小吸收和在聚焦光束的组分丰富的有源层中的最大吸收。 这增强了精细细节半导体器件的成像。 具体地说,自由载流子产生对激发强度的二次依赖性增强了分辨率并提供了三维切片能力。
    • 3. 发明授权
    • Differential pulsed laser beam probing of integrated circuits
    • 差分脉冲激光束探测集成电路
    • US06252222B1
    • 2001-06-26
    • US09483463
    • 2000-01-13
    • Steven A. KasapiChun-Cheng TsaoSeema Somani
    • Steven A. KasapiChun-Cheng TsaoSeema Somani
    • G01R31265
    • G01R31/308
    • A laser beam is used to probe an integrated circuit device under test. A single laser provides a single laser pulse which is divided into two pulses, both of which are incident upon the device under test. After the two pulses interact with the device under test, the two pulses are separated and detected by two photo detectors. The electrical signals output by the photo detectors are then subtracted, which cancels out any common mode noise induced on both pulses including noise due to mechanical vibration of the device under test and also any noise from the laser. The difference signal can be used to reproduce a time varying signal in the device under test.
    • 激光束用于探测被测集成电路器件。 单个激光器提供单个激光脉冲,其被分成两个脉冲,两个脉冲都入射在被测器件上。 在两个脉冲与被测器件相互作用之后,两个脉冲被两个光电检测器分离并检测。 然后减去由光电检测器输出的电信号,这消除了由于被测器件的机械振动引起的包括噪声在内的两种脉冲引起的任何共模噪声,以及来自激光器的任何噪声。 差分信号可用于在被测器件中再现时变信号。