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    • 5. 发明公开
    • DEVICE FOR ACOUSTIC TEMPERATURE MEASUREMENT
    • US20230358619A1
    • 2023-11-09
    • US17786029
    • 2020-12-11
    • KIMA PROCESS CONTROL GMBH
    • Peter KALKERT
    • G01K11/24G01K13/024G01N29/024G01N29/22G01N29/24G01N29/32G01N29/44G01N29/34
    • G01K11/24G01K13/024G01N29/024G01N29/221G01N29/2437G01N29/326G01N29/223G01N29/4436G01N29/343G01N2291/02881G01N2291/011
    • The invention relates to a device (1) at least for an acoustic temperature measurement in a gaseous medium (M) passing a medium channel (110) by means of runtime measurement of an acoustic pulse (AP) running through the gaseous medium (M) from at least a first transmitter arrangement (TA1) to at least a first receiver arrangement (RA1), the first transmitter arrangement (TA1) comprising a sound pulse generator (2) for the generating the acoustic pulse (AP), which is connected by a first acoustic channel (3) to a transmitter (4) which transmits the acoustic pulse (AP) into the medium (M), the first acoustic channel (3) being of acoustically dispersive design, and, the first receiver arrangement (RA1) comprising a receiver (5) for receiving the acoustic pulse (AP) after it has passed through the medium (M) and for transmitting it via a second acoustic channel (6) to a first microphone (7), preferably a piezoelectric microphone (7), for detecting the acoustic pulse (AP), the first acoustic channel (3) being curved towards the sound pulse generator (2) in such a way that the radiant heat of the medium (M) on the sound pulse generator (2) is at least greatly reduced, wherein at least the transmitter (4) comprises in the first acoustic channel (3) on its side (41) facing the medium (M) to be measured interfering element (42) which reflects a part (RI) of the acoustic pulse (AP) back into the first acoustic channel (3) of the first transmitter arrangement (TA1), in which a second microphone (8), preferably arranged on the side (43) of the transmitter (4) feeing the sound pulse generator (2), is arranged for detecting the back-reflected part (RI) of the acoustic pulse (AP), the device (1) further comprising a pulse discriminator (9) designed to determine the arrival times (AT) of the recorded acoustic pulses (AP) in a suitable way and to transmit them to an evaluation unit (10) designed to determine the temperature of the medium (M) from the runtime of the acoustic pulse (AP) from the transmitter (4) to the receiver (5), taking into account the arrival times (AT) determined by the pulse discriminator and the acoustic pulses (RI, AI) detected by first and second microphones (7,8).
    • 8. 发明申请
    • HIGH-TEMPERATURE ULTRASONIC SENSOR
    • US20220365035A1
    • 2022-11-17
    • US17688436
    • 2022-03-07
    • SENSOR NETWORKS, INC.
    • James BARSHINGERMark FEYDOJeffrey ANDERSON
    • G01N29/22G01K13/00G01N29/07G01N29/24G01N29/32
    • A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-temperature portion such that the low-temperature portion is subjected to significantly less heat from the structure compared to the high-temperature portion.