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1. 发明申请

US20040262163A1 Molten salt bath for electroforming and method of manufacturing metal product using the same 审中-公开
标题翻译：用于电铸的熔融盐浴及使用其制造金属制品的方法
公开(公告)号：US20040262163A1
公开(公告)日：2004-12-30
申请号：US10776264
申请日：2004-02-12
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Koji Nitta , Shinji Inazawa , Tsuyoshi Haga , Yasuhiko Ito , Toshiyuki Nohira , Tokujiro Nishikiori
IPC分类号： C25D001/00
CPC分类号： C25D3/66
摘要： A molten salt bath for electroforming containing lithium bromide, cesium bromide and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided. In addition, a method of manufacturing a metal product including the steps of: forming a resist pattern on a conductive substrate and exposing a portion of the conductive substrate; immersing the conductive substrate having the resist pattern formed into the molten salt bath for electroforming, the molten salt bath for electroforming containing a metal to be precipitated and/or a compound of a metal to be precipitated; and precipitating the metal at a portion where the conductive substrate is exposed, is provided. Further, a molten salt bath for electroforming obtained by mixing lithium bromide, cesium bromide, and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided.

2. 发明申请

US20040229076A1 Corrosion-resistant structure incorporating zinc or zinc-alloy plated lead or lead-alloy wires and method of making same 失效
标题翻译：含锌或锌合金电镀铅或铅合金电线的耐腐蚀结构及其制造方法
公开(公告)号：US20040229076A1
公开(公告)日：2004-11-18
申请号：US10462707
申请日：2003-06-17
发明人： Joe G. Tom , Philip G. Malone , Charles A. Weiss JR. , Steven L. Larson
IPC分类号： B32B015/00 , B32B009/04 , C25D001/00
CPC分类号： C25D7/0607 , F42B12/74 , Y10S428/935 , Y10T428/12438 , Y10T428/12701 , Y10T428/12792
摘要： Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bullet core is swaged from a number of bunched electroplated fine lead or lead-alloy wires placed in a die. The lead or lead-alloy wires may be fabricated from lead or lead-alloy wool. The lead alloy may comprise zinc and antimony. The electroplating process plates zinc on the fine wires and may plate a zinc alloy such as zinc-aluminum. The plated surface may be coated with a corrosion resistant coating such as molybdenum phosphate. In addition to bullets and bullet cores, fishing weights, lead shielding, counterweights, ballast, and other lead containing structure may be fabricated or treated using methods and materials of the present invention.
摘要翻译：结合铅的结构由特殊制备的组件制成，使得当结构暴露于未受保护的环境（例如耐候户外或咸水）时，引线的移动性受到阻碍。在优选实施例中，从放置在模具中的多个成束的电镀的细铅或铅合金丝来模锻子弹或子弹芯。铅或铅合金线可以由铅或铅合金羊毛制成。铅合金可以包括锌和锑。电镀工艺在细线上镀锌，并可镀锌合金如锌 - 铝。电镀表面可以涂覆有耐腐蚀涂层，例如磷酸钼。除了子弹和子弹芯之外，可以使用本发明的方法和材料来制造或处理钓鱼重量，铅屏蔽，配重，镇流器和其它含铅结构。

3. 发明申请

US20040069641A1 Non-cyanogen type electrolytic solution for plating gold 失效
标题翻译：用于镀金的非氰型电解液
公开(公告)号：US20040069641A1
公开(公告)日：2004-04-15
申请号：US10661533
申请日：2003-09-15
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Miwa Abe , Kei Imafuji
IPC分类号： C25D005/00 , C25D001/00
CPC分类号： C25D3/48
摘要： A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.
摘要翻译：用于镀金的非氰型电解液含有金盐作为金的供应源，并加入非氰化合物类型的化合物，其中电解电镀溶液中加入一种选自一组硫尿嘧啶; 2-氨基乙硫醇; N-甲基硫脲，3-氨基-5-巯基-1,2,4-三唑; 4,6-二羟基-2-巯基嘧啶; 和巯基烟酸酯; 作为与金形成络合化合物的化合物。优选使用氯代牛磺酸盐或金亚硫酸盐作为金盐。

4. 发明申请

US20030186074A1 Metal electrode using molybdenum-tungsten alloy as barrier layers and the fabrication method of the same 审中-公开
标题翻译：使用钼钨合金作为阻挡层的金属电极及其制造方法
公开(公告)号：US20030186074A1
公开(公告)日：2003-10-02
申请号：US10112708
申请日：2002-04-02
发明人： Chi-Lin Chen , Chich-Shang Chang
IPC分类号： B32B015/00 , C25D001/00 , B32B015/10 , H01L021/44
CPC分类号： H01L29/4908 , B32B15/017 , H01L29/66757 , H01L29/66765 , Y10T428/12743 , Y10T428/12826 , Y10T428/1284
摘要： This specification discloses a metal electrode that uses MoW (molybdenum-tungsten) alloy as its barrier layers and the method for making the same. Using MoW alloy as the barrier layer of a metal electrode can effectively solve the spiking and hillock problems occurred in aluminum electrodes. The MoW alloy barrier layer is thermally stable, preventing the resistance from rising due to the high-temperature manufacturing process. The metal electrode using the MoW alloy as the barrier layer can be prepared using the dry etching process. The resulting resistance is lower than other kinds of barrier layers. The MoW alloy barrier layer can be used in TFT metal electrodes for high-resolution and large-area displays.
摘要翻译：本说明书公开了使用MoW（钼 - 钨）合金作为其阻挡层的金属电极及其制造方法。使用MoW合金作为金属电极的阻挡层可以有效地解决铝电极发生的尖峰和小丘问题。 MoW合金阻挡层是热稳定的，防止由于高温制造工艺而导致的电阻上升。使用MoW合金作为阻挡层的金属电极可以使用干法蚀刻工艺来制备。所得到的电阻低于其它种类的阻挡层。 MoW合金阻挡层可用于高分辨率和大面积显示器的TFT金属电极。

5. 发明申请

US20030111349A1 Electrolytic processes with reduced cell voltage and gas formation 失效
标题翻译：电解过程具有降低的电池电压和气体形成
公开(公告)号：US20030111349A1
公开(公告)日：2003-06-19
申请号：US10192335
申请日：2002-07-10
申请人： 3M Innovative Properties Company
发明人： Michael J. Sierakowski , L. Charles Hardy , Michael S. Terrazas , Jennifer E. Waddell , Bryan J. Johnson
IPC分类号： C25D001/00 , C25D003/38 , C25C001/12
CPC分类号： C25C1/00 , C25C1/12 , C25D3/38
摘要： Electrolytic solutions containing organic additive(s) selected from a described class of additives (e.g., 4,6-dihydroxypyrimidine) reduce overall applied electrical potential of electrolytic cells and/or reduce gas formation at the anode(s) or increase copper production rate. Benefits include reducing overall power consumption and reducing acid mist during electrolytic processes.
摘要翻译：含有选自上述添加剂（例如4,6-二羟基嘧啶）的有机添加剂的电解溶液降低了电解槽的总施加电位和/或减少了阳极处的气体形成或提高了铜的生产率。优点包括在电解过程中降低总体功耗并减少酸雾。

6. 发明申请

US20030064586A1 METHOD AND APPARATUS FOR CONTROLLING CONTAMINATION DURING THE ELECTROPLATING DEPOSITION OF METALS ONTO A SEMICONDUCTOR WAFER SURFACE 有权
标题翻译：用于控制金属电镀沉积在半导体波长表面上的污染的方法和装置
公开(公告)号：US20030064586A1
公开(公告)日：2003-04-03
申请号：US09965739
申请日：2001-09-28
发明人： Sailesh Mansinh Merchant , Minseok Oh , Deepak A. Ramappa
IPC分类号： C25D001/00 , H01L021/76
CPC分类号： C25D17/001 , C25D5/20 , H01L21/2885 , Y10S438/913
摘要： A method and apparatus for the electroplating deposition of a metal onto a semiconductor wafer surface (29), including vibrationally scrubbing the wafer surface (29) during an electroplating process. At least one transducer (32) is mounted to a wall (33) of an electroplating tool chamber (22). The transducer (32) intermittently delivers sonic energy pulses lasting for one to two seconds to the electroplating solution during the electroplating process.
摘要翻译：一种用于将金属电镀沉积到半导体晶片表面（29）上的方法和装置，包括在电镀过程中振动洗涤晶片表面（29）。至少一个换能器（32）安装到电镀工具室（22）的壁（33）上。在电镀过程中，换能器（32）间歇地传送持续1至2秒的电能脉冲到电镀溶液。

7. 发明申请

US20030010630A1 Method for manufacturing an electrode and an electrode 审中-公开
标题翻译：电极和电极的制造方法
公开(公告)号：US20030010630A1
公开(公告)日：2003-01-16
申请号：US10203845
申请日：2002-08-14
发明人： Veikko Polvi , Pekka Taskinen , Tuija Suortti
IPC分类号： C25B011/00 , C25C007/02 , C25D017/10 , C25D001/00 , B23H003/04
CPC分类号： C25C7/02
摘要： A method for manufacturing an electrode used in the electrolysis of metals, in which method and electrode plate element (2) is attached to a suspension bar (1), which also serves as a power conductor. The plate element (2) is attached to the suspension bar (1) by means of a diffusion joint. The invention also relates to an electrode.
摘要翻译：一种制造用于电解金属的电极的方法，其中方法和电极板元件（2）附接到也用作电力导体的悬架杆（1）上。板元件（2）通过扩散接头附接到悬挂杆（1）。本发明还涉及电极。

8. 发明申请

US20020064676A1 Tin whisker-free printed circuit board 失效
标题翻译：锡须无印刷电路板
公开(公告)号：US20020064676A1
公开(公告)日：2002-05-30
申请号：US10002714
申请日：2001-11-01
发明人： George S. Bokisa , Craig V. Bishop , John R. Kochilla
IPC分类号： B32B015/00 , B32B015/01 , C25D001/00
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/1666 , C23C18/1669 , C23C18/31 , C23C18/48 , C23C18/54 , Y10T428/12701 , Y10T428/12708 , Y10T428/12722
摘要： A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.
摘要翻译：一种印刷电路板，包括形成在印刷电路板的外表面上的电路，该电路包括铜或铜合金; 在电路上进行了最后的完成，最后完成包括在铜或铜合金电路上镀锡; 以及在锡涂层上的合金盖层，所述合金盖层包括至少两个可浸镀金属。合金盖层中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。该电路保持无须且可焊接。

9. 发明申请

US20020023843A1 Method and device for the manufacture of the medical expanding stents 失效
标题翻译：用于制造医疗扩张支架的方法和装置
公开(公告)号：US20020023843A1
公开(公告)日：2002-02-28
申请号：US09950659
申请日：2001-09-13
发明人： David Cherkes
IPC分类号： C25D001/08 , C25D001/00 , C25D017/00 , C25C007/00
CPC分类号： B23H3/00 , A61F2/91 , A61F2/915 , A61F2002/91533 , A61F2002/91575 , A61F2230/0013 , B23H3/06 , B23H9/00 , Y10S623/901 , Y10S623/902 , Y10S623/903 , Y10S623/909
摘要： Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.
摘要翻译：用于可扩展支架的可扩展圆柱形金属网格的制造方法和装置，特别是用于定制制造。该方法包括确定要植入的支架的类型和尺寸，以期望的网格图案电化学形成支架并将支架植入患者体内。该方法包括使用具有期望的网状图案的阴极和管状坯料，形成支架。在阴极和空白之间输送电解质，并且在电化学形成过程中阴极和坯料同时旋转。

10. 发明申请

US20040168923A1 Device for producing negatively charged nanoparticles and a method for the same 失效
标题翻译：负极纳米粒子的制造装置及其制造方法
公开(公告)号：US20040168923A1
公开(公告)日：2004-09-02
申请号：US10483843
申请日：2004-01-12
发明人： Moxi Fang , Yue Sun
IPC分类号： C25D001/00
CPC分类号： B82Y30/00 , A61N1/44 , B01J19/085 , B03C3/38 , B82Y15/00 , H01T23/00
摘要： A device and method are provided for producing negatively charged nanoparticles. The device comprises a power supply, an electron supermicroemitter and a controller, the power supply connects with the electron supermicroemitter and the controller respectively. The potential of the electron supermicroemitter to the ground is controlled in the range of null2 kV to null29 kV by the power supply and the controller in accordance with the shape, size and different application of the materials of the emitter, so as to form field electron emitting of tunneling effect. The energy of electrons with high current density produced by the emitter can be adjusted during the electrons' colliding with particles in aerosol such that the electrons are attached to the nanoparticles of different size with wider energy band to form negatively charged nanoparticles.
摘要翻译：提供了用于产生带负电荷的纳米粒子的装置和方法。该装置包括电源，电子超微发生器和控制器，电源分别与电子超微型计算机和控制器连接。根据发射器材料的形状，尺寸和不同应用，电源和控制器将电子超微电极的电位控制在-2 kV至-29 kV的范围内，以形成场电子发射隧道效应。在电子与气溶胶中的颗粒碰撞期间，可以调节由发射极产生的具有高电流密度的电子的能量，使得电子以更宽的能带连接到具有不同大小的纳米颗粒以形成带负电荷的纳米颗粒。

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