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1. 发明申请

US20040258948A1 Solder coated lid 有权
标题翻译：焊锡盖
公开(公告)号：US20040258948A1
公开(公告)日：2004-12-23
申请号：US10861371
申请日：2004-06-07
申请人： Senju Metal Industry Co., Ltd. , Sumitomo Metal (SMI) Electronics Devices Inc.
发明人： Hideyuki Yoshino , Sanae Taniguchi , Mitsuo Zen , Takenori Azuma
IPC分类号： B32B015/00 , C25D005/10 , B32B009/04
CPC分类号： H01L21/50 , H01L2224/48091 , H01L2924/16195 , Y10T428/12597 , Y10T428/12708 , Y10T428/12944 , Y10T428/12951 , H01L2924/00014
摘要： A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a SnnullSb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.
摘要翻译：用于电子器件的封装的焊接涂层盖具有无铅焊料层，其包含液态温度为至少220摄氏度的Sn-Sb基焊料，其至少提供在盖子的盖子的至少一个区域加入到一个包的基地。盖可以在低温下连接到包装的底部，从而减少焊料组分的蒸发和粘附到包装内的电子装置。

2. 发明申请

US20040258944A1 Uncoated cutting tool using brazed-in superhard blank 有权
标题翻译：无涂层切割工具采用钎焊超硬材料
公开(公告)号：US20040258944A1
公开(公告)日：2004-12-23
申请号：US10463467
申请日：2003-06-17
申请人： Kennametal Inc.
发明人： Edward J. Oles , Alfred S. Gates JR. , Kent L. Reiner , William M. Alexander IV , Jean-Pierre Genain
IPC分类号： B32B015/00
CPC分类号： B23B27/065 , B23B27/148 , B23B2222/28 , B23B2226/125 , B23B2240/08 , B23K1/0008 , B23K31/025 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2101/20 , B23P5/00 , B23P15/28 , C23C26/02 , C23C30/005 , Y10T82/10 , Y10T407/1904 , Y10T407/24 , Y10T407/25 , Y10T407/26 , Y10T407/27 , Y10T408/81 , Y10T428/12493 , Y10T428/12507 , Y10T428/12576
摘要： An uncoated cutting tool that comprises a body containing a pocket. A polycrystalline cubic boron nitride blank has a cutting tip. The blank is brazed into the pocket using a braze alloy whereby there is a braze joint between the body and the polycrystalline cubic boron nitride blank. The braze alloy has a liquidus temperature of at least about 900 degrees Centigrade wherein the braze alloy is selected from the group comprising a nickel-gold braze alloy containing nickel and gold, a copper-gold braze alloy containing copper and gold, a silver-titanium braze alloy containing silver and titanium, and a silver-palladium braze alloy containing silver and palladium.
摘要翻译：一种未涂覆的切削工具，其包括包含口袋的主体。多晶立方氮化硼坯料具有切割尖端。使用钎焊合金将坯料钎焊到口袋中，其中在主体和多晶立方氮化硼坯料之间存在钎焊接头。钎焊合金的液相线温度为至少约900摄氏度，其中钎焊合金选自包含镍和金的镍 - 金钎焊合金，含铜和金的铜 - 金钎焊合金，银 - 钛含有银和钛的钎焊合金以及含有银和钯的银 - 钯钎焊合金。

3. 发明申请

US20040253476A1 Multilayer getter structures and methods for making same 有权
标题翻译：多层吸气剂结构及其制作方法
公开(公告)号：US20040253476A1
公开(公告)日：2004-12-16
申请号：US10866345
申请日：2004-06-10
发明人： Andrea Conte , Marco Moraja
IPC分类号： B32B015/00
CPC分类号： B32B15/01 , H01J7/183 , Y10T428/12479 , Y10T428/12493 , Y10T428/12611 , Y10T428/12806 , Y10T428/12812 , Y10T428/12819 , Y10T428/12875 , Y10T428/12986 , Y10T428/12993
摘要： Getter multilayer structures are disclosed, embodiments of which include at least a layer of a non-evaporable getter alloy having a low activation temperature over a layer of a different non-evaporable getter material having high specific surface area, both preferably obtained by cathodic deposition. The multilayer NEG structures exhibit better gas sorbing characteristics and lower activation temperature lower than those of deposits made up of a single material. A process for manufacturing such structures includes depositing a first, high surface area NEG film on a support, and then depositing a thin over layer of low activation NEG film.
摘要翻译：吸收剂多层结构被公开，其实施方案包括至少一层不可蒸发的吸气剂合金，其具有比具有高比表面积的不同不可蒸发的吸气剂材料的层的低活化温度，两者优选通过阴极沉积获得。多层NEG结构表现出比单一材料构成的沉积物更好的气体吸附特性和较低的活化温度。制造这种结构的方法包括在载体上沉积第一高表面积NEG膜，然后沉积薄的低活化NEG膜的上层。

4. 发明申请

US20040241401A1 Capacitor having improved electrodes 有权
标题翻译：电容器具有改进的电极
公开(公告)号：US20040241401A1
公开(公告)日：2004-12-02
申请号：US10476867
申请日：2003-11-05
发明人： Andrew T Hunt , Mark G Allen , David Kiesling
IPC分类号： B32B015/00 , B32B009/00
CPC分类号： H01G4/012 , H01G4/255 , H01G7/06 , H01L23/5223 , H01L27/0805 , H01L28/55 , H01L28/82 , H01L28/86 , H01L2924/0002 , Y10T428/24917 , Y10T428/265 , Y10T428/31678 , H01L2924/00
摘要： Capacitor material for use in forming capacitors, is disclosed. More specifically, the invention is directed to capacitors formed from this material that have one or more discrete electrodes (314), each electrode (314) being exposed to at least two thicknesses of dielectric material (300). These electrodes (314) are surrounded by wider insulative material (312) such that the material can be cut, or patterned into capacitors having specific values. A single electrode can form a small value capacitor while still providing a larger conductive area for attaching the capacitor to associated circuitry. The thin dielectric (310) can be a tunable material so that the capacitance can be varied with voltage. The tunability can be increased by adding thin electrodes that interact with direct current.
摘要翻译：公开了用于形成电容器的电容器材料。更具体地，本发明涉及由具有一个或多个离散电极（314）的该材料形成的电容器，每个电极（314）暴露于至少两个电介质材料（300）的厚度。这些电极（314）被较宽的绝缘材料（312）包围，使得该材料可被切割或图案化成具有特定值的电容器。单个电极可以形成小值电容器，同时仍然提供用于将电容器附接到相关电路的较大导电区域。薄电介质（310）可以是可调谐材料，使得电容可以随电压而变化。通过添加与直流电相互作用的薄电极可以提高可调性。

5. 发明申请

US20040214016A1 Conductive paste and glass circuit structure 有权
标题翻译：导电胶和玻璃电路结构
公开(公告)号：US20040214016A1
公开(公告)日：2004-10-28
申请号：US10802922
申请日：2004-03-18
发明人： Fumiya Adachi
IPC分类号： B32B015/00 , B32B017/06 , B32B017/00
CPC分类号： H01B1/22 , C03C8/04 , C03C8/18 , C03C17/06 , H05K1/092 , Y10T428/24917
摘要： Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit having a composition containing a Bi2O3nullB2O3nullSiO2nullAl2O3 or Bi2O3nullB2O3nullSiO2nullAl2P3nullZnO primary component and about 0.5 to 5% by weight of NiO as a secondary component, and an organic vehicle. The conductive paste is applied on a glass substrate and then baked to form a conductor film. A glass circuit structure formed by using the conductor film can be advantageously used as a defogging glass for an automobile window.
摘要翻译：提供一种能够调节电阻率并形成与玻璃基板结合强度高的金属端子的高粘合强度的导电膜的导电糊。导电性糊剂含有导电性成分，含有Bi2O3-B2O3-SiO2-Al2O3或Bi2O3-B2O3-SiO2-Al2P3-ZnO初级成分和约0.5〜5％（重量）NiO作为次要成分的组合物的玻璃料，和有机车辆。将导电糊涂布在玻璃基板上，然后烘烤以形成导体膜。通过使用导体膜形成的玻璃电路结构可以有利地用作汽车窗的防雾玻璃。

6. 发明申请

US20040214012A1 Heat treatable coated article with niobium zirconium inclusive IR reflecting layer and method of making same 有权
标题翻译：含有铌锆的红外线反射层的可热处理涂层制品及其制造方法
公开(公告)号：US20040214012A1
公开(公告)日：2004-10-28
申请号：US10423058
申请日：2003-04-25
发明人： Grzegorz Stachowiak
IPC分类号： B32B015/00 , B32B017/06 , B32B009/00
CPC分类号： C03C17/3618 , C03C17/3435 , C03C17/36 , C03C17/3626 , C03C17/3649 , C03C17/366 , C03C17/3681
摘要： A coated article is provided so as to include a solar control coating having an infrared (IR) reflecting layer sandwiched between at least a pair of dielectric layers. The IR reflecting layer includes NbZr and/or NbZrNx in certain embodiments of this invention. The use of such materials as an IR reflecting layer(s) enables the coated article to have good corrosion resistance to alkaline solutions, good mechanical performance such as scratch resistance, and/or good color stability (i.e., a low nullE* value(s)) upon heat treatment (HT). The coated article may or may not be heat treated in different embodiments of the invention.
摘要翻译：提供一种涂覆制品，以便包括具有夹在至少一对电介质层之间的红外线（IR）反射层的太阳能控制涂层。在本发明的某些实施方案中，IR反射层包括NbZr和/或NbZrNx。使用这样的材料作为IR反射层使得涂覆制品对碱性溶液具有良好的耐腐蚀性，良好的机械性能如耐刮擦性和/或良好的颜色稳定性（即，低ΔE*值（s ））热处理（HT）。在本发明的不同实施例中，涂覆制品可以或可以不进行热处理。

7. 发明申请

US20040191530A1 Sputtering target and transparent conductive film 有权
标题翻译：溅射靶和透明导电膜
公开(公告)号：US20040191530A1
公开(公告)日：2004-09-30
申请号：US10483614
申请日：2004-01-14
发明人： Kazuyoshi Inoue , Shigeo Matsuzaki
IPC分类号： B32B015/00
CPC分类号： C23C14/3414 , C04B35/453 , C04B2235/3229 , C04B2235/3232 , C04B2235/3239 , C04B2235/3244 , C04B2235/3251 , C04B2235/3284 , C04B2235/3286 , C04B2235/3289 , C04B2235/3293 , C04B2235/3294 , C04B2235/3296 , C04B2235/5436 , C04B2235/5445 , C04B2235/604 , C04B2235/658 , C04B2235/77 , C04B2235/96 , Y10S428/922
摘要： A sputtering target containing a hexagonal laminar compound formed of indium oxide and zinc oxide and represented by In2O3(ZnO)m wherein m is an integer of 2 to 7 and further contains 0.01 to 1 at % of an oxide of a third element having a normal valence of 4 or more, and a transparent electrically conductive film formed therefrom. The sputtering target has a low volume resistivity and permits stable sputtering. The transparent electrically conductive film is excellent in etchability.
摘要翻译：包含由氧化铟和氧化锌形成并由In2O3（ZnO）m表示的六方晶片状化合物的溅射靶，其中m为2〜7的整数，并且还含有0.01〜1原子％的具有正常的第三元素的氧化物 4价以上的透明导电性膜。溅射靶具有低体积电阻率并且允许稳定的溅射。透明导电膜的蚀刻性优异。

8. 发明申请

US20040191490A1 Circuit board, process for producing the same and a power module employing the same 有权
标题翻译：电路板，其制造方法和使用该电路板的功率模块
公开(公告)号：US20040191490A1
公开(公告)日：2004-09-30
申请号：US10768857
申请日：2004-01-29
发明人： Masahiro Hara , Hideyo Osanai
IPC分类号： B32B015/00 , B32B003/00
CPC分类号： H05K3/043 , H05K1/0306 , H05K3/061 , H05K2201/09845 , H05K2203/0369 , H05K2203/1476 , Y10T29/49156 , Y10T428/24917
摘要： Composite member 2 consisting of ceramic insulator substrate 3 and two metal layers 4A and 4B such as aluminum sheets is subjected to milling in order to remove the unwanted areas of metal layer 4A (where inter-element spacings are to be formed). In order to suppress cracking due to substrate warpage, a small bottom portion of 4A is left intact as residual metal layer 4Aa which is preferably removed by etching. Milling is performed after thin-film layer of etching resist 5 is applied to the surface of metal layer 4A. By milling in two stages, a step is formed at the bottom of lateral sides of a pattern element to make a skirt which contributes to reducing external stresses.
摘要翻译：将由陶瓷绝缘体基板3和诸如铝板的两个金属层4A和4B组成的复合构件2进行研磨以去除金属层4A（其中形成元件间间隔）的不需要的区域。为了抑制由于基板翘曲引起的开裂，4A的小底部作为残留金属层4Aa保持不变，优选通过蚀刻除去。在将金属层4A的表面上施加抗蚀剂5的薄膜层之后进行研磨。通过两步铣削，在图案元件的侧面的底部形成台阶以制成有助于减小外部应力的裙部。

9. 发明申请

US20040182277A1 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same 失效
公开(公告)号：US20040182277A1
公开(公告)日：2004-09-23
申请号：US10765046
申请日：2004-01-28
发明人： Hiroaki Inoue , Kenji Nakamura , Moriji Matsumoto , Hirokazu Ezawa , Masahiro Miyata , Manabu Tsujimura
IPC分类号： C23C018/34 , B05D005/12 , B32B015/00
CPC分类号： C23C18/50 , C23C18/34 , Y10T428/12576 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/265
摘要： There is provided an electroless NinullB plating liquid for forming, a NinullB alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless NinullB plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4null). The electroless NinullB plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a NinullB alloy film having an FCC crystalline structure.

10. 发明申请

US20040170860A1 Method of producing metal composite materials comprising incompatible metals 审中-公开
标题翻译：制造包含不相容金属的金属复合材料的方法
公开(公告)号：US20040170860A1
公开(公告)日：2004-09-02
申请号：US10778084
申请日：2004-02-17
发明人： Roy Hardwick , Harry Sildva
IPC分类号： B32B015/00
CPC分类号： C22C14/00 , B23K20/04 , B23K35/004 , B23K35/005 , B23K2103/16 , B23K2103/172 , B23K2103/24 , B32B15/013 , Y10T428/12806 , Y10T428/12819 , Y10T428/12972
摘要： A method of making a multi-layered composite material having a layer of a first metal and a layer of a second incompatible metal, separate from the first metal, the method involving hot rolling a multi-layered assembly of the first metal; the second metal; and a composite interlayer between the first metal and the second metal; wherein the composite interlayer having a first outer layer of a first composite metal compatible with the first metal; a second outer layer of a second composite metal compatible with the second metal; and an interlayer metal bonded between the first composite metal and the second composite metal; and wherein the first metal is adjacent the first composite metal and the second metal is adjacent the second composite metal; to effect production of the multi-layered composite material. The invention is valuable for producing a bonded composite of a hardened steel, such as an armour steel, with GA14V titanium.
摘要翻译：一种制造多层复合材料的方法，所述多层复合材料具有与所述第一金属分离的第一金属层和第二不相容金属层，所述方法涉及热轧所述第一金属的多层组件; 第二金属; 以及所述第一金属和所述第二金属之间的复合中间层; 其中所述复合中间层具有与所述第一金属相容的第一复合金属的第一外层; 与第二金属相容的第二复合金属的第二外层; 以及粘结在所述第一复合金属和所述第二复合金属之间的夹层金属; 并且其中所述第一金属与所述第一复合金属相邻，并且所述第二金属与所述第二复合金属相邻; 以实现多层复合材料的生产。本发明对于生产诸如铠装钢的硬化钢与GA14V钛的粘合复合材料是有价值的。

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